DE60042471D1 - Heizungsvorrichtung zum Bonden mittels Löthocker und Löthocker Bondenverfahren - Google Patents

Heizungsvorrichtung zum Bonden mittels Löthocker und Löthocker Bondenverfahren

Info

Publication number
DE60042471D1
DE60042471D1 DE60042471T DE60042471T DE60042471D1 DE 60042471 D1 DE60042471 D1 DE 60042471D1 DE 60042471 T DE60042471 T DE 60042471T DE 60042471 T DE60042471 T DE 60042471T DE 60042471 D1 DE60042471 D1 DE 60042471D1
Authority
DE
Germany
Prior art keywords
soldering
bonding
stump
stool
heating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60042471T
Other languages
English (en)
Inventor
Shoriki Narita
Makoto Imanishi
Takaharu Mae
Nobuhisa Watanabe
Shinji Kanayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of DE60042471D1 publication Critical patent/DE60042471D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
DE60042471T 1999-10-19 2000-10-19 Heizungsvorrichtung zum Bonden mittels Löthocker und Löthocker Bondenverfahren Expired - Lifetime DE60042471D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29663199A JP4371497B2 (ja) 1999-10-19 1999-10-19 バンプボンディング用加熱装置

Publications (1)

Publication Number Publication Date
DE60042471D1 true DE60042471D1 (de) 2009-08-13

Family

ID=17836055

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60042471T Expired - Lifetime DE60042471D1 (de) 1999-10-19 2000-10-19 Heizungsvorrichtung zum Bonden mittels Löthocker und Löthocker Bondenverfahren

Country Status (4)

Country Link
US (2) US6329640B1 (de)
EP (1) EP1094499B1 (de)
JP (1) JP4371497B2 (de)
DE (1) DE60042471D1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6787391B1 (en) * 1998-06-19 2004-09-07 Matsushita Electric Industrial Co., Ltd. Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor
JP4456234B2 (ja) * 2000-07-04 2010-04-28 パナソニック株式会社 バンプ形成方法
TW549560U (en) * 2002-11-18 2003-08-21 Ind Tech Res Inst Rotational positioning mechanism for separating brittle material
JP4516354B2 (ja) * 2004-05-17 2010-08-04 パナソニック株式会社 部品供給方法
US7571770B2 (en) * 2005-03-23 2009-08-11 Baker Hughes Incorporated Downhole cooling based on thermo-tunneling of electrons
CN102110634B (zh) * 2010-11-22 2012-04-11 沈阳芯源微电子设备有限公司 可旋转加热的吸附装置
JP6409033B2 (ja) * 2016-08-10 2018-10-17 株式会社カイジョー ボンディング方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4578032A (en) * 1984-11-26 1986-03-25 Miller C Fredrick Workpiece heater
US5060843A (en) * 1989-06-07 1991-10-29 Nec Corporation Process of forming bump on electrode of semiconductor chip and apparatus used therefor
JPH05299492A (ja) * 1992-04-17 1993-11-12 Nachi Fujikoshi Corp ウエハの位置決め装置
JPH06232131A (ja) * 1993-02-02 1994-08-19 Toshiba Corp ウエハ加熱装置およびバンプ形成装置
JP2616558B2 (ja) * 1993-12-14 1997-06-04 日本電気株式会社 バンプ形成装置およびバンプ形成方法
US5933752A (en) * 1996-11-28 1999-08-03 Sony Corporation Method and apparatus for forming solder bumps for a semiconductor device
JPH10163215A (ja) * 1996-12-05 1998-06-19 Matsushita Electric Ind Co Ltd バンプレベリング装置及びその方法
JP3400337B2 (ja) * 1998-02-12 2003-04-28 株式会社新川 ボンディング装置
TW412817B (en) * 1998-06-19 2000-11-21 Matsushita Electric Ind Co Ltd A bump bonding apparatus and method

Also Published As

Publication number Publication date
EP1094499A3 (de) 2005-06-15
US6329640B1 (en) 2001-12-11
JP2001118869A (ja) 2001-04-27
JP4371497B2 (ja) 2009-11-25
EP1094499A2 (de) 2001-04-25
EP1094499B1 (de) 2009-07-01
US6392202B2 (en) 2002-05-21
US20020011479A1 (en) 2002-01-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition