DE60037929D1 - Geschichtetes Chipbauteil und Herstellungsverfahren - Google Patents

Geschichtetes Chipbauteil und Herstellungsverfahren

Info

Publication number
DE60037929D1
DE60037929D1 DE60037929T DE60037929T DE60037929D1 DE 60037929 D1 DE60037929 D1 DE 60037929D1 DE 60037929 T DE60037929 T DE 60037929T DE 60037929 T DE60037929 T DE 60037929T DE 60037929 D1 DE60037929 D1 DE 60037929D1
Authority
DE
Germany
Prior art keywords
manufacturing process
chip component
layered chip
layered
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60037929T
Other languages
English (en)
Other versions
DE60037929T2 (de
Inventor
Nobuaki Muramatsu
Takahiro Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toko Inc
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toko Inc filed Critical Toko Inc
Publication of DE60037929D1 publication Critical patent/DE60037929D1/de
Application granted granted Critical
Publication of DE60037929T2 publication Critical patent/DE60037929T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/0026—Multilayer LC-filter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE60037929T 1999-09-24 2000-09-22 Geschichtetes Chipbauteil und Herstellungsverfahren Expired - Lifetime DE60037929T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26985699A JP4034483B2 (ja) 1999-09-24 1999-09-24 積層型チップ部品の製造方法
JP26985699 1999-09-24

Publications (2)

Publication Number Publication Date
DE60037929D1 true DE60037929D1 (de) 2008-03-20
DE60037929T2 DE60037929T2 (de) 2009-01-22

Family

ID=17478162

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60037929T Expired - Lifetime DE60037929T2 (de) 1999-09-24 2000-09-22 Geschichtetes Chipbauteil und Herstellungsverfahren

Country Status (4)

Country Link
US (2) US6597056B1 (de)
EP (1) EP1087524B1 (de)
JP (1) JP4034483B2 (de)
DE (1) DE60037929T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040108134A1 (en) * 2002-10-11 2004-06-10 Borland William J. Printed wiring boards having low inductance embedded capacitors and methods of making same
JP5116004B2 (ja) * 2006-08-03 2013-01-09 日東電工株式会社 透明導電性積層体及びそれを備えたタッチパネル
US10770225B2 (en) * 2016-08-08 2020-09-08 Hamilton Sundstrand Corporation Multilayered coils
JP6743767B2 (ja) * 2017-06-06 2020-08-19 株式会社村田製作所 Ｌｃ複合部品
US20220084930A1 (en) * 2019-01-30 2022-03-17 Kyocera Corporation Electronic component mounting base and electronic device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3812442A (en) * 1972-02-29 1974-05-21 W Muckelroy Ceramic inductor
JPH0846471A (ja) * 1994-07-29 1996-02-16 Murata Mfg Co Ltd 積層型ｌｃ複合部品
US6356181B1 (en) * 1996-03-29 2002-03-12 Murata Manufacturing Co., Ltd. Laminated common-mode choke coil
US6247228B1 (en) * 1996-08-12 2001-06-19 Tessera, Inc. Electrical connection with inwardly deformable contacts
US5949304A (en) * 1997-10-16 1999-09-07 Motorola, Inc. Multilayer ceramic package with floating element to couple transmission lines
US6566731B2 (en) * 1999-02-26 2003-05-20 Micron Technology, Inc. Open pattern inductor

Also Published As

Publication number Publication date
EP1087524A3 (de) 2003-07-09
US6597056B1 (en) 2003-07-22
JP4034483B2 (ja) 2008-01-16
EP1087524A2 (de) 2001-03-28
EP1087524B1 (de) 2008-01-30
DE60037929T2 (de) 2009-01-22
JP2001093732A (ja) 2001-04-06
US20030201533A1 (en) 2003-10-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition