DE60036925D1 - Vorrichtung zur Oberflächenbehandlung von Blattmaterial - Google Patents

Vorrichtung zur Oberflächenbehandlung von Blattmaterial

Info

Publication number
DE60036925D1
DE60036925D1 DE60036925T DE60036925T DE60036925D1 DE 60036925 D1 DE60036925 D1 DE 60036925D1 DE 60036925 T DE60036925 T DE 60036925T DE 60036925 T DE60036925 T DE 60036925T DE 60036925 D1 DE60036925 D1 DE 60036925D1
Authority
DE
Germany
Prior art keywords
surface treatment
leaf material
leaf
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60036925T
Other languages
English (en)
Other versions
DE60036925T2 (de
Inventor
Kisaburo Niiyama
Masahiro Midorikawa
Kiyosi Sugawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Kakoki Co Ltd
Original Assignee
Tokyo Kakoki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Kakoki Co Ltd filed Critical Tokyo Kakoki Co Ltd
Publication of DE60036925D1 publication Critical patent/DE60036925D1/de
Application granted granted Critical
Publication of DE60036925T2 publication Critical patent/DE60036925T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Spray Control Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
DE2000636925 2000-05-11 2000-09-12 Vorrichtung zur Oberflächenbehandlung von Blattmaterial Expired - Fee Related DE60036925T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000138361 2000-05-11
JP2000138361A JP3518676B2 (ja) 2000-05-11 2000-05-11 プリント配線基板材の表面処理装置

Publications (2)

Publication Number Publication Date
DE60036925D1 true DE60036925D1 (de) 2007-12-13
DE60036925T2 DE60036925T2 (de) 2008-08-07

Family

ID=18645982

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2000636925 Expired - Fee Related DE60036925T2 (de) 2000-05-11 2000-09-12 Vorrichtung zur Oberflächenbehandlung von Blattmaterial

Country Status (6)

Country Link
EP (1) EP1153665B1 (de)
JP (1) JP3518676B2 (de)
KR (1) KR100713235B1 (de)
CN (1) CN1200776C (de)
DE (1) DE60036925T2 (de)
TW (1) TWI232075B (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100398894B1 (ko) * 2001-01-02 2003-09-19 주식회사 주연엔지니어링 초 박판형 피시비 기판 제조 공정중 표면 처리 공정에 사용되는 정면기의 구동장치
KR20040110391A (ko) * 2003-06-19 2004-12-31 삼성전자주식회사 기판 처리 장치
KR100567833B1 (ko) * 2004-01-09 2006-04-05 스피닉스(주) 기판 처리 장치
KR20080064314A (ko) * 2007-01-04 2008-07-09 주식회사 디엠에스 유체 분사장치
KR100914184B1 (ko) * 2007-12-17 2009-08-26 세메스 주식회사 기판 처리 장치
CN101740325B (zh) * 2008-11-14 2012-11-28 家登精密工业股份有限公司 半导体基材清洁装置
DE102011107601A1 (de) * 2011-07-16 2013-01-17 GM Global Technology Operations LLC (n. d. Gesetzen des Staates Delaware) Beschichtungsvorrichtung mit einer Beschichtungsdüsenanordnung für einen Kunststoffprofilstrang
KR101308136B1 (ko) * 2011-08-31 2013-09-12 세메스 주식회사 기판 처리 장치
CN102513249A (zh) * 2011-12-15 2012-06-27 无锡威孚环保催化剂有限公司 带式金属材料表面涂覆工艺及设备
KR101214875B1 (ko) 2012-03-23 2012-12-24 주식회사 지씨이 기판 제조 공정 중 도금공정 라인에 있어서, 한 가지의 도금 조로 경질이나 플렉시블 또는 박판의 기판을 도금할 수 있는 도금방법 및 그 장치
JP2014187352A (ja) * 2013-02-22 2014-10-02 Mitsubishi Paper Mills Ltd レジスト層の薄膜化装置
JP2015017315A (ja) * 2013-07-15 2015-01-29 イビデン株式会社 表面処理装置および表面処理基板の製造方法
JP2015084407A (ja) * 2013-09-17 2015-04-30 アイケイ株式会社 基板材の表面処理装置
CN103871938B (zh) * 2014-03-31 2016-10-12 上海华力微电子有限公司 用于清洗半导体晶圆的清洗槽
JP6189279B2 (ja) * 2014-11-14 2017-08-30 新光電気工業株式会社 エッチング装置
JPWO2016152956A1 (ja) * 2015-03-25 2018-01-25 リンテック株式会社 ガスバリア層付き成形物の製造装置
CN107179655A (zh) * 2017-07-28 2017-09-19 京东方科技集团股份有限公司 一种显影方法及显影装置
CN107214019A (zh) * 2017-07-31 2017-09-29 望江县精美欣钢构有限公司 一种双执行机构钢板表面自动喷胶设备
CN107976874A (zh) * 2017-11-10 2018-05-01 江门崇达电路技术有限公司 一种des线显影喷嘴装置及显影方法
CN109290083A (zh) * 2018-09-14 2019-02-01 安徽建联木业有限公司 一种木材板双面喷涂装置
CN110586552B (zh) * 2019-10-17 2024-06-25 攀钢集团矿业有限公司 一种往复式高梯度磁选机冲洗装置
CN112742622A (zh) * 2020-12-27 2021-05-04 苏州鑫河镜业有限公司 一种可双面喷涂的环保防雾纳米涂层涂覆机及其工作方法
CN113499924B (zh) * 2021-07-30 2022-01-04 江苏远军幕墙新材料有限公司 一种建筑幕墙铝单板用自洁涂料涂喷设备
CN113751379B (zh) * 2021-10-22 2022-08-26 深圳市择众信息咨询有限公司 一种电子元器件高效清洁装置
CN114273126A (zh) * 2021-11-30 2022-04-05 江苏亨博复合材料有限公司 一种热塑预浸料生产制造的静电喷涂装置
CN114505283A (zh) * 2022-02-24 2022-05-17 深圳市东方迈卓科技有限公司 一种用于集成系统电路板生产加工设备
CN115767929B (zh) * 2022-12-05 2024-01-05 江西华兴四海机械设备有限公司 一种pcb线路板生产用的喷洒蚀刻设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5762749A (en) * 1995-07-21 1998-06-09 Dainippon Screen Mfg. Co., Ltd. Apparatus for removing liquid from substrates
JPH10212074A (ja) * 1997-01-29 1998-08-11 Sumitomo Electric Ind Ltd ケーブル用背負い式リール
JP4081161B2 (ja) * 1997-09-05 2008-04-23 武田薬品工業株式会社 光学活性化合物の製造法
KR19990080106A (ko) * 1998-04-13 1999-11-05 윤종용 반도체 장치의 세정 장비
JP3005898B2 (ja) * 1998-04-30 2000-02-07 東京化工機株式会社 液体噴射装置

Also Published As

Publication number Publication date
TWI232075B (en) 2005-05-01
KR20010104606A (ko) 2001-11-26
JP2001314789A (ja) 2001-11-13
EP1153665A3 (de) 2002-11-27
CN1323660A (zh) 2001-11-28
JP3518676B2 (ja) 2004-04-12
KR100713235B1 (ko) 2007-05-02
EP1153665A2 (de) 2001-11-14
CN1200776C (zh) 2005-05-11
DE60036925T2 (de) 2008-08-07
EP1153665B1 (de) 2007-10-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee