JPS61296724A - High-pressure jet scrubber washer - Google Patents

High-pressure jet scrubber washer

Info

Publication number
JPS61296724A
JPS61296724A JP13775485A JP13775485A JPS61296724A JP S61296724 A JPS61296724 A JP S61296724A JP 13775485 A JP13775485 A JP 13775485A JP 13775485 A JP13775485 A JP 13775485A JP S61296724 A JPS61296724 A JP S61296724A
Authority
JP
Japan
Prior art keywords
liquid
curtain
pressure jet
liquid curtain
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13775485A
Other languages
Japanese (ja)
Inventor
Ryuichi Funada
舟田 隆一
Teruo Moriyama
守山 照雄
Isao Watabiki
功 綿引
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13775485A priority Critical patent/JPS61296724A/en
Publication of JPS61296724A publication Critical patent/JPS61296724A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE:To make scattering fine particles absorbed by a conical liquid curtain or exhausted along the conical liquid curtain by forming the conical liquid curtain in a space comprehending the outside of an object to be washed to which washing solution is applied by a high-pressure jet nozzle and the neighborhood of the high-pressure jet nozzle. CONSTITUTION:Washing solution spouted out of a high-pressure jet nozzle 1 forms a liquid column 12 and is applied to a target 9 to be washed continuously or intermittently. At that time, fine particles of the solution drops 13 scatter around the target 9. Air flow near the inside of a conical liquid curtain 14 which is spouted out of spouting outlets 7 of an annular nozzle main body 4 flow downward and some of the liquid drops 13 are guided downward along the liquid curtain 14 by that air flow and the liquid drops 13 which collide with the liquid curtain 14 are mostly absorbed by the liquid curtain 14. Further, the liquid drops 13 recoiling from the liquid curtain 14 are also guided downward. Therefore, quantity of the liquid drops 13 which scatter from the above of the target 9 to the outside of the curtain and recontaminate the target 9 is substantially reduced.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は洗浄装置に係り、特に半導体部品、電子部品、
光学部品等精密部品の洗浄に好敵な高圧ジェットスクラ
バ装置に°関する。
[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a cleaning device, particularly for cleaning semiconductor parts, electronic parts,
Regarding high-pressure jet scrubber equipment that is suitable for cleaning precision parts such as optical parts.

〔発明の背景〕[Background of the invention]

従来、この種の高圧ジェットスクラバ装置としては、特
開昭56−67926号公報記載発明及び特開昭56−
125842号公報記載の発明が知られている。
Hitherto, this type of high-pressure jet scrubber device has been disclosed in the invention described in JP-A No. 56-67926 and the invention described in JP-A-56-67926.
The invention described in Japanese Patent No. 125842 is known.

特開昭56−67926号の発明は第3図に示すように
1回転チャック101に取付けられた加工物108に対
してノズル102を相対的に動かしながら回転中心から
ずれた位置に、ノズル102から流体110を射突させ
ると共に、射突後の流体110の拡がりが回転中心に向
う放射方向に大きく、反対方向に小さくなるようにノズ
ル102を傾斜させるもので、これにより回転中心に損
傷を与えず、加工物108の全面をもれなく洗浄しよう
とするものである。
The invention disclosed in Japanese Patent Application Laid-open No. 56-67926 is, as shown in FIG. In addition to projecting the fluid 110, the nozzle 102 is tilted so that the spread of the fluid 110 after the projecting is large in the radial direction toward the center of rotation and becomes small in the opposite direction, thereby preventing damage to the center of rotation. , the entire surface of the workpiece 108 is to be thoroughly cleaned.

また特開昭56−125842号の発明は第4図に示す
ように、回転するホルダ202に載置された試料203
に対する洗浄液噴射ノズル204の移動速度を、制御部
211を有する駆動装置210により試料203の回転
中心からの距離に反比例して変化させるように構成した
もので、これより洗浄不同、洗浄不足を解消しようとす
るものである。
Further, the invention of JP-A-56-125842 is as shown in FIG.
The moving speed of the cleaning liquid spray nozzle 204 relative to the sample 203 is changed in inverse proportion to the distance from the rotation center of the sample 203 by a drive device 210 having a control unit 211, thereby solving uneven cleaning and insufficient cleaning. That is.

