DE60128425D1 - Schneidrad zum Einkerben von spröden Materialien - Google Patents

Schneidrad zum Einkerben von spröden Materialien

Info

Publication number
DE60128425D1
DE60128425D1 DE60128425T DE60128425T DE60128425D1 DE 60128425 D1 DE60128425 D1 DE 60128425D1 DE 60128425 T DE60128425 T DE 60128425T DE 60128425 T DE60128425 T DE 60128425T DE 60128425 D1 DE60128425 D1 DE 60128425D1
Authority
DE
Germany
Prior art keywords
scoring
cutting wheel
brittle materials
brittle
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60128425T
Other languages
English (en)
Other versions
DE60128425T2 (de
Inventor
Hiroshi Soyama
Kazuya Maekawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Application granted granted Critical
Publication of DE60128425D1 publication Critical patent/DE60128425D1/de
Publication of DE60128425T2 publication Critical patent/DE60128425T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0385—Rotary scoring blade

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Dicing (AREA)
DE60128425T 2000-08-04 2001-08-02 Schneidrad zum Einkerben von spröden Materialien Expired - Lifetime DE60128425T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000237241 2000-08-04
JP2000237241A JP3370314B2 (ja) 2000-08-04 2000-08-04 脆性基板用カッターホイール

Publications (2)

Publication Number Publication Date
DE60128425D1 true DE60128425D1 (de) 2007-06-28
DE60128425T2 DE60128425T2 (de) 2008-02-14

Family

ID=18729139

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60128425T Expired - Lifetime DE60128425T2 (de) 2000-08-04 2001-08-02 Schneidrad zum Einkerben von spröden Materialien

Country Status (7)

Country Link
US (1) US6629484B2 (de)
EP (1) EP1177870B1 (de)
JP (1) JP3370314B2 (de)
KR (1) KR100583613B1 (de)
CN (1) CN1261282C (de)
DE (1) DE60128425T2 (de)
TW (1) TW506948B (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2551085B1 (de) * 2005-07-06 2019-01-16 Mitsuboshi Diamond Industrial Co., Ltd. Anreissrad für sprödes Marterial, Verfahren zur Herstellung solch eines Anreissrads und solch ein Anreissrad für sprödes Material verwendendes Anreissverfahren, Anreissvorrichtung und Anreisswerkzeug
KR100829068B1 (ko) 2007-02-22 2008-05-16 주식회사 탑 엔지니어링 글라스 커팅 디스크를 장착한 휠 스크라이버
CR9492S (es) * 2007-12-05 2009-08-03 Boada Germans Sa Util de corte para cortadoras de ceramica
US20110107894A1 (en) * 2008-05-30 2011-05-12 Mitsuboshi Diamond Industrial Co., Ltd Brittle Material Substrate Chamfering Method
JP5332344B2 (ja) * 2008-06-30 2013-11-06 三星ダイヤモンド工業株式会社 チップホルダ及びホルダユニット
KR101081898B1 (ko) * 2008-12-05 2011-11-10 세메스 주식회사 스크라이브 휠 및 이를 가지는 스크라이빙 유닛, 그리고 스크라이빙 유닛을 이용한 스크라이브 라인 형성 방법.
USD623034S1 (en) 2009-12-18 2010-09-07 Techtronic Power Tools Technology Limited Tool arbor
USD619152S1 (en) 2009-12-18 2010-07-06 Techtronic Power Tools Technology Limited Adapter
US9186770B2 (en) 2010-04-29 2015-11-17 Black & Decker Inc. Oscillating tool attachment feature
US8925931B2 (en) 2010-04-29 2015-01-06 Black & Decker Inc. Oscillating tool
US9073195B2 (en) 2010-04-29 2015-07-07 Black & Decker Inc. Universal accessory for oscillating power tool
USD653523S1 (en) 2010-09-29 2012-02-07 Milwaukee Electric Tool Corporation Adapter for a tool
USD646542S1 (en) 2010-09-29 2011-10-11 Milwaukee Electric Tool Corporation Accessory interface for a tool
USD651062S1 (en) 2010-09-29 2011-12-27 Milwaukee Electric Tool Corporation Tool interface for an accessory
KR20140016928A (ko) * 2011-04-14 2014-02-10 코닝 인코포레이티드 얇은 유리 기판 내에 크랙 개시 결함을 기계적으로 형성하는 방법
JP5440808B2 (ja) * 2011-08-01 2014-03-12 三星ダイヤモンド工業株式会社 ピン
JP5440809B2 (ja) * 2011-08-01 2014-03-12 三星ダイヤモンド工業株式会社 チップホルダ
USD832666S1 (en) 2012-07-16 2018-11-06 Black & Decker Inc. Oscillating saw blade
US9555554B2 (en) 2013-05-06 2017-01-31 Milwaukee Electric Tool Corporation Oscillating multi-tool system
JP6424652B2 (ja) * 2015-02-02 2018-11-21 三星ダイヤモンド工業株式会社 ホルダ、ホルダユニット及びスクライブ装置
JP5936733B1 (ja) * 2015-03-10 2016-06-22 トーヨー産業株式会社 ガラス専用カッターホイール
CN105084752A (zh) * 2015-07-15 2015-11-25 北京沃尔德金刚石工具股份有限公司 一种轴孔有排屑槽的渗透型刀轮
USD814900S1 (en) 2017-01-16 2018-04-10 Black & Decker Inc. Blade for oscillating power tools
US10265778B2 (en) 2017-01-16 2019-04-23 Black & Decker Inc. Accessories for oscillating power tools
CN107140820B (zh) * 2017-06-20 2023-10-27 嘉兴沃尔德金刚石工具有限公司 一种自带排屑孔阵的刀轮
US10710923B2 (en) * 2017-10-26 2020-07-14 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Wheel cutter for cutting a flexible glass substrate and cutting method thereof
JP6910647B2 (ja) * 2017-11-30 2021-07-28 三星ダイヤモンド工業株式会社 スクライビングホイール、このスクライビングホイールを備えるチップホルダ、支持ピン、およびこの支持ピンを備えるチップホルダ
JP6936485B2 (ja) * 2017-12-27 2021-09-15 三星ダイヤモンド工業株式会社 スクライブ装置およびホルダユニット
US20190337175A1 (en) * 2018-05-01 2019-11-07 Pei-Keng Liu Cutting device
CN111908780A (zh) * 2019-05-10 2020-11-10 塔工程有限公司 划线装置及其控制方法
CN112008890B (zh) * 2019-05-30 2024-04-16 三星钻石工业股份有限公司 保持具单元及销
JP7474475B2 (ja) * 2019-05-30 2024-04-25 三星ダイヤモンド工業株式会社 ホルダユニットおよびピン
KR102226004B1 (ko) * 2019-08-12 2021-03-11 엠.제이.테크(주) PCD(Polycrystalline Diamond) 재질의 스크라이빙휠
KR20220068544A (ko) * 2020-11-19 2022-05-26 코닝 인코포레이티드 유리 라미네이트 기판의 커팅 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1962238A (en) * 1932-05-31 1934-06-12 Arthur T Fletcher Glass cutter
US2912021A (en) * 1958-03-10 1959-11-10 Borg Warner Mounting rotors on arbors of various transaxial contours
JP2621489B2 (ja) * 1989-07-13 1997-06-18 富士ゼロックス株式会社 荷電制御型インクジェットプリンタにおけるインク滴の帯電制御方式
TW308581B (de) 1995-11-06 1997-06-21 Mitsuboshi Diamond Kogyo Kk
JPH09267268A (ja) * 1996-04-03 1997-10-14 Noritake Dia Kk 内周スリット付き極薄ブレード
JP4084864B2 (ja) * 1997-07-10 2008-04-30 株式会社Ｔｊｍデザイン カッティングソー
JP3759317B2 (ja) * 1998-08-04 2006-03-22 トーヨー産業株式会社 ガラス切断専用のカッターホイール

Also Published As

Publication number Publication date
JP2002050592A (ja) 2002-02-15
DE60128425T2 (de) 2008-02-14
CN1337298A (zh) 2002-02-27
EP1177870B1 (de) 2007-05-16
KR100583613B1 (ko) 2006-05-26
US20020033087A1 (en) 2002-03-21
KR20020012115A (ko) 2002-02-15
EP1177870A3 (de) 2002-06-05
JP3370314B2 (ja) 2003-01-27
US6629484B2 (en) 2003-10-07
EP1177870A2 (de) 2002-02-06
TW506948B (en) 2002-10-21
CN1261282C (zh) 2006-06-28

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Legal Events

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