DE60144396D1 - Chemisch/mechanischer polierbelag mit löchern und/oder rillen - Google Patents

Chemisch/mechanischer polierbelag mit löchern und/oder rillen

Info

Publication number
DE60144396D1
DE60144396D1 DE60144396T DE60144396T DE60144396D1 DE 60144396 D1 DE60144396 D1 DE 60144396D1 DE 60144396 T DE60144396 T DE 60144396T DE 60144396 T DE60144396 T DE 60144396T DE 60144396 D1 DE60144396 D1 DE 60144396D1
Authority
DE
Germany
Prior art keywords
rills
chemical
holes
mechanical polishing
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60144396T
Other languages
English (en)
Inventor
In-Ha Park
Jae-Seok Kim
Tae-Kyoung Kwon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SKC Co Ltd
Original Assignee
SKC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SKC Co Ltd filed Critical SKC Co Ltd
Application granted granted Critical
Publication of DE60144396D1 publication Critical patent/DE60144396D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60144396T 2001-08-16 2001-08-29 Chemisch/mechanischer polierbelag mit löchern und/oder rillen Expired - Lifetime DE60144396D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020010049355A KR100646702B1 (ko) 2001-08-16 2001-08-16 홀 및/또는 그루브로 형성된 화학적 기계적 연마패드
PCT/KR2001/001465 WO2003017348A1 (en) 2001-08-16 2001-08-29 Chemical mechanical polishing pad having holes and/or grooves

Publications (1)

Publication Number Publication Date
DE60144396D1 true DE60144396D1 (de) 2011-05-19

Family

ID=19713251

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60144396T Expired - Lifetime DE60144396D1 (de) 2001-08-16 2001-08-29 Chemisch/mechanischer polierbelag mit löchern und/oder rillen

Country Status (8)

Country Link
US (1) US6875096B2 (de)
EP (1) EP1417703B1 (de)
JP (1) JP2005500174A (de)
KR (1) KR100646702B1 (de)
CN (1) CN1261983C (de)
DE (1) DE60144396D1 (de)
TW (1) TW590854B (de)
WO (1) WO2003017348A1 (de)

