DE60143722D1 - Verfahren zur Herstellung eines wärmeleitenden Substrats mit Leiterrahmen und thermisch leitender Platte - Google Patents

Verfahren zur Herstellung eines wärmeleitenden Substrats mit Leiterrahmen und thermisch leitender Platte

Info

Publication number
DE60143722D1
DE60143722D1 DE60143722T DE60143722T DE60143722D1 DE 60143722 D1 DE60143722 D1 DE 60143722D1 DE 60143722 T DE60143722 T DE 60143722T DE 60143722 T DE60143722 T DE 60143722T DE 60143722 D1 DE60143722 D1 DE 60143722D1
Authority
DE
Germany
Prior art keywords
thermally conductive
producing
lead frame
conductive substrate
conductive plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60143722T
Other languages
English (en)
Inventor
Yoshihisa Yamashita
Koichi Hirano
Seiichi Nakatani
Mitsuhiro Matsuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of DE60143722D1 publication Critical patent/DE60143722D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
DE60143722T 2000-06-01 2001-05-30 Verfahren zur Herstellung eines wärmeleitenden Substrats mit Leiterrahmen und thermisch leitender Platte Expired - Lifetime DE60143722D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000164225 2000-06-01

Publications (1)

Publication Number Publication Date
DE60143722D1 true DE60143722D1 (de) 2011-02-03

Family

ID=18667872

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60132397T Expired - Lifetime DE60132397T2 (de) 2000-06-01 2001-05-30 Verfahren zur Herstellung eines thermisch leitenden Substrats mit Leiterrahmen und Wärmestrahlungsplatte
DE60143722T Expired - Lifetime DE60143722D1 (de) 2000-06-01 2001-05-30 Verfahren zur Herstellung eines wärmeleitenden Substrats mit Leiterrahmen und thermisch leitender Platte

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60132397T Expired - Lifetime DE60132397T2 (de) 2000-06-01 2001-05-30 Verfahren zur Herstellung eines thermisch leitenden Substrats mit Leiterrahmen und Wärmestrahlungsplatte

Country Status (4)

Country Link
US (2) US6700182B2 (de)
EP (2) EP1895584B1 (de)
KR (1) KR100771060B1 (de)
DE (2) DE60132397T2 (de)

