AU2001289121A1 - Fluid delivery ring and methods for making and implementing the same - Google Patents

Fluid delivery ring and methods for making and implementing the same

Info

Publication number
AU2001289121A1
AU2001289121A1 AU2001289121A AU8912101A AU2001289121A1 AU 2001289121 A1 AU2001289121 A1 AU 2001289121A1 AU 2001289121 A AU2001289121 A AU 2001289121A AU 8912101 A AU8912101 A AU 8912101A AU 2001289121 A1 AU2001289121 A1 AU 2001289121A1
Authority
AU
Australia
Prior art keywords
implementing
making
methods
same
fluid delivery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001289121A
Inventor
Stephen M. Smith
Randolph E. Treur
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2001289121A1 publication Critical patent/AU2001289121A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49428—Gas and water specific plumbing component making
    • Y10T29/49432—Nozzle making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49428—Gas and water specific plumbing component making
    • Y10T29/49432—Nozzle making
    • Y10T29/49433—Sprayer
AU2001289121A 2000-09-27 2001-09-12 Fluid delivery ring and methods for making and implementing the same Abandoned AU2001289121A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/672,173 US6481447B1 (en) 2000-09-27 2000-09-27 Fluid delivery ring and methods for making and implementing the same
US09/672,173 2000-09-27
PCT/US2001/028996 WO2002027767A2 (en) 2000-09-27 2001-09-12 Fluid delivery ring and methods for making and implementing the same

Publications (1)

Publication Number Publication Date
AU2001289121A1 true AU2001289121A1 (en) 2002-04-08

Family

ID=24697439

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001289121A Abandoned AU2001289121A1 (en) 2000-09-27 2001-09-12 Fluid delivery ring and methods for making and implementing the same

Country Status (9)

Country Link
US (3) US6481447B1 (en)
EP (1) EP1320871B1 (en)
JP (1) JP4559702B2 (en)
KR (1) KR100766757B1 (en)
CN (1) CN1225770C (en)
AU (1) AU2001289121A1 (en)
DE (1) DE60138199D1 (en)
TW (1) TW520523B (en)
WO (1) WO2002027767A2 (en)

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KR100481309B1 (en) * 2002-06-27 2005-04-07 삼성전자주식회사 Apparatus for drying semiconductor substrate
US7383843B2 (en) * 2002-09-30 2008-06-10 Lam Research Corporation Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
KR20060068453A (en) * 2004-12-16 2006-06-21 삼성전자주식회사 Apparatus and method for manufacturing semiconductor devices
JP5180661B2 (en) * 2008-04-18 2013-04-10 株式会社ディスコ Spinner cleaning device and processing device
CN103084349A (en) * 2011-11-03 2013-05-08 无锡华润上华科技有限公司 Wafer cleaning method
JP5871582B2 (en) * 2011-11-22 2016-03-01 株式会社ディスコ Etching device
JP2015062956A (en) * 2012-09-19 2015-04-09 株式会社荏原製作所 Polishing device
CN105470177B (en) * 2016-01-05 2018-09-07 清华大学 Wafer cleaning drying device
CN111146122B (en) * 2019-12-26 2022-10-28 厦门通富微电子有限公司 Liquid collection device, developing/etching machine table and developing/etching method

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Also Published As

Publication number Publication date
JP2004510348A (en) 2004-04-02
US7494550B2 (en) 2009-02-24
CN1466772A (en) 2004-01-07
TW520523B (en) 2003-02-11
KR20030030038A (en) 2003-04-16
KR100766757B1 (en) 2007-10-17
US7040017B2 (en) 2006-05-09
US6481447B1 (en) 2002-11-19
EP1320871A2 (en) 2003-06-25
CN1225770C (en) 2005-11-02
EP1320871B1 (en) 2009-04-01
US20060070639A1 (en) 2006-04-06
US20030015224A1 (en) 2003-01-23
DE60138199D1 (en) 2009-05-14
WO2002027767A2 (en) 2002-04-04
WO2002027767A3 (en) 2003-01-30
JP4559702B2 (en) 2010-10-13

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