しかし上記両発明において、高圧ジェットにより被洗浄
物に噴射された流体は、流体圧力及び噴射角度の影響に
より被洗浄物の衝突後、流体の一部は微細粒となって洗
浄雰囲気中に飛散し浮遊しており、洗浄を終った被洗浄
物の表面に再付着したり、作業雰囲気までも汚染すると
いう問題点があり、この問題点については解決がなされ
ていなかった。
However, in both of the above inventions, the fluid injected onto the object to be cleaned by a high-pressure jet is affected by the fluid pressure and spray angle, and after colliding with the object to be cleaned, some of the fluid becomes fine particles and is scattered into the cleaning atmosphere. There is a problem that the particles float in the air and re-adhere to the surface of the object to be cleaned after cleaning, or even contaminate the working atmosphere, and this problem has not been solved.

またシリコンウェファに、ホトレジスト膜を形成するた
めの回転塗布装置において、吐出塗布されるホトレジス
ト微細粒が再付着するのを防止するために被塗布物を覆
う外囲体を設けることが知られているが、高圧ジェット
洗浄の場合に適用した結果は十分な効果が得られなかっ
た。
It is also known that in a spin coating device for forming a photoresist film on a silicon wafer, an envelope is provided to cover the object to be coated in order to prevent fine particles of photoresist that are discharged and coated from adhering again. However, when applied to high-pressure jet cleaning, sufficient effects were not obtained.

〔発明の目的〕[Purpose of the invention]

本発明は上記問題点を解決するためになされたもので、
高圧ジェット洗浄によって発生する液体の微細粒の飛散
をおさえ、被洗浄物の再汚染と洗浄雰囲気の汚染を防止
する高圧ジェットスクラバ洗浄装置を提供することを目
的とする。
The present invention has been made to solve the above problems,
It is an object of the present invention to provide a high-pressure jet scrubber cleaning device that suppresses the scattering of fine liquid particles generated by high-pressure jet cleaning and prevents re-contamination of objects to be cleaned and contamination of the cleaning atmosphere.

〔発明の概要〕[Summary of the invention]

上記目的を達成するため、高圧ジェットノズルによって
噴射される被洗浄物の外側と、該高圧ジェットノズルの
周囲とを包括する空間に円錐状の流体カーテンを形成さ
せることにより、飛散する微細粒を上記流体カーテンに
吸収または流体カーテンに沿って排出されるように構成
した点に特徴を有する。
In order to achieve the above purpose, a conical fluid curtain is formed in a space encompassing the outside of the object to be cleaned that is sprayed by a high-pressure jet nozzle and the surroundings of the high-pressure jet nozzle, thereby removing the scattered fine particles. It is characterized in that it is configured to be absorbed into or discharged along the fluid curtain.

〔発明の実施例〕[Embodiments of the invention]

以下本発明の実施例について、第1〜2図にょて説明す
る。
Embodiments of the present invention will be described below with reference to FIGS. 1 and 2.

第1図において外囲体16a、16bの中心に。At the center of the outer enclosures 16a, 16b in FIG.

例えばシリコンウェファのような被洗浄物9が、シャフ
ト11によって回転される支持台1oに載置されており
、被洗浄物9の上方には、定方向に対し移動可能のよう
に設けた移動アーム2に固定した、給液チューブ3を具
有する高圧ジェットノズル1がある。また洗浄時におい
て被洗浄物9の上方へ移動するアー45があり、該アー
ム5は、給液チューブ8を具有するリング状ノズル本体
4を保持している。
An object 9 to be cleaned, such as a silicon wafer, is placed on a support stand 1o that is rotated by a shaft 11, and a moving arm is provided above the object 9 to be movable in a fixed direction. There is a high-pressure jet nozzle 1 with a liquid supply tube 3 fixed to 2 . There is also an arm 45 that moves above the object to be cleaned 9 during cleaning, and this arm 5 holds a ring-shaped nozzle body 4 having a liquid supply tube 8.

リング状ノズル本体4は、第2図に示すようにジャケッ
ト4aと吐出リング4bとの間にパツキン4cを挿入し
、ボルト4dで締付は液密を保つように構成されている
。またリング状ノズル本体4は、横断面のように中空部
6及び吐出ロアを形成するようになっている。
As shown in FIG. 2, the ring-shaped nozzle main body 4 is constructed such that a gasket 4c is inserted between a jacket 4a and a discharge ring 4b, and is tightened with a bolt 4d to maintain liquid tightness. Further, the ring-shaped nozzle main body 4 is configured to form a hollow portion 6 and a discharge lower portion in a cross section.

