DE60139193D1 - Verfahren und vorrichtung zur messung der schmelzenhöhe - Google Patents

Verfahren und vorrichtung zur messung der schmelzenhöhe

Info

Publication number
DE60139193D1
DE60139193D1 DE60139193T DE60139193T DE60139193D1 DE 60139193 D1 DE60139193 D1 DE 60139193D1 DE 60139193 T DE60139193 T DE 60139193T DE 60139193 T DE60139193 T DE 60139193T DE 60139193 D1 DE60139193 D1 DE 60139193D1
Authority
DE
Germany
Prior art keywords
measuring
melt height
melt
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60139193T
Other languages
English (en)
Inventor
Masato Moriya
Tadayuki Hanamoto
Hiroshi Monden
Toshio Hayashida
Toshirou Kotooka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumco Techxiv Corp
Original Assignee
Sumco Techxiv Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumco Techxiv Corp filed Critical Sumco Techxiv Corp
Application granted granted Critical
Publication of DE60139193D1 publication Critical patent/DE60139193D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20Controlling or regulating
    • C30B15/22Stabilisation or shape controlling of the molten zone near the pulled crystal; Controlling the section of the crystal
    • C30B15/26Stabilisation or shape controlling of the molten zone near the pulled crystal; Controlling the section of the crystal using television detectors; using photo or X-ray detectors
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10Apparatus
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10Apparatus
    • Y10T117/1004Apparatus with means for measuring, testing, or sensing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Measurement Of Optical Distance (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
  • Measurement Of Levels Of Liquids Or Fluent Solid Materials (AREA)
DE60139193T 2000-05-01 2001-05-01 Verfahren und vorrichtung zur messung der schmelzenhöhe Expired - Lifetime DE60139193D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000132776 2000-05-01
PCT/JP2001/003761 WO2001083859A1 (fr) 2000-05-01 2001-05-01 Procede et appareil de mesure du niveau de bain de fusion

Publications (1)

Publication Number Publication Date
DE60139193D1 true DE60139193D1 (de) 2009-08-20

Family

ID=18641408

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60139193T Expired - Lifetime DE60139193D1 (de) 2000-05-01 2001-05-01 Verfahren und vorrichtung zur messung der schmelzenhöhe

Country Status (7)

