DE60034032T2 - Verfahren und vorrichtung zur kontrolle von lotpastenschichten auf substraten - Google Patents
Verfahren und vorrichtung zur kontrolle von lotpastenschichten auf substraten Download PDFInfo
- Publication number
- DE60034032T2 DE60034032T2 DE60034032T DE60034032T DE60034032T2 DE 60034032 T2 DE60034032 T2 DE 60034032T2 DE 60034032 T DE60034032 T DE 60034032T DE 60034032 T DE60034032 T DE 60034032T DE 60034032 T2 DE60034032 T2 DE 60034032T2
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- image
- substance
- processor
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 81
- 239000000758 substrate Substances 0.000 title claims description 64
- 229910000679 solder Inorganic materials 0.000 claims description 93
- 239000000126 substance Substances 0.000 claims description 44
- 238000007689 inspection Methods 0.000 claims description 19
- 238000009499 grossing Methods 0.000 claims description 17
- 238000005070 sampling Methods 0.000 claims description 15
- 238000001514 detection method Methods 0.000 claims description 13
- 238000007639 printing Methods 0.000 claims description 13
- 238000004458 analytical method Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 238000007650 screen-printing Methods 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 4
- 230000011218 segmentation Effects 0.000 claims description 4
- 239000011345 viscous material Substances 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 claims description 2
- 230000008569 process Effects 0.000 description 21
- 230000006870 function Effects 0.000 description 13
- 230000009977 dual effect Effects 0.000 description 11
- 238000012545 processing Methods 0.000 description 9
- 238000009826 distribution Methods 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 6
- 238000004886 process control Methods 0.000 description 5
- 230000007704 transition Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000003044 adaptive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012935 Averaging Methods 0.000 description 2
- 238000003070 Statistical process control Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- BWWVXHRLMPBDCK-UHFFFAOYSA-N 1,2,4-trichloro-5-(2,6-dichlorophenyl)benzene Chemical compound C1=C(Cl)C(Cl)=CC(Cl)=C1C1=C(Cl)C=CC=C1Cl BWWVXHRLMPBDCK-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000002996 emotional effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003709 image segmentation Methods 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012421 spiking Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Image Processing (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Analysis (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US304699 | 1999-05-04 | ||
| US09/304,699 US6738505B1 (en) | 1999-05-04 | 1999-05-04 | Method and apparatus for detecting solder paste deposits on substrates |
| PCT/US2000/012121 WO2000067005A1 (en) | 1999-05-04 | 2000-05-03 | A method and apparatus for inspecting solder paste deposits on substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60034032D1 DE60034032D1 (de) | 2007-05-03 |
| DE60034032T2 true DE60034032T2 (de) | 2007-12-13 |
Family
ID=23177612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60034032T Expired - Lifetime DE60034032T2 (de) | 1999-05-04 | 2000-05-03 | Verfahren und vorrichtung zur kontrolle von lotpastenschichten auf substraten |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6738505B1 (enExample) |
| EP (1) | EP1181535B1 (enExample) |
| JP (1) | JP4971543B2 (enExample) |
| AU (1) | AU4697800A (enExample) |
| DE (1) | DE60034032T2 (enExample) |
| WO (1) | WO2000067005A1 (enExample) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6891967B2 (en) * | 1999-05-04 | 2005-05-10 | Speedline Technologies, Inc. | Systems and methods for detecting defects in printed solder paste |
| US7072503B2 (en) * | 1999-05-04 | 2006-07-04 | Speedline Technologies, Inc. | Systems and methods for detecting defects in printed solder paste |
| JP3661604B2 (ja) * | 2001-04-05 | 2005-06-15 | 松下電器産業株式会社 | 顕微観察装置および顕微観察方法 |
| US20020196336A1 (en) * | 2001-06-19 | 2002-12-26 | Applied Materials, Inc. | Method and apparatus for substrate imaging |
| US7239399B2 (en) * | 2001-11-13 | 2007-07-03 | Cyberoptics Corporation | Pick and place machine with component placement inspection |
| US7813559B2 (en) | 2001-11-13 | 2010-10-12 | Cyberoptics Corporation | Image analysis for pick and place machines with in situ component placement inspection |
| US7555831B2 (en) * | 2001-11-13 | 2009-07-07 | Cyberoptics Corporation | Method of validating component feeder exchanges |
| KR100421987B1 (ko) * | 2001-12-06 | 2004-03-11 | 삼성전자주식회사 | 오차확산 처리방법 |
| US7101508B2 (en) * | 2002-07-31 | 2006-09-05 | Agilent Technologies, Inc. | Chemical array fabrication errors |
| US7213738B2 (en) * | 2002-09-30 | 2007-05-08 | Speedline Technologies, Inc. | Selective wave solder system |
| DE10311822A1 (de) * | 2003-03-13 | 2004-10-07 | Ekra Eduard Kraft Gmbh Maschinenfabrik | Verfahren und Vorrichtung zur Kontrolle oder Beeinflussung des Druckprozesses beim Lotpastendruck |
| US7508973B2 (en) * | 2003-03-28 | 2009-03-24 | Hitachi High-Technologies Corporation | Method of inspecting defects |
| GB2403003B (en) * | 2003-06-19 | 2006-06-07 | Dek Int Gmbh | Inspection system for and method of inspecting deposits printed on workpieces |
| US7003871B2 (en) * | 2003-10-01 | 2006-02-28 | Integrated Ideas & Technologies, Inc. | Solder paste stencil manufacturing system |
| US7559134B2 (en) * | 2003-11-04 | 2009-07-14 | Cyberoptics Corporation | Pick and place machine with improved component placement inspection |
| US7706595B2 (en) * | 2003-11-07 | 2010-04-27 | Cyberoptics Corporation | Pick and place machine with workpiece motion inspection |
| US20050125993A1 (en) * | 2003-11-07 | 2005-06-16 | Madsen David D. | Pick and place machine with improved setup and operation procedure |
| US20060016066A1 (en) * | 2004-07-21 | 2006-01-26 | Cyberoptics Corporation | Pick and place machine with improved inspection |
| US20060075631A1 (en) * | 2004-10-05 | 2006-04-13 | Case Steven K | Pick and place machine with improved component pick up inspection |
| US20070003126A1 (en) * | 2005-05-19 | 2007-01-04 | Case Steven K | Method and apparatus for evaluating a component pick action in an electronics assembly machine |
| WO2007033349A1 (en) * | 2005-09-14 | 2007-03-22 | Cyberoptics Corporation | Pick and place machine with improved component pick image processing |
| DE112006003019T5 (de) * | 2005-10-31 | 2008-10-23 | Cyberoptics Corp., Golden Valley | Elektronikmontagevorrichtung mit eingebauter Lötpastenprüfung |
| US20070102478A1 (en) | 2005-11-10 | 2007-05-10 | Speedline Technologies, Inc. | Optimal imaging system and method for a stencil printer |
| US20070102477A1 (en) | 2005-11-10 | 2007-05-10 | Speedline Technologies, Inc. | Imaging system and method for a stencil printer |
| KR100958493B1 (ko) * | 2005-12-06 | 2010-05-17 | 시바우라 메카트로닉스 가부시키가이샤 | 면 조잡도 검사 장치 |
| US7458318B2 (en) | 2006-02-01 | 2008-12-02 | Speedline Technologies, Inc. | Off-axis illumination assembly and method |
| US9068917B1 (en) * | 2006-03-14 | 2015-06-30 | Kla-Tencor Technologies Corp. | Systems and methods for inspection of a specimen |
| CN101427127A (zh) | 2006-04-26 | 2009-05-06 | 夏普株式会社 | 滤色器检测方法、滤色器制造方法和滤色器检测装置 |
| US7549371B2 (en) * | 2006-07-10 | 2009-06-23 | Speedline Technologies, Inc. | Method and apparatus for clamping a substrate |
| KR100892748B1 (ko) * | 2006-09-13 | 2009-04-15 | 에이에스엠엘 마스크툴즈 비.브이. | 피처 피치에 기초하여 패턴 분해를 수행하는 방법 |
| JP2008139027A (ja) * | 2006-11-29 | 2008-06-19 | Sharp Corp | 検査装置、検査方法、撮像検査システム、カラーフィルタの製造方法、検査プログラム |
| US7710611B2 (en) | 2007-02-16 | 2010-05-04 | Illinois Tool Works, Inc. | Single and multi-spectral illumination system and method |
| US7861650B2 (en) * | 2007-04-13 | 2011-01-04 | Illinois Tool Works, Inc. | Method and apparatus for adjusting a substrate support |
| JP5877639B2 (ja) * | 2010-12-27 | 2016-03-08 | 富士機械製造株式会社 | 画像生成装置および画像生成方法 |
| US8939074B2 (en) | 2013-03-12 | 2015-01-27 | Illinois Tool Works Inc. | Color-based linear three dimensional acquisition system and method |
| KR102025184B1 (ko) * | 2013-07-31 | 2019-09-25 | 엘지디스플레이 주식회사 | 데이터 변환 장치 및 이를 이용한 디스플레이 장치 |
| US9370925B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Stencil printer having stencil shuttle assembly |
| US9370924B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Dual action stencil wiper assembly for stencil printer |
| US10723117B2 (en) | 2015-04-07 | 2020-07-28 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
| US10703089B2 (en) | 2015-04-07 | 2020-07-07 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer |
| US9370923B1 (en) | 2015-04-07 | 2016-06-21 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
| US10576566B2 (en) * | 2016-06-06 | 2020-03-03 | International Business Machines Corporation | Solder paste misprint cleaning |
| KR20190084167A (ko) * | 2017-12-21 | 2019-07-16 | 주식회사 고영테크놀러지 | 인쇄 회로 기판 검사 장치, 스크린 프린터의 결함 유형 결정 방법 및 컴퓨터 판독 가능한 기록 매체 |
| CN108960306B (zh) * | 2018-06-22 | 2022-03-04 | 西安电子科技大学 | 基于smt大数据的锡膏检测阈值优化方法 |
| US11033990B2 (en) | 2018-11-29 | 2021-06-15 | Raytheon Company | Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies |
| WO2021144981A1 (ja) * | 2020-01-17 | 2021-07-22 | 株式会社Ｆｕｊｉ | 検査装置及び検査方法 |
| US12056867B2 (en) | 2021-06-17 | 2024-08-06 | Kla Corporation | Image contrast metrics for deriving and improving imaging conditions |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6361110A (ja) * | 1986-05-27 | 1988-03-17 | シンセテイツク ヴイジヨン システムズ インコ−ポレ−テツド | 高速三次元測定方法及び装置 |
| JPH081373B2 (ja) * | 1991-05-28 | 1996-01-10 | エイ・ティ・アンド・ティ・コーポレーション | 反射性のパタンの特質を監視するための検査方法 |
| US5172420A (en) | 1991-05-28 | 1992-12-15 | At&T Bell Laboratories | Method for monitoring the dimensions and other aspects linewidth thickness and discoloration of specular patterns |
| JPH05223532A (ja) | 1991-07-10 | 1993-08-31 | Raytheon Co | 自動視覚検査システム |
| CN1050423C (zh) * | 1993-04-21 | 2000-03-15 | 欧姆龙株式会社 | 目视检查辅助装置及基板检查装置 |
| GB9325243D0 (en) | 1993-12-09 | 1994-02-09 | New Royal Holloway & Bedford | Automatic monitoring system |
| JPH07201946A (ja) * | 1993-12-28 | 1995-08-04 | Hitachi Ltd | 半導体装置等の製造方法及びその装置並びに検査方法及びその装置 |
| DE4410603C1 (de) | 1994-03-26 | 1995-06-14 | Jenoptik Technologie Gmbh | Verfahren zur Erkennung von Fehlern bei der Inspektion von strukturierten Oberflächen |
| JPH0834111A (ja) * | 1994-05-18 | 1996-02-06 | Sanyo Electric Co Ltd | スクリーン印刷機 |
| JPH1056569A (ja) * | 1996-08-07 | 1998-02-24 | Riso Kagaku Corp | 画像処理方法および装置 |
| US6066206A (en) | 1997-02-21 | 2000-05-23 | Speedline Technologies, Inc. | Dual track stenciling system with solder gathering head |
| US5873939A (en) * | 1997-02-21 | 1999-02-23 | Doyle; Dennis G. | Dual track stencil/screen printer |
-
1999
- 1999-05-04 US US09/304,699 patent/US6738505B1/en not_active Expired - Lifetime
-
2000
- 2000-05-03 DE DE60034032T patent/DE60034032T2/de not_active Expired - Lifetime
- 2000-05-03 AU AU46978/00A patent/AU4697800A/en not_active Abandoned
- 2000-05-03 WO PCT/US2000/012121 patent/WO2000067005A1/en not_active Ceased
- 2000-05-03 EP EP00928798A patent/EP1181535B1/en not_active Expired - Lifetime
- 2000-05-03 JP JP2000615594A patent/JP4971543B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US6738505B1 (en) | 2004-05-18 |
| JP4971543B2 (ja) | 2012-07-11 |
| EP1181535A1 (en) | 2002-02-27 |
| WO2000067005A1 (en) | 2000-11-09 |
| EP1181535B1 (en) | 2007-03-21 |
| AU4697800A (en) | 2000-11-17 |
| DE60034032D1 (de) | 2007-05-03 |
| JP2002543421A (ja) | 2002-12-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE60034032T2 (de) | Verfahren und vorrichtung zur kontrolle von lotpastenschichten auf substraten | |
| DE112005000401B4 (de) | Systeme und Verfahren zur Erfassung von Fehlern in aufgedruckter Lötpaste | |
| US7149344B2 (en) | Systems and methods for detecting defects in printed solder paste | |
| DE69711043T2 (de) | Vorrichtung und verfahren zum siebdrucken | |
| DE60209454T2 (de) | Bildbearbeitungsvorrichtung und -verfahren | |
| DE112007000232T5 (de) | Optimales Abbildungssystem und Verfahren für einen Schablonendrucker | |
| DE3805363A1 (de) | Siebdruckverfahren sowie vorrichtung zur durchfuehrung desselben | |
| DE112006002943T5 (de) | Abbildungssystem und Verfahren für einen Schablonendrucker | |
| DE2643809B2 (de) | Verfahren zum Einjustieren eines Körpers | |
| DE102014108367A1 (de) | Reinigungsbaugruppe und Reinigungsverfahren für Pastendrucker | |
| DE102016203392B3 (de) | Bildinspektionsverfahren mit mehreren Kameras | |
| DE60027886T2 (de) | Verfahren und vorrichtung zum montieren von elekronischen bauteilen | |
| DE3928527C2 (enExample) | ||
| DE69429014T2 (de) | Bilderzeugungsgerät | |
| DE60316998T2 (de) | Verfahren zur Erzeugung von Inspektionsdaten zum Drucken | |
| DE19848243A1 (de) | Biegewinkelerfassungssystem | |
| DE112022004457T5 (de) | Gerät zur Haarinspektion auf einem Substrat und Verfahren zur Haarinspektion auf einem Substrat | |
| EP0342318B1 (de) | Automatischer Bildschärfeabgleich von Bildröhren | |
| DE68912900T2 (de) | Verfahren und Gerät zur Inspektion von Schichten. | |
| DE10017836B4 (de) | Druckplattenverarbeitungsvorrichtung und Verfahren zum Ermitteln der Position einer Paßmarkierung auf einer Druckplatte | |
| DE10335312A1 (de) | Erstellen von Testmustern zur Nachkontrolle | |
| AT502069B1 (de) | Verfahren und einrichtung zum prüfen von gegenständen | |
| DE112020007473T5 (de) | Druckqualitätskontrollsystem und Druckqualitätskontrollverfahren | |
| DE112022007713T5 (de) | Assistenzsystem für Druckprozesse | |
| DE112021007882T5 (de) | Erkennungsvorrichtung und Erkennungsverfahren |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |