DE60102115D1 - Verfahren und Vorrichtung zum Schwall-Löten - Google Patents

Verfahren und Vorrichtung zum Schwall-Löten

Info

Publication number
DE60102115D1
DE60102115D1 DE60102115T DE60102115T DE60102115D1 DE 60102115 D1 DE60102115 D1 DE 60102115D1 DE 60102115 T DE60102115 T DE 60102115T DE 60102115 T DE60102115 T DE 60102115T DE 60102115 D1 DE60102115 D1 DE 60102115D1
Authority
DE
Germany
Prior art keywords
wave soldering
soldering
wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60102115T
Other languages
English (en)
Other versions
DE60102115T2 (de
Inventor
Atsushi Yamaguchi
Masato Hirano
Yoshinori Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE60102115D1 publication Critical patent/DE60102115D1/de
Publication of DE60102115T2 publication Critical patent/DE60102115T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
DE60102115T 2000-08-21 2001-08-17 Verfahren und Vorrichtung zum Schwall-Löten Expired - Fee Related DE60102115T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000249588 2000-08-21
JP2000249588 2000-08-21

Publications (2)

Publication Number Publication Date
DE60102115D1 true DE60102115D1 (de) 2004-04-01
DE60102115T2 DE60102115T2 (de) 2004-12-23

Family

ID=18739311

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60102115T Expired - Fee Related DE60102115T2 (de) 2000-08-21 2001-08-17 Verfahren und Vorrichtung zum Schwall-Löten

Country Status (3)

Country Link
US (2) US6648216B2 (de)
EP (1) EP1188506B1 (de)
DE (1) DE60102115T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7097806B2 (en) 2000-09-01 2006-08-29 Fry's Metals, Inc. Rapid surface cooling of solder droplets by flash evaporation
EP1259101A4 (de) 2000-09-26 2003-04-09 Matsushita Electric Industrial Co Ltd Schwallötvorrichtung und -methode
JP2003051671A (ja) * 2001-06-01 2003-02-21 Nec Corp 実装構造体の製造方法および実装構造体
CN101200025B (zh) 2004-04-16 2012-09-05 P.凯金属股份有限公司 液体活性添加剂在焊接方法中用于降低熔融焊料粘度的用途
TW200610122A (en) * 2004-09-14 2006-03-16 P Kay Metal Inc Soldering process
US20060226199A1 (en) * 2005-03-30 2006-10-12 Visteon Global Technologies, Inc. Selective soldering of flat flexible cable with lead-free solder to a substrate
JP3942623B2 (ja) * 2005-12-12 2007-07-11 富士通テン株式会社 フラットディップ装置およびフラットディップ装置のはんだ付け方法
US20070254255A1 (en) * 2006-03-28 2007-11-01 Neville James E System, apparatus and methods for board cooling
DE102006029593A1 (de) * 2006-05-29 2007-12-13 Pink Gmbh Vakuumtechnik Verfahren und Vorrichtung zur Herstellung einer Lotverbindung
US8662374B2 (en) 2010-12-16 2014-03-04 Air Liquide Industrial U.S. Lp Method for reduced cycle times in multi-pass welding while providing an inert atmosphere to the welding zone
DE102011081606B4 (de) * 2011-08-26 2022-08-04 Infineon Technologies Ag Kühlvorrichtung und Lötanlage
CN108112185B (zh) * 2017-12-12 2019-06-07 宁波隆锐机械制造有限公司 一种电路板冷却装置
US10965079B2 (en) * 2018-10-26 2021-03-30 Schweitzer Engineering Laboratories, Inc. Comb pattern insert for wave solder pallets
CN111889835B (zh) * 2020-07-27 2021-09-21 中国石油大学(华东) 一种降低钎焊接头中残余应力的方法
US11824037B2 (en) * 2020-12-31 2023-11-21 International Business Machines Corporation Assembly of a chip to a substrate

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3056015A (en) 1960-09-30 1962-09-25 Bendix Corp Dip-soldering method and apparatus
JPS5516726A (en) * 1978-07-21 1980-02-05 Hitachi Ltd Soldering device
US4402448A (en) 1978-10-12 1983-09-06 Cooper Industries, Inc. Mass soldering system
DE2932398C2 (de) * 1979-08-09 1981-10-15 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum Kühlen von Leiterplatten nach dem maschinellen Einlöten von elektrischen Bauteilen
US4818823A (en) * 1987-07-06 1989-04-04 Micro-Circuits, Inc. Adhesive component means for attaching electrical components to conductors
JPH01289566A (ja) * 1988-05-12 1989-11-21 Mitsubishi Electric Corp ベーパーフェイズ・リフロー半田付装置
US5236117A (en) * 1992-06-22 1993-08-17 Staktek Corporation Impact solder method and apparatus
US5685475A (en) * 1995-09-08 1997-11-11 Ford Motor Company Apparatus for cooling printed circuit boards in wave soldering
JP3220635B2 (ja) 1996-02-09 2001-10-22 松下電器産業株式会社 はんだ合金及びクリームはんだ
US5730932A (en) * 1996-03-06 1998-03-24 International Business Machines Corporation Lead-free, tin-based multi-component solder alloys
KR20010012083A (ko) * 1997-04-22 2001-02-15 주디쓰 레슬리 왈튼, 아이언 노엘 왈튼 무연 땜납
JP3414263B2 (ja) * 1998-06-04 2003-06-09 株式会社日立製作所 電子回路基板の製造方法
JP2000188464A (ja) * 1998-12-21 2000-07-04 Senju Metal Ind Co Ltd 自動はんだ付け装置
JP2000244108A (ja) 1999-02-22 2000-09-08 Senju Metal Ind Co Ltd プリント基板のはんだ付け方法、プリント基板のはんだ付け装置およびはんだ付け装置用冷却装置
JP3617793B2 (ja) * 1999-06-30 2005-02-09 株式会社東芝 はんだ付け方法およびはんだ付け装置
JP2002043734A (ja) * 2000-07-24 2002-02-08 Senju Metal Ind Co Ltd プリント基板のはんだ付け方法およびその装置

Also Published As

Publication number Publication date
DE60102115T2 (de) 2004-12-23
US20020038815A1 (en) 2002-04-04
EP1188506B1 (de) 2004-02-25
US20040056067A1 (en) 2004-03-25
US6648216B2 (en) 2003-11-18
US7150387B2 (en) 2006-12-19
EP1188506A1 (de) 2002-03-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8339 Ceased/non-payment of the annual fee