DE60103398D1 - Mustererzeugungsverfahren unter verwendung einer inorganischer antireflexionsschicht - Google Patents
Mustererzeugungsverfahren unter verwendung einer inorganischer antireflexionsschichtInfo
- Publication number
- DE60103398D1 DE60103398D1 DE60103398T DE60103398T DE60103398D1 DE 60103398 D1 DE60103398 D1 DE 60103398D1 DE 60103398 T DE60103398 T DE 60103398T DE 60103398 T DE60103398 T DE 60103398T DE 60103398 D1 DE60103398 D1 DE 60103398D1
- Authority
- DE
- Germany
- Prior art keywords
- antire
- inorganic
- production method
- reflection layer
- pattern production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H01L21/02129—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being boron or phosphorus doped silicon oxides, e.g. BPSG, BSG or PSG
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H01L21/0214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being a silicon oxynitride, e.g. SiON or SiON:H
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02266—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by physical ablation of a target, e.g. sputtering, reactive sputtering, physical vapour deposition or pulsed laser deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0276—Photolithographic processes using an anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/3143—Inorganic layers composed of alternated layers or of mixtures of nitrides and oxides or of oxinitrides, e.g. formation of oxinitride by oxidation of nitride layers
- H01L21/3145—Inorganic layers composed of alternated layers or of mixtures of nitrides and oxides or of oxinitrides, e.g. formation of oxinitride by oxidation of nitride layers formed by deposition from a gas or vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Memories (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US597122 | 2000-06-20 | ||
US09/597,122 US6607984B1 (en) | 2000-06-20 | 2000-06-20 | Removable inorganic anti-reflection coating process |
PCT/US2001/019660 WO2001099164A2 (en) | 2000-06-20 | 2001-06-20 | Patterning method using a removable inorganic antireflection coating |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60103398D1 true DE60103398D1 (de) | 2004-06-24 |
DE60103398T2 DE60103398T2 (de) | 2005-06-09 |
Family
ID=24390174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60103398T Expired - Lifetime DE60103398T2 (de) | 2000-06-20 | 2001-06-20 | Mustererzeugungsverfahren unter Verwendung einer inorganischen Antireflexionsschicht |
Country Status (5)
Country | Link |
---|---|
US (1) | US6607984B1 (de) |
EP (1) | EP1292969B1 (de) |
DE (1) | DE60103398T2 (de) |
TW (1) | TW563208B (de) |
WO (1) | WO2001099164A2 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6573175B1 (en) * | 2001-11-30 | 2003-06-03 | Micron Technology, Inc. | Dry low k film application for interlevel dielectric and method of cleaning etched features |
US7304720B2 (en) * | 2002-02-22 | 2007-12-04 | Asml Holding N.V. | System for using a two part cover for protecting a reticle |
US20050118541A1 (en) * | 2003-11-28 | 2005-06-02 | Applied Materials, Inc. | Maintenance of photoresist adhesion and activity on the surface of dielectric ARCS for 90 nm feature sizes |
US20050158947A1 (en) * | 2004-01-16 | 2005-07-21 | United Microelectronics Corp. | Method for Forming Self-Aligned Trench |
US7365014B2 (en) * | 2004-01-30 | 2008-04-29 | Applied Materials, Inc. | Reticle fabrication using a removable hard mask |
US7829471B2 (en) * | 2005-07-29 | 2010-11-09 | Applied Materials, Inc. | Cluster tool and method for process integration in manufacturing of a photomask |
US20070031609A1 (en) * | 2005-07-29 | 2007-02-08 | Ajay Kumar | Chemical vapor deposition chamber with dual frequency bias and method for manufacturing a photomask using the same |
US7375038B2 (en) * | 2005-09-28 | 2008-05-20 | Applied Materials, Inc. | Method for plasma etching a chromium layer through a carbon hard mask suitable for photomask fabrication |
US20090047791A1 (en) * | 2007-08-16 | 2009-02-19 | International Business Machines Corporation | Semiconductor etching methods |
US20090104541A1 (en) * | 2007-10-23 | 2009-04-23 | Eui Kyoon Kim | Plasma surface treatment to prevent pattern collapse in immersion lithography |
US8268730B2 (en) * | 2009-06-03 | 2012-09-18 | Micron Technology, Inc. | Methods of masking semiconductor device structures |
US20130102123A1 (en) * | 2011-10-19 | 2013-04-25 | Nanya Technology Corporation | Method for fabricating single-sided buried strap in a semiconductor device |
CN103531444B (zh) * | 2012-07-02 | 2016-05-25 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构的形成方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62286229A (ja) | 1986-06-04 | 1987-12-12 | Matsushita Electric Ind Co Ltd | ドライエツチング方法 |
JPH01255264A (ja) * | 1988-04-05 | 1989-10-12 | Seiko Instr Inc | 半導体装置の製造方法 |
EP0501275A3 (en) * | 1991-03-01 | 1992-11-19 | Motorola, Inc. | Method of making symmetrical and asymmetrical mesfets |
DE4231312C2 (de) | 1992-09-18 | 1996-10-02 | Siemens Ag | Antireflexschicht und Verfahren zur lithografischen Strukturierung einer Schicht |
JP3486426B2 (ja) * | 1993-01-18 | 2004-01-13 | キヤノン株式会社 | 半導体装置及び液晶表示装置 |
KR0176153B1 (ko) | 1995-05-30 | 1999-04-15 | 김광호 | 반도체 장치의 소자분리막 및 그 형성방법 |
JPH0955351A (ja) | 1995-08-15 | 1997-02-25 | Sony Corp | 半導体装置の製造方法 |
FR2749973B1 (fr) * | 1996-06-13 | 1998-09-25 | France Telecom | Procede de gravure de la grille en technologie mos utilisant un masque dur a base de sion |
TW327694B (en) * | 1997-01-30 | 1998-03-01 | Nat Science Council | The method for depositing oxynitride film on substrate by LPD |
US5883011A (en) | 1997-06-18 | 1999-03-16 | Vlsi Technology, Inc. | Method of removing an inorganic antireflective coating from a semiconductor substrate |
US6121133A (en) | 1997-08-22 | 2000-09-19 | Micron Technology, Inc. | Isolation using an antireflective coating |
US6020091A (en) | 1997-09-30 | 2000-02-01 | Siemens Aktiengesellschaft | Hard etch mask |
US5883006A (en) * | 1997-12-12 | 1999-03-16 | Kabushiki Kaisha Toshiba | Method for making a semiconductor device using a flowable oxide film |
US6190955B1 (en) | 1998-01-27 | 2001-02-20 | International Business Machines Corporation | Fabrication of trench capacitors using disposable hard mask |
US6159832A (en) * | 1998-03-18 | 2000-12-12 | Mayer; Frederick J. | Precision laser metallization |
DE19844102C2 (de) * | 1998-09-25 | 2000-07-20 | Siemens Ag | Herstellverfahren für eine Halbleiterstruktur |
US6342428B1 (en) | 1999-10-04 | 2002-01-29 | Philips Electronics North America Corp. | Method for a consistent shallow trench etch profile |
-
2000
- 2000-06-20 US US09/597,122 patent/US6607984B1/en not_active Expired - Lifetime
-
2001
- 2001-06-14 TW TW090114427A patent/TW563208B/zh not_active IP Right Cessation
- 2001-06-20 WO PCT/US2001/019660 patent/WO2001099164A2/en active IP Right Grant
- 2001-06-20 DE DE60103398T patent/DE60103398T2/de not_active Expired - Lifetime
- 2001-06-20 EP EP01948507A patent/EP1292969B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO2001099164A2 (en) | 2001-12-27 |
DE60103398T2 (de) | 2005-06-09 |
EP1292969A2 (de) | 2003-03-19 |
TW563208B (en) | 2003-11-21 |
EP1292969B1 (de) | 2004-05-19 |
US6607984B1 (en) | 2003-08-19 |
WO2001099164A3 (en) | 2002-07-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60232686D1 (de) | Verfahren zur Verkleinerung des Musters in einer Photoresistschicht | |
DE69943189D1 (de) | Verfahren zum Herstellen einer Überzugsschicht | |
DE60125755D1 (de) | Verfahren zur herstellung einer flexodruckplatte | |
DE60045375D1 (de) | Verfahren zur ätzung einer schicht mit niedriger dielektrizitätskonstante | |
DE60125665D1 (de) | Saugfähiger Gegenstand mit einer faserigen Oberflächenschicht | |
DE69935810D1 (de) | Verfahren zur herstellung einer laminierten struktur | |
DE60237159D1 (de) | Verfahren zur ausbildung einer lichtabsorbierenden schicht | |
DE60100449D1 (de) | Verfahren zur Herstellung einer Photo-Orientierungsschicht | |
DE60103398D1 (de) | Mustererzeugungsverfahren unter verwendung einer inorganischer antireflexionsschicht | |
DE60142673D1 (de) | Verfahren zum Herstellen einer Wärmedämmschicht | |
DE60118126D1 (de) | Verfahren zur Herstellung einer Spiegelstruktur | |
DE60008861D1 (de) | Verfahren zur herstellung einer schalldämmenden platte mit widerstandschicht mit struktureigenschaften und zugehöriger platte. | |
DE69932337D1 (de) | Herstellungsverfahren einer anzeigetafel unter verwendung eines klebemittelauftragungsverfahren | |
DE69934680D1 (de) | Verfahren zur herstellung einer schicht | |
FI990159A0 (fi) | Menetelmä kuiturainan laadun valvomiseksi | |
DE60139361D1 (de) | Herstellungsverfahren einer hohlen Zahnstange | |
DE69926993D1 (de) | Verfahren zur herstellung einer mehrschichtigen deckschicht | |
ATE236878T1 (de) | Neue produktionsmethode | |
DE60021928D1 (de) | Verfahren zur Herstellung einer Cordieriet-Keramik mit Wabenstruktur | |
DE50113288D1 (de) | Verfahren zur Steuerung einer schnellen dynamischen Waage | |
DE60114089D1 (de) | Verfahren zur Herstellung von einer verschleissfesten Beschichtung | |
DE50202891D1 (de) | Verfahren zum Herstellen einer Halbleiterstruktur unter Verwendung einer Schutzschicht | |
DE50212601D1 (de) | Verfahren zur herstellung einer brenneranlage | |
DE10192273D2 (de) | Verfahren zur Positionierung einer fremdkraftbetätigten Schließfläche | |
DE50210249D1 (de) | Schichtsystem mit einer porösen schicht |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: INTERNATIONAL BUSINESS MACHINES CORP., ARMONK,, US Owner name: QIMONDA AG, 81739 MUENCHEN, DE |