DE60138199D1 - Flüssigkeitsabgabering und verfahren zur herstellung und zur anwendung desselben - Google Patents

Flüssigkeitsabgabering und verfahren zur herstellung und zur anwendung desselben

Info

Publication number
DE60138199D1
DE60138199D1 DE60138199T DE60138199T DE60138199D1 DE 60138199 D1 DE60138199 D1 DE 60138199D1 DE 60138199 T DE60138199 T DE 60138199T DE 60138199 T DE60138199 T DE 60138199T DE 60138199 D1 DE60138199 D1 DE 60138199D1
Authority
DE
Germany
Prior art keywords
preparation
liquid dispensing
dispensing
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60138199T
Other languages
English (en)
Inventor
Stephen M Smith
Randolph E Treur
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE60138199D1 publication Critical patent/DE60138199D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49428—Gas and water specific plumbing component making
    • Y10T29/49432—Nozzle making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49428—Gas and water specific plumbing component making
    • Y10T29/49432—Nozzle making
    • Y10T29/49433—Sprayer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE60138199T 2000-09-27 2001-09-12 Flüssigkeitsabgabering und verfahren zur herstellung und zur anwendung desselben Expired - Lifetime DE60138199D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/672,173 US6481447B1 (en) 2000-09-27 2000-09-27 Fluid delivery ring and methods for making and implementing the same
PCT/US2001/028996 WO2002027767A2 (en) 2000-09-27 2001-09-12 Fluid delivery ring and methods for making and implementing the same

Publications (1)

Publication Number Publication Date
DE60138199D1 true DE60138199D1 (de) 2009-05-14

Family

ID=24697439

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60138199T Expired - Lifetime DE60138199D1 (de) 2000-09-27 2001-09-12 Flüssigkeitsabgabering und verfahren zur herstellung und zur anwendung desselben

Country Status (9)

Country Link
US (3) US6481447B1 (de)
EP (1) EP1320871B1 (de)
JP (1) JP4559702B2 (de)
KR (1) KR100766757B1 (de)
CN (1) CN1225770C (de)
AU (1) AU2001289121A1 (de)
DE (1) DE60138199D1 (de)
TW (1) TW520523B (de)
WO (1) WO2002027767A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100481309B1 (ko) * 2002-06-27 2005-04-07 삼성전자주식회사 반도체 기판의 건조장비
US7383843B2 (en) * 2002-09-30 2008-06-10 Lam Research Corporation Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
KR20060068453A (ko) * 2004-12-16 2006-06-21 삼성전자주식회사 반도체 소자 제조 장치 및 방법
JP5180661B2 (ja) * 2008-04-18 2013-04-10 株式会社ディスコ スピンナ洗浄装置および加工装置
CN103084349A (zh) * 2011-11-03 2013-05-08 无锡华润上华科技有限公司 晶片清洗方法
JP5871582B2 (ja) * 2011-11-22 2016-03-01 株式会社ディスコ エッチング装置
JP2015062956A (ja) * 2012-09-19 2015-04-09 株式会社荏原製作所 研磨装置
CN105470177B (zh) * 2016-01-05 2018-09-07 清华大学 晶圆清洗干燥装置
CN111146122B (zh) * 2019-12-26 2022-10-28 厦门通富微电子有限公司 一种液体收集装置、显影/刻蚀机台和显影/刻蚀方法

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JPS59142839A (ja) * 1983-02-01 1984-08-16 Canon Inc 気相法装置のクリ−ニング方法
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JPS61296724A (ja) * 1985-06-26 1986-12-27 Hitachi Ltd 高圧ジエツトスクラバ洗浄装置
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US5614055A (en) * 1993-08-27 1997-03-25 Applied Materials, Inc. High density plasma CVD and etching reactor
TW273067B (de) * 1993-10-04 1996-03-21 Tokyo Electron Co Ltd
US5312047A (en) * 1993-11-09 1994-05-17 Akers Louis A Lawn mower washer ring
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JP3699142B2 (ja) * 1994-09-30 2005-09-28 アネルバ株式会社 薄膜形成装置
AU5172196A (en) * 1995-02-27 1996-09-18 Randy J. Cooper Lawn and garden sprinkler with bendable tubes
KR100210965B1 (ko) * 1995-06-19 1999-07-15 이시다 아키라 기판처리용 유체공급방법 및 장치
JPH0917764A (ja) * 1995-06-28 1997-01-17 Sigma Merutetsuku Kk 薬液処理装置
TW283250B (en) * 1995-07-10 1996-08-11 Watkins Johnson Co Plasma enhanced chemical processing reactor and method
JPH0936080A (ja) * 1995-07-13 1997-02-07 Toray Eng Co Ltd 加工済シリコンインゴットの洗浄方法
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JP2000514136A (ja) * 1996-06-28 2000-10-24 ラム リサーチ コーポレイション 高密度プラズマ化学蒸着装置および方法
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Also Published As

Publication number Publication date
CN1466772A (zh) 2004-01-07
JP2004510348A (ja) 2004-04-02
AU2001289121A1 (en) 2002-04-08
WO2002027767A2 (en) 2002-04-04
EP1320871A2 (de) 2003-06-25
US7494550B2 (en) 2009-02-24
US7040017B2 (en) 2006-05-09
WO2002027767A3 (en) 2003-01-30
JP4559702B2 (ja) 2010-10-13
KR100766757B1 (ko) 2007-10-17
EP1320871B1 (de) 2009-04-01
CN1225770C (zh) 2005-11-02
TW520523B (en) 2003-02-11
KR20030030038A (ko) 2003-04-16
US6481447B1 (en) 2002-11-19
US20060070639A1 (en) 2006-04-06
US20030015224A1 (en) 2003-01-23

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