DE60140319D1 - Filtereinrichtung und verfahren zur herstellung einer filtereinrichtung - Google Patents

Filtereinrichtung und verfahren zur herstellung einer filtereinrichtung

Info

Publication number
DE60140319D1
DE60140319D1 DE60140319T DE60140319T DE60140319D1 DE 60140319 D1 DE60140319 D1 DE 60140319D1 DE 60140319 T DE60140319 T DE 60140319T DE 60140319 T DE60140319 T DE 60140319T DE 60140319 D1 DE60140319 D1 DE 60140319D1
Authority
DE
Germany
Prior art keywords
filter device
producing
filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60140319T
Other languages
German (de)
English (en)
Inventor
Robert Aigner
Pasi Tikka
Juha Ella
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Nokia Inc
Original Assignee
Avago Technologies Wireless IP Singapore Pte Ltd
Nokia Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies Wireless IP Singapore Pte Ltd, Nokia Inc filed Critical Avago Technologies Wireless IP Singapore Pte Ltd
Application granted granted Critical
Publication of DE60140319D1 publication Critical patent/DE60140319D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/175—Acoustic mirrors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02047—Treatment of substrates
    • H03H9/02055—Treatment of substrates of the surface including the back surface
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H03H9/0211—Means for compensation or elimination of undesirable effects of reflections
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/58—Multiple crystal filters
    • H03H9/582—Multiple crystal filters implemented with thin-film techniques
    • H03H9/583—Multiple crystal filters implemented with thin-film techniques comprising a plurality of piezoelectric layers acoustically coupled
    • H03H9/585—Stacked Crystal Filters [SCF]
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/58—Multiple crystal filters
    • H03H9/582—Multiple crystal filters implemented with thin-film techniques
    • H03H9/586—Means for mounting to a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/589—Acoustic mirrors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
DE60140319T 2001-11-06 2001-11-06 Filtereinrichtung und verfahren zur herstellung einer filtereinrichtung Expired - Lifetime DE60140319D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2001/012826 WO2003041273A1 (en) 2001-11-06 2001-11-06 Filter device and method of fabricating a filter device

Publications (1)

Publication Number Publication Date
DE60140319D1 true DE60140319D1 (de) 2009-12-10

Family

ID=8164665

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60140319T Expired - Lifetime DE60140319D1 (de) 2001-11-06 2001-11-06 Filtereinrichtung und verfahren zur herstellung einer filtereinrichtung

Country Status (5)

Country Link
US (1) US6943647B2 (enExample)
EP (1) EP1454412B1 (enExample)
JP (1) JP3987036B2 (enExample)
DE (1) DE60140319D1 (enExample)
WO (1) WO2003041273A1 (enExample)

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EP1540819A1 (en) * 2002-09-12 2005-06-15 Philips Intellectual Property & Standards GmbH Bulk acoustic waver resonator with means for suppression of pass-band ripple in bulk acoustic wave filters
JP4024741B2 (ja) 2003-10-20 2007-12-19 富士通メディアデバイス株式会社 圧電薄膜共振子及びフィルタ
US7332985B2 (en) * 2003-10-30 2008-02-19 Avago Technologies Wireless Ip (Singapore) Pte Ltd. Cavity-less film bulk acoustic resonator (FBAR) devices
JP2005260484A (ja) * 2004-03-10 2005-09-22 Tdk Corp 圧電共振器およびそれを備えた電子部品
JP2005277454A (ja) * 2004-03-22 2005-10-06 Tdk Corp 圧電共振器およびそれを備えた電子部品
US8981876B2 (en) 2004-11-15 2015-03-17 Avago Technologies General Ip (Singapore) Pte. Ltd. Piezoelectric resonator structures and electrical filters having frame elements
US7791434B2 (en) * 2004-12-22 2010-09-07 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic resonator performance enhancement using selective metal etch and having a trench in the piezoelectric
US7598827B2 (en) 2006-06-19 2009-10-06 Maxim Integrated Products Harmonic termination of power amplifiers using BAW filter output matching circuits
US7586389B2 (en) * 2006-06-19 2009-09-08 Maxim Integrated Products, Inc. Impedance transformation and filter using bulk acoustic wave technology
US7706213B2 (en) * 2006-10-23 2010-04-27 Nancy Ann Winfree Mechanical filter for sensors
US20090053401A1 (en) * 2007-08-24 2009-02-26 Maxim Integrated Products, Inc. Piezoelectric deposition for BAW resonators
US8512800B2 (en) * 2007-12-04 2013-08-20 Triquint Semiconductor, Inc. Optimal acoustic impedance materials for polished substrate coating to suppress passband ripple in BAW resonators and filters
DE102008003820B4 (de) * 2008-01-10 2013-01-17 Epcos Ag Frontendschaltung
US7768364B2 (en) * 2008-06-09 2010-08-03 Maxim Integrated Products, Inc. Bulk acoustic resonators with multi-layer electrodes
US8030823B2 (en) * 2009-01-26 2011-10-04 Resonance Semiconductor Corporation Protected resonator
US9735338B2 (en) 2009-01-26 2017-08-15 Cymatics Laboratories Corp. Protected resonator
US8248185B2 (en) 2009-06-24 2012-08-21 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic resonator structure comprising a bridge
US8902023B2 (en) 2009-06-24 2014-12-02 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator structure having an electrode with a cantilevered portion
JP5617523B2 (ja) * 2009-12-08 2014-11-05 株式会社村田製作所 積層型圧電薄膜フィルタの製造方法
US9243316B2 (en) 2010-01-22 2016-01-26 Avago Technologies General Ip (Singapore) Pte. Ltd. Method of fabricating piezoelectric material with selected c-axis orientation
US8796904B2 (en) 2011-10-31 2014-08-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Bulk acoustic resonator comprising piezoelectric layer and inverse piezoelectric layer
DE102010033867A1 (de) 2010-08-10 2012-02-16 Epcos Ag Filteranordnung, Duplexer sowie Verfahren zur Herstellung einer Filteranordnung
US8962443B2 (en) 2011-01-31 2015-02-24 Avago Technologies General Ip (Singapore) Pte. Ltd. Semiconductor device having an airbridge and method of fabricating the same
US9136818B2 (en) 2011-02-28 2015-09-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Stacked acoustic resonator comprising a bridge
US9203374B2 (en) 2011-02-28 2015-12-01 Avago Technologies General Ip (Singapore) Pte. Ltd. Film bulk acoustic resonator comprising a bridge
US9154112B2 (en) 2011-02-28 2015-10-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Coupled resonator filter comprising a bridge
US9048812B2 (en) 2011-02-28 2015-06-02 Avago Technologies General Ip (Singapore) Pte. Ltd. Bulk acoustic wave resonator comprising bridge formed within piezoelectric layer
US9425764B2 (en) 2012-10-25 2016-08-23 Avago Technologies General Ip (Singapore) Pte. Ltd. Accoustic resonator having composite electrodes with integrated lateral features
US9148117B2 (en) 2011-02-28 2015-09-29 Avago Technologies General Ip (Singapore) Pte. Ltd. Coupled resonator filter comprising a bridge and frame elements
US9083302B2 (en) 2011-02-28 2015-07-14 Avago Technologies General Ip (Singapore) Pte. Ltd. Stacked bulk acoustic resonator comprising a bridge and an acoustic reflector along a perimeter of the resonator
US9484882B2 (en) * 2013-02-14 2016-11-01 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator having temperature compensation
US8575820B2 (en) 2011-03-29 2013-11-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Stacked bulk acoustic resonator
US9444426B2 (en) 2012-10-25 2016-09-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Accoustic resonator having integrated lateral feature and temperature compensation feature
US8350445B1 (en) 2011-06-16 2013-01-08 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Bulk acoustic resonator comprising non-piezoelectric layer and bridge
US9473106B2 (en) * 2011-06-21 2016-10-18 Georgia Tech Research Corporation Thin-film bulk acoustic wave delay line
US8922302B2 (en) 2011-08-24 2014-12-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator formed on a pedestal
US9254997B2 (en) * 2013-08-29 2016-02-09 Taiwan Semiconductor Manufacturing Co., Ltd. CMOS-MEMS integrated flow for making a pressure sensitive transducer
US10090820B2 (en) 2015-07-31 2018-10-02 Qorvo Us, Inc. Stealth-dicing compatible devices and methods to prevent acoustic backside reflections on acoustic wave devices
JP2017046225A (ja) * 2015-08-27 2017-03-02 株式会社ディスコ Ｂａｗデバイス及びｂａｗデバイスの製造方法
JP6699927B2 (ja) * 2016-03-03 2020-05-27 株式会社ディスコ Ｂａｗデバイス及びｂａｗデバイスの製造方法
JP2020113954A (ja) 2019-01-16 2020-07-27 株式会社村田製作所 弾性波装置