給液チューブ8を経て送り出される液体が吐出ロアから
噴出されることにより、円錐状の液体カーテン14が形
成されるようになされている。
A conical liquid curtain 14 is formed by ejecting the liquid sent through the liquid supply tube 8 from the discharge lower.

外囲体16bの下部は第1図に示すように、水はけのた
め網状乃至多孔状の受板18、はね返り防止板20を設
けることが望ましい。
As shown in FIG. 1, the lower part of the outer enclosure 16b is preferably provided with a net-like or porous receiving plate 18 and a splash prevention plate 20 for water drainage.

以上の構成において洗浄を行う際には、被洗浄物9の上
方において、高圧ジェットノズル1と同時若しくは多少
の時間差をおいてリング状ノズル本体4が規定位置に到
達し、高圧ジェットノズル1の噴射と同時若しくは多少
の時間差をおい゛てリング状ノズル本体4から液が噴出
し液体カーテンを形成する。
When cleaning is performed with the above configuration, the ring-shaped nozzle body 4 reaches a specified position above the object 9 to be cleaned, either at the same time as the high-pressure jet nozzle 1 or with a slight time lag, and the high-pressure jet nozzle 1 is activated. At the same time or with a slight time lag, liquid is ejected from the ring-shaped nozzle body 4 to form a liquid curtain.

高圧ジェットノズル1から噴射された洗浄液は液柱12
となり、被洗浄物9に対し連続的に或い□は断続的に噴
射を繰り返す。この時微細粒状になった液滴13が被洗
浄物9の周辺に飛散する。
The cleaning liquid injected from the high-pressure jet nozzle 1 is a liquid column 12.
The spraying is repeated continuously or intermittently on the object 9 to be cleaned. At this time, fine droplets 13 are scattered around the object 9 to be cleaned.

リング状ノズル本体4の吐出ロアから噴出する円錐状の
液体カーテン14の内側近くの空気の流れは、上方から
下方へと向い、この流れにより液滴13の一部は液体カ
ーテン14に沿って下方へ導かれ、液体カーテン14に
衝突した液滴13は液体カーテン14に殆ど吸収され、
さらにはね返る液滴13も下方へ導かれるから、被洗浄
物9の上方から液体カーテン14へ外へ飛散したり、被
洗浄物9を再汚染する液滴の量は激減する。
The flow of air near the inside of the conical liquid curtain 14 ejected from the discharge lower of the ring-shaped nozzle body 4 is directed from above to below, and due to this flow, some of the droplets 13 are directed downward along the liquid curtain 14. Most of the droplets 13 that are guided to the liquid curtain 14 and collide with the liquid curtain 14 are absorbed by the liquid curtain 14.
Furthermore, since the splashing droplets 13 are also guided downward, the amount of droplets that scatter outward from above the object 9 to be cleaned onto the liquid curtain 14 or re-contaminate the object 9 to be cleaned is drastically reduced.

以上通り本実施例は、高圧ジェットノズル1から噴射さ
れる液柱12が被洗浄物9に射突することにより発生す
る微細粒を、液体カーテン14により吸収又は下方誘導
することにより、洗浄域外へ飛散流出しないように構成
したものである。
As described above, in this embodiment, fine particles generated when the liquid column 12 jetted from the high-pressure jet nozzle 1 collides with the object 9 to be cleaned are absorbed or guided downward by the liquid curtain 14, thereby moving them out of the cleaning area. It is designed to prevent splashing and leakage.

液体カーテン14の態様は、吐出ロアの形状、大きさに
よって変化する。
The form of the liquid curtain 14 changes depending on the shape and size of the discharge lower.

すなわち、吐出リング4bの全周に連続的に吐出ロアを
設けた本実施例の他、断続的に吐出ロアを形成する場合
には、断続形の液体カーテンを形成し、また吐出リング
の全周に多数の小穴を設けた場合には、細粒流体による
シャワー状のカーテンを形成する。
That is, in addition to this embodiment in which the discharge lowers are continuously provided around the entire circumference of the discharge ring 4b, when the discharge lowers are formed intermittently, an intermittent liquid curtain is formed, and the discharge lowers are continuously provided around the entire circumference of the discharge ring 4b. When a large number of small holes are provided in the pores, a shower-like curtain of fine fluid particles is formed.