Country Link
US (1) US6994748B2 (de)
EP (1) EP1279752B1 (de)
JP (1) JP4733900B2 (de)
KR (1) KR100720660B1 (de)
DE (1) DE60139193D1 (de)
TW (1) TW546423B (de)
WO (1) WO2001083859A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW546423B (en) 2000-05-01 2003-08-11 Komatsu Denshi Kinzoku Kk Method and apparatus for measuring melt level
JP2006045007A (ja) * 2004-08-05 2006-02-16 Komatsu Electronic Metals Co Ltd シリコン単結晶の品質評価方法
US7176405B2 (en) * 2005-04-22 2007-02-13 Ultratech, Inc. Heat shield for thermal processing
JP4734139B2 (ja) * 2006-02-27 2011-07-27 Sumco Techxiv株式会社 位置測定方法
JP4929817B2 (ja) * 2006-04-25 2012-05-09 信越半導体株式会社 基準反射体と融液面との距離の測定方法、及びこれを用いた融液面位置の制御方法、並びにシリコン単結晶の製造装置
JP4784401B2 (ja) 2006-05-30 2011-10-05 株式会社Sumco シリコン単結晶の育成プロセスにおける融液の液面位置監視装置
JP5194295B2 (ja) * 2007-08-24 2013-05-08 Sumco Techxiv株式会社 Cz法による単結晶引き上げ装置内の液面レベル測定方法
JP5181178B2 (ja) * 2007-09-12 2013-04-10 Sumco Techxiv株式会社 半導体単結晶製造装置における位置計測装置および位置計測方法
TWI396652B (zh) * 2008-05-23 2013-05-21 Century Display Shenxhen Co Liquid crystal residual warning system
US8221545B2 (en) * 2008-07-31 2012-07-17 Sumco Phoenix Corporation Procedure for in-situ determination of thermal gradients at the crystal growth front
JP5577873B2 (ja) 2010-06-16 2014-08-27 信越半導体株式会社 遮熱部材下端面と原料融液面との間の距離の測定方法、遮熱部材下端面と原料融液面との間の距離の制御方法、シリコン単結晶の製造方法
US9228878B2 (en) * 2012-03-19 2016-01-05 Advanced Energy Industries, Inc. Dual beam non-contact displacement sensor
DE102013002471B4 (de) 2013-02-13 2016-08-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur Bestimmung der Schmelzhöhe und zur Regulation der Erstarrung und Schmelzung einer Schmelze in einem Tiegel
CN104005083B (zh) * 2014-05-20 2016-06-29 北京工业大学 一种测量单晶炉熔硅液面高度的装置与方法
JP6812931B2 (ja) * 2017-09-06 2021-01-13 株式会社Sumco 液面レベル検出装置の調整用治具および調整方法
US11101582B2 (en) * 2018-11-19 2021-08-24 The Boeing Company Methods and apparatus for installing sleeve on cable using active dimensional analysis
JP7006636B2 (ja) * 2019-03-01 2022-01-24 株式会社Sumco シリコン単結晶製造装置
JP7272249B2 (ja) * 2019-12-02 2023-05-12 株式会社Sumco 単結晶育成方法および単結晶育成装置
US11692883B2 (en) 2020-10-28 2023-07-04 Advanced Energy Industries, Inc. Fiber optic temperature probe
CN112903060B (zh) * 2021-01-29 2024-07-12 西安奕斯伟材料科技股份有限公司 一种监测熔体液面位置的方法、系统及计算机存储介质
CN114606565B (zh) * 2022-01-27 2023-01-20 徐州鑫晶半导体科技有限公司 单晶生长装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4508970A (en) * 1982-07-15 1985-04-02 Motorola, Inc. Melt level sensing system and method
DE4123336A1 (de) * 1991-07-15 1993-01-21 Leybold Ag Kristallziehverfahren und vorrichtung zu seiner durchfuehrung
JP2627695B2 (ja) 1992-01-17 1997-07-09 コマツ電子金属株式会社 Cz法における融液レベル制御装置および制御方法
JP2627696B2 (ja) * 1992-01-17 1997-07-09 コマツ電子金属株式会社 Cz法における融液レベル制御装置および制御方法
JP2844032B2 (ja) 1992-02-26 1999-01-06 コマツ電子金属株式会社 Cz法における融液レベル制御装置
JP2816627B2 (ja) 1992-04-17 1998-10-27 コマツ電子金属株式会社 半導体単結晶製造装置の融液面位置測定・制御装置
DE4231162C2 (de) * 1992-09-17 1996-03-14 Wacker Siltronic Halbleitermat Verfahren zur Regelung der Schmelzenhöhe während des Ziehens von Einkristallen
JP2823035B2 (ja) 1993-02-10 1998-11-11 信越半導体株式会社 半導体単結晶の引上装置及び引上方法
JP3129571B2 (ja) 1993-04-28 2001-01-31 コマツ電子金属株式会社 Cz法における融液レベル制御装置
US6071340A (en) * 1996-02-28 2000-06-06 General Signal Technology Corporation Apparatus for melt-level detection in Czochralski crystal growth systems
JPH1171149A (ja) 1997-08-26 1999-03-16 Kuraray Co Ltd セメント用添加剤
US5882402A (en) * 1997-09-30 1999-03-16 Memc Electronic Materials, Inc. Method for controlling growth of a silicon crystal
JP4616949B2 (ja) * 1999-03-17 2011-01-19 Sumco Techxiv株式会社 メルトレベル検出装置及び検出方法
TW546423B (en) 2000-05-01 2003-08-11 Komatsu Denshi Kinzoku Kk Method and apparatus for measuring melt level

Also Published As

Publication number Publication date
JP4733900B2 (ja) 2011-07-27
KR20030001467A (ko) 2003-01-06
US6994748B2 (en) 2006-02-07
KR100720660B1 (ko) 2007-05-21
EP1279752A1 (de) 2003-01-29
EP1279752B1 (de) 2009-07-08
TW546423B (en) 2003-08-11
WO2001083859A1 (fr) 2001-11-08
US20030116729A1 (en) 2003-06-26
EP1279752A4 (de) 2007-05-30

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