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FR2261654B1 (enExample) * 1974-02-15 1978-01-06 Thomson Csf
CA1089544A (en) * 1976-11-09 1980-11-11 Sadao Takahashi Elastic surface wave device
JPS60126907A (ja) * 1983-12-12 1985-07-06 Nippon Telegr & Teleph Corp <Ntt> 単一応答複合圧電振動素子
JPH03165116A (ja) * 1989-11-22 1991-07-17 Clarion Co Ltd 弾性表面波装置
US5864261A (en) * 1994-05-23 1999-01-26 Iowa State University Research Foundation Multiple layer acoustical structures for thin-film resonator based circuits and systems
JPH0897675A (ja) * 1994-09-28 1996-04-12 Canon Inc 弾性表面波素子及びその作製方法及びそれを用いた通信装置
US5872493A (en) * 1997-03-13 1999-02-16 Nokia Mobile Phones, Ltd. Bulk acoustic wave (BAW) filter having a top portion that includes a protective acoustic mirror
US5903087A (en) * 1997-06-05 1999-05-11 Motorola Inc. Electrode edge wave patterns for piezoelectric resonator
JPH11284481A (ja) * 1998-03-30 1999-10-15 Murata Mfg Co Ltd 圧電薄膜振動子およびその製造方法
US6150703A (en) * 1998-06-29 2000-11-21 Trw Inc. Lateral mode suppression in semiconductor bulk acoustic resonator (SBAR) devices using tapered electrodes, and electrodes edge damping materials
DE19931297A1 (de) * 1999-07-07 2001-01-11 Philips Corp Intellectual Pty Volumenwellen-Filter
US6603241B1 (en) * 2000-05-23 2003-08-05 Agere Systems, Inc. Acoustic mirror materials for acoustic devices
KR100398365B1 (ko) * 2001-06-25 2003-09-19 삼성전기주식회사 폭방향 파동이 억제되는 박막 공진기
US6720844B1 (en) * 2001-11-16 2004-04-13 Tfr Technologies, Inc. Coupled resonator bulk acoustic wave filter
EP1540819A1 (en) * 2002-09-12 2005-06-15 Philips Intellectual Property & Standards GmbH Bulk acoustic waver resonator with means for suppression of pass-band ripple in bulk acoustic wave filters

Also Published As

Publication number Publication date
WO2003041273A1 (en) 2003-05-15
US6943647B2 (en) 2005-09-13
EP1454412B1 (en) 2009-10-28
EP1454412A1 (en) 2004-09-08
JP3987036B2 (ja) 2007-10-03
US20040227591A1 (en) 2004-11-18
JP2005509348A (ja) 2005-04-07

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Legal Events

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8364 No opposition during term of opposition