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US6838776B2 (en) 2003-04-18 2005-01-04 Freescale Semiconductor, Inc. Circuit device with at least partial packaging and method for forming
US6921975B2 (en) * 2003-04-18 2005-07-26 Freescale Semiconductor, Inc. Circuit device with at least partial packaging, exposed active surface and a voltage reference plane
JP4644008B2 (ja) * 2005-03-09 2011-03-02 三菱電機株式会社 半導体モジュール
EP1885907A4 (de) * 2005-05-26 2008-12-10 Nanocomp Technologies Inc Systeme und verfahren zum wärmemanagement elektronischer bauteile
EP1926846A4 (de) 2005-07-28 2010-12-15 Nanocomp Technologies Inc Systeme und verfahren zur formung und gewinnung von nanofasermaterialien
US9061913B2 (en) 2007-06-15 2015-06-23 Nanocomp Technologies, Inc. Injector apparatus and methods for production of nanostructures
JP2010534772A (ja) 2007-07-09 2010-11-11 ナノコンプ テクノロジーズ インコーポレイテッド 化学的に促進された延伸性構造体内のナノチューブの整列
US8057777B2 (en) 2007-07-25 2011-11-15 Nanocomp Technologies, Inc. Systems and methods for controlling chirality of nanotubes
AU2008283846A1 (en) 2007-08-07 2009-02-12 Nanocomp Technologies, Inc. Electrically and thermally non-metallic conductive nanostructure-based adapters
EP2279522B1 (de) 2008-05-07 2017-01-25 Nanocomp Technologies, Inc. Heizvorrichtungen auf nanostrukturbasis und verwendungsverfahren
EP2279512B1 (de) 2008-05-07 2019-10-23 Nanocomp Technologies, Inc. Koaxiale stromkabel und kabelbaum auf kohlenstoffnanoröhrchenbasis
US8354593B2 (en) 2009-07-10 2013-01-15 Nanocomp Technologies, Inc. Hybrid conductors and method of making same
US8722171B2 (en) 2011-01-04 2014-05-13 Nanocomp Technologies, Inc. Nanotube-based insulators
US20140208689A1 (en) 2013-01-25 2014-07-31 Renee Joyal Hypodermic syringe assist apparatus and method
WO2014115064A1 (en) * 2013-01-25 2014-07-31 Koninklijke Philips N.V. Lighting assembly and method for manufacturing a lighting assembly
US9824958B2 (en) * 2013-03-05 2017-11-21 Infineon Technologies Austria Ag Chip carrier structure, chip package and method of manufacturing the same
EP3010853B1 (de) 2013-06-17 2023-02-22 Nanocomp Technologies, Inc. Exfolierende dispergiermittel für nanoröhrchen, bündel und fasern
DE102014114520B4 (de) * 2014-10-07 2020-03-05 Infineon Technologies Austria Ag Ein elektronisches Modul mit mehreren Einkapselungsschichten und ein Verfahren zu dessen Herstellung
US11434581B2 (en) 2015-02-03 2022-09-06 Nanocomp Technologies, Inc. Carbon nanotube structures and methods for production thereof
CN205105500U (zh) * 2015-08-06 2016-03-23 台达电子企业管理（上海）有限公司 散热器与电源模块
CN106571354B (zh) * 2015-10-09 2018-11-16 台达电子工业股份有限公司 电源变换器及其制造方法
US10581082B2 (en) 2016-11-15 2020-03-03 Nanocomp Technologies, Inc. Systems and methods for making structures defined by CNT pulp networks
US11279836B2 (en) 2017-01-09 2022-03-22 Nanocomp Technologies, Inc. Intumescent nanostructured materials and methods of manufacturing same
JP6879834B2 (ja) * 2017-06-21 2021-06-02 日本発條株式会社 回路基板およびその製造方法
JP2019062021A (ja) * 2017-09-25 2019-04-18 株式会社東芝 半導体モジュールおよびその製造方法
US20210175155A1 (en) * 2019-12-06 2021-06-10 Alpha And Omega Semiconductor (Cayman) Ltd. Power module having interconnected base plate with molded metal and method of making the same
EP4036966A1 (de) 2021-02-02 2022-08-03 Hitachi Energy Switzerland AG Metallsubstratstruktur und verfahren zur herstellung einer metallsubstratstruktur für ein halbleiterleistungsmodul sowie halbleiterleistungsmodul
EP4068348B1 (de) * 2021-03-31 2023-11-29 Hitachi Energy Ltd Metallsubstratstruktur und verfahren zur herstellung einer metallsubstratstruktur für ein halbleiterleistungsmodul sowie halbleitermodul

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JPS6151947A (ja) * 1984-08-22 1986-03-14 Mitsubishi Electric Corp 半導体装置
US5122439A (en) * 1989-08-28 1992-06-16 International Business Machines Corp. Forming a pattern on a substrate
DE9114268U1 (de) 1991-11-15 1992-01-09 Siemens Ag, 8000 Muenchen, De
JPH0863119A (ja) 1994-08-01 1996-03-08 Motorola Inc 単色ｌｅｄを用いた全色画像表示装置
JPH09102667A (ja) * 1995-10-03 1997-04-15 Japan Aviation Electron Ind Ltd 配線基板の製造方法及び配線基板
JP3516789B2 (ja) * 1995-11-15 2004-04-05 三菱電機株式会社 半導体パワーモジュール
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JPH11233712A (ja) * 1998-02-12 1999-08-27 Hitachi Ltd 半導体装置及びその製法とそれを使った電気機器
JP4126751B2 (ja) 1998-05-26 2008-07-30 ソニー株式会社 表示装置および照明装置

Also Published As

Publication number Publication date
US7033865B2 (en) 2006-04-25
US20020020897A1 (en) 2002-02-21
EP1160861A3 (de) 2004-03-03
US20040207053A1 (en) 2004-10-21
EP1895584A1 (de) 2008-03-05
EP1895584B1 (de) 2010-12-22
KR20010109496A (ko) 2001-12-10
DE60132397D1 (de) 2008-03-06
EP1160861A2 (de) 2001-12-05
KR100771060B1 (ko) 2007-10-30
US6700182B2 (en) 2004-03-02
DE60132397T2 (de) 2009-01-22
EP1160861B1 (de) 2008-01-16

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