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EP1414996B1 (de) * 2001-07-10 2010-12-01 Johnson & Johnson Research Pty Limited Verfahren zur genetischen modifikation hämatopoetischer vorläuferzellen und verwendungen der modifizierten zellen
JP3843933B2 (ja) * 2002-02-07 2006-11-08 ソニー株式会社 研磨パッド、研磨装置および研磨方法
US6942549B2 (en) * 2003-10-29 2005-09-13 International Business Machines Corporation Two-sided chemical mechanical polishing pad for semiconductor processing
JP2005177897A (ja) * 2003-12-17 2005-07-07 Nec Electronics Corp 研磨方法および研磨装置と半導体装置製造方法
US6955587B2 (en) * 2004-01-30 2005-10-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Grooved polishing pad and method
US7329174B2 (en) * 2004-05-20 2008-02-12 Jsr Corporation Method of manufacturing chemical mechanical polishing pad
US6974372B1 (en) 2004-06-16 2005-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having grooves configured to promote mixing wakes during polishing
KR100568258B1 (ko) 2004-07-01 2006-04-07 삼성전자주식회사 화학적 기계적 연마용 연마 패드 및 이를 이용하는 화학적기계적 연마 장치
JP2007103602A (ja) * 2005-10-03 2007-04-19 Toshiba Corp 研磨パッド及び研磨装置
KR100752181B1 (ko) * 2005-10-05 2007-08-24 동부일렉트로닉스 주식회사 화학적 기계적 연마장치
CN1958236B (zh) * 2005-11-03 2010-08-11 上海华虹Nec电子有限公司 一种化学机械抛光中研磨垫沟槽加工方法
US20070128991A1 (en) * 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
US20070202780A1 (en) * 2006-02-24 2007-08-30 Chung-Ching Feng Polishing pad having a surface texture and method and apparatus for fabricating the same
US7985122B2 (en) 2006-06-13 2011-07-26 Freescale Semiconductor, Inc Method of polishing a layer using a polishing pad
TWI409868B (zh) * 2008-01-30 2013-09-21 Iv Technologies Co Ltd 研磨方法、研磨墊及研磨系統
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
CN102639299A (zh) * 2009-11-12 2012-08-15 3M创新有限公司 旋转抛光垫
JP5789634B2 (ja) * 2012-05-14 2015-10-07 株式会社荏原製作所 ワークピースを研磨するための研磨パッド並びに化学機械研磨装置、および該化学機械研磨装置を用いてワークピースを研磨する方法
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) * 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
KR102436416B1 (ko) 2014-10-17 2022-08-26 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US10269555B2 (en) * 2015-09-30 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Post-CMP cleaning and apparatus
CN113103145B (zh) 2015-10-30 2023-04-11 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10155297B2 (en) * 2016-07-08 2018-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing head
US20180281076A1 (en) * 2017-03-31 2018-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Gelling reduction tool for grooving chemical mechanical planarization polishing pads
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP7113626B2 (ja) * 2018-01-12 2022-08-05 ニッタ・デュポン株式会社 研磨パッド
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
KR102113003B1 (ko) * 2018-11-29 2020-05-20 한국생산기술연구원 웨이퍼용 화학기계연마 장치의 패드부
TWI833018B (zh) * 2019-05-07 2024-02-21 美商Ｃｍｃ材料有限責任公司 經基於槽生產之化學機械平坦化墊
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
CN114425743A (zh) * 2020-10-28 2022-05-03 中国科学院微电子研究所 一种抛光垫及化学机械抛光设备
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5020283A (en) * 1990-01-22 1991-06-04 Micron Technology, Inc. Polishing pad with uniform abrasion
US5329734A (en) * 1993-04-30 1994-07-19 Motorola, Inc. Polishing pads used to chemical-mechanical polish a semiconductor substrate
US6273806B1 (en) * 1997-05-15 2001-08-14 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
JPH11285962A (ja) * 1998-04-06 1999-10-19 Sony Corp 研磨パッド、研磨装置および研磨方法
JP2000084833A (ja) * 1998-09-11 2000-03-28 Okamoto Machine Tool Works Ltd 研磨盤および研磨パッドの取り換え方法
KR20000025003A (ko) * 1998-10-07 2000-05-06 윤종용 반도체 기판의 화학 기계적 연마에 사용되는 연마 패드
US6238271B1 (en) * 1999-04-30 2001-05-29 Speed Fam-Ipec Corp. Methods and apparatus for improved polishing of workpieces
US6261168B1 (en) * 1999-05-21 2001-07-17 Lam Research Corporation Chemical mechanical planarization or polishing pad with sections having varied groove patterns
JP2001071256A (ja) * 1999-08-31 2001-03-21 Shinozaki Seisakusho:Kk 研磨パッドの溝形成方法及び装置並びに研磨パッド
US6656019B1 (en) * 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
EP1412129A4 (de) * 2001-08-02 2008-04-02 Skc Co Ltd Verfahren zur herstellung eines chemisch-mechanischen polierkissens unter verwendung von laser

Also Published As

Publication number Publication date
KR20030015568A (ko) 2003-02-25
EP1417703B1 (de) 2011-04-06
EP1417703A4 (de) 2008-04-09
TW590854B (en) 2004-06-11
CN1543669A (zh) 2004-11-03
US20040058630A1 (en) 2004-03-25
KR100646702B1 (ko) 2006-11-17
JP2005500174A (ja) 2005-01-06
CN1261983C (zh) 2006-06-28
WO2003017348A1 (en) 2003-02-27
EP1417703A1 (de) 2004-05-12
US6875096B2 (en) 2005-04-05

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