吐出ロアから噴出するものは液体のほか高圧気体であっ
てもよく、また流体カーテンは、高圧ジェットノズル1
の噴射域を囲にようして形成するものであればよく、実
施例のような円錐状のものに限定されない。
What is ejected from the discharge lower may be high-pressure gas in addition to liquid, and the fluid curtain is formed by the high-pressure jet nozzle 1.
It may be formed so as to surround the injection area, and is not limited to a conical shape as in the embodiment.

〔発明の効果〕〔Effect of the invention〕

上記の通り本発明の実施により、高圧ジェットスクラバ
装置において、高圧ジェットノズルから噴射される洗浄
液が被洗浄物に射突する際発生する微細粒を洗浄域外に
飛散させることなく、また被洗浄物に対する再付着を防
止して精密な洗浄を行うことが可能である。
As described above, by implementing the present invention, in a high-pressure jet scrubber device, the fine particles generated when the cleaning liquid jetted from the high-pressure jet nozzle hits the object to be cleaned are not scattered outside the cleaning area, and the It is possible to prevent redeposition and perform precise cleaning.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例を示す断面図、第2図は第1
図中主要部の傾斜図、第3図は従来のジェットスクラバ
装置の断面図、第4図は従来の別のジェットスクラバ装
置の略示図である。 1・・・高圧ジェットノズル、2・・・移動アーム、3
・・・給液チューブ、4・・・リング状ノズル本体、5
・・・アーム、6・・・中空部、7・・・吐出口、8・
・・給液チューブ、9・・・被洗浄物、10・・・支持
台、11・・・シャフト、  12・・・液体、13・
・・液滴、14・・・液体カーテン、16a、16b・
・・外囲体、18・・・受板、代理人 弁理士 小川勝
男゛、シフ 率1図 IQ     I+    20 佑′2図
FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG.
3 is a sectional view of a conventional jet scrubber device, and FIG. 4 is a schematic diagram of another conventional jet scrubber device. 1... High pressure jet nozzle, 2... Moving arm, 3
...Liquid supply tube, 4...Ring-shaped nozzle body, 5
...Arm, 6.Hollow part, 7.Discharge port, 8.
...Liquid supply tube, 9...Object to be cleaned, 10...Support stand, 11...Shaft, 12...Liquid, 13.
...Droplet, 14...Liquid curtain, 16a, 16b.
...Envelope, 18...Socket board, agent patent attorney Katsuo Ogawa, Schiff rate 1 figure IQ I+ 20 Yu'2 figure

Claims (1)

【特許請求の範囲】 1、高圧ジェットノズルによる噴射域の外側を囲によう
するように流体を落下させ流体カーテンを形成する装置
を設けたことを特徴とする高圧ジエットスクラバ装置。 2、上記流体カーテンは、連続的に囲によう形成されて
いる特許請求の範囲第1項記載の高圧ジエットスクラバ
装置。 3、上記流体カーテンは、断続的に囲によう形成されて
いる、特許請求の範囲第1記載の高圧ジエットスクラバ
装置。 4、上記流体カーテンは、細粒流体によって囲によう形
成されている特許請求の範囲第1項記載の高圧ジェット
スクラバ装置。
[Scope of Claims] 1. A high-pressure jet scrubber device comprising a device for forming a fluid curtain by causing fluid to fall around the outside of an injection area of a high-pressure jet nozzle. 2. The high-pressure jet scrubber device according to claim 1, wherein the fluid curtain is formed in a continuous surround. 3. The high-pressure jet scrubber device according to claim 1, wherein the fluid curtain is formed intermittently in a surrounding manner. 4. The high-pressure jet scrubber device according to claim 1, wherein the fluid curtain is surrounded by fine fluid particles.
JP13775485A 1985-06-26 1985-06-26 High-pressure jet scrubber washer Pending JPS61296724A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13775485A JPS61296724A (en) 1985-06-26 1985-06-26 High-pressure jet scrubber washer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13775485A JPS61296724A (en) 1985-06-26 1985-06-26 High-pressure jet scrubber washer

Publications (1)

Publication Number Publication Date
JPS61296724A true JPS61296724A (en) 1986-12-27

Family

ID=15206050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13775485A Pending JPS61296724A (en) 1985-06-26 1985-06-26 High-pressure jet scrubber washer

Country Status (1)

Country Link
JP (1) JPS61296724A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641664U (en) * 1992-11-12 1994-06-03 株式会社新屋製作所 Boots cleaning equipment
US5718763A (en) * 1994-04-04 1998-02-17 Tokyo Electron Limited Resist processing apparatus for a rectangular substrate
US5785068A (en) * 1995-05-11 1998-07-28 Dainippon Screen Mfg. Co., Ltd. Substrate spin cleaning apparatus
US6481447B1 (en) * 2000-09-27 2002-11-19 Lam Research Corporation Fluid delivery ring and methods for making and implementing the same
JP2007160183A (en) * 2005-12-12 2007-06-28 Yutaka Electronics Industry Co Ltd Washing machine
JP2014041916A (en) * 2012-08-22 2014-03-06 Mitsubishi Electric Corp Apparatus for processing semiconductor and method for manufacturing semiconductor device using the same
JP2015109327A (en) * 2013-12-04 2015-06-11 株式会社ディスコ Cleaning device
CN105127164A (en) * 2014-05-30 2015-12-09 盛美半导体设备(上海)有限公司 Cavity automatic cleaning device
CN108956248A (en) * 2018-05-16 2018-12-07 南通市飞宇石油科技开发有限公司 A kind of endless tube injecting type rock core oil washing instrument

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641664U (en) * 1992-11-12 1994-06-03 株式会社新屋製作所 Boots cleaning equipment
US5718763A (en) * 1994-04-04 1998-02-17 Tokyo Electron Limited Resist processing apparatus for a rectangular substrate
US5785068A (en) * 1995-05-11 1998-07-28 Dainippon Screen Mfg. Co., Ltd. Substrate spin cleaning apparatus
US6481447B1 (en) * 2000-09-27 2002-11-19 Lam Research Corporation Fluid delivery ring and methods for making and implementing the same
US7494550B2 (en) * 2000-09-27 2009-02-24 Lam Research Corporation Fluid delivery ring and methods for making and implementing the same
JP2007160183A (en) * 2005-12-12 2007-06-28 Yutaka Electronics Industry Co Ltd Washing machine
JP2014041916A (en) * 2012-08-22 2014-03-06 Mitsubishi Electric Corp Apparatus for processing semiconductor and method for manufacturing semiconductor device using the same
JP2015109327A (en) * 2013-12-04 2015-06-11 株式会社ディスコ Cleaning device
TWI642491B (en) * 2013-12-04 2018-12-01 迪思科股份有限公司 Cleaning device
CN105127164A (en) * 2014-05-30 2015-12-09 盛美半导体设备(上海)有限公司 Cavity automatic cleaning device
CN108956248A (en) * 2018-05-16 2018-12-07 南通市飞宇石油科技开发有限公司 A kind of endless tube injecting type rock core oil washing instrument

Similar Documents

Publication Publication Date Title
KR102513280B1 (en) Cleaning apparatus and wafer cleaning method
JPH0444216Y2 (en)
KR101223354B1 (en) Substrate processing device
JPS63136528A (en) Applicator for treatment liquid
KR19990013579A (en) Liquid treatment device
KR20140086840A (en) Substrate cleaning apparatus
JPS61296724A (en) High-pressure jet scrubber washer
JPS61283126A (en) Method and apparatus for washing inner wall of processing station
KR20180035902A (en) Substrate processing method and substrate processing apparatus
JP2004140345A (en) Semiconductor manufacturing device
CN206961798U (en) Substrate board treatment and spray head cleaning device
KR20110077705A (en) The apparatus and method for cleaning single wafer
JP2002143749A (en) Rotary coater
JP3286286B2 (en) Cleaning equipment
JPS6226175B2 (en)
JP2004050054A (en) Method for washing substrate treatment device and substrate treatment device
CN218692049U (en) Wafer cleaning device
JP2608136B2 (en) Rotary coating device
CN108933092A (en) Substrate board treatment, spray head cleaning device and spray head cleaning method
CN217641243U (en) Wafer cleaning device
TWI747062B (en) Processing cup unit and substrate processing apparatus
JPH04118067A (en) Coating device
TWI640369B (en) Substrate processing apparatus, spray head cleaing device and method for cleaning spray head
JP3191379B2 (en) Wafer drying apparatus and semiconductor device manufacturing method
JPH0852443A (en) Cleaning method using ultrapure water