JP4971543B2 - 基板上の半田ペースト堆積を検査する方法および装置 - Google Patents

基板上の半田ペースト堆積を検査する方法および装置 Download PDF

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Publication number
JP4971543B2
JP4971543B2 JP2000615594A JP2000615594A JP4971543B2 JP 4971543 B2 JP4971543 B2 JP 4971543B2 JP 2000615594 A JP2000615594 A JP 2000615594A JP 2000615594 A JP2000615594 A JP 2000615594A JP 4971543 B2 JP4971543 B2 JP 4971543B2
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Japan
Prior art keywords
image
substrate
solder paste
texture
processor
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Expired - Fee Related
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JP2000615594A
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English (en)
Japanese (ja)
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JP2002543421A5 (enExample
JP2002543421A (ja
Inventor
デイビッド ピー． プリンス，
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スピードライン・テクノロジーズ・インコーポレーテッド
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Publication of JP2002543421A5 publication Critical patent/JP2002543421A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Image Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Analysis (AREA)
JP2000615594A 1999-05-04 2000-05-03 基板上の半田ペースト堆積を検査する方法および装置 Expired - Fee Related JP4971543B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/304,699 1999-05-04
US09/304,699 US6738505B1 (en) 1999-05-04 1999-05-04 Method and apparatus for detecting solder paste deposits on substrates
PCT/US2000/012121 WO2000067005A1 (en) 1999-05-04 2000-05-03 A method and apparatus for inspecting solder paste deposits on substrates

Publications (3)

Publication Number Publication Date
JP2002543421A JP2002543421A (ja) 2002-12-17
JP2002543421A5 JP2002543421A5 (enExample) 2007-06-28
JP4971543B2 true JP4971543B2 (ja) 2012-07-11

Family

ID=23177612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000615594A Expired - Fee Related JP4971543B2 (ja) 1999-05-04 2000-05-03 基板上の半田ペースト堆積を検査する方法および装置

Country Status (6)

Country Link
US (1) US6738505B1 (enExample)
EP (1) EP1181535B1 (enExample)
JP (1) JP4971543B2 (enExample)
AU (1) AU4697800A (enExample)
DE (1) DE60034032T2 (enExample)
WO (1) WO2000067005A1 (enExample)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6891967B2 (en) * 1999-05-04 2005-05-10 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
US7072503B2 (en) * 1999-05-04 2006-07-04 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
JP3661604B2 (ja) * 2001-04-05 2005-06-15 松下電器産業株式会社 顕微観察装置および顕微観察方法
US20020196336A1 (en) * 2001-06-19 2002-12-26 Applied Materials, Inc. Method and apparatus for substrate imaging
US7239399B2 (en) * 2001-11-13 2007-07-03 Cyberoptics Corporation Pick and place machine with component placement inspection
US7813559B2 (en) 2001-11-13 2010-10-12 Cyberoptics Corporation Image analysis for pick and place machines with in situ component placement inspection
US7555831B2 (en) * 2001-11-13 2009-07-07 Cyberoptics Corporation Method of validating component feeder exchanges
KR100421987B1 (ko) * 2001-12-06 2004-03-11 삼성전자주식회사 오차확산 처리방법
US7101508B2 (en) * 2002-07-31 2006-09-05 Agilent Technologies, Inc. Chemical array fabrication errors
US7213738B2 (en) * 2002-09-30 2007-05-08 Speedline Technologies, Inc. Selective wave solder system
DE10311822A1 (de) * 2003-03-13 2004-10-07 Ekra Eduard Kraft Gmbh Maschinenfabrik Verfahren und Vorrichtung zur Kontrolle oder Beeinflussung des Druckprozesses beim Lotpastendruck
US7508973B2 (en) * 2003-03-28 2009-03-24 Hitachi High-Technologies Corporation Method of inspecting defects
GB2403003B (en) * 2003-06-19 2006-06-07 Dek Int Gmbh Inspection system for and method of inspecting deposits printed on workpieces
US7003871B2 (en) * 2003-10-01 2006-02-28 Integrated Ideas & Technologies, Inc. Solder paste stencil manufacturing system
US7559134B2 (en) * 2003-11-04 2009-07-14 Cyberoptics Corporation Pick and place machine with improved component placement inspection
US7706595B2 (en) * 2003-11-07 2010-04-27 Cyberoptics Corporation Pick and place machine with workpiece motion inspection
US20050125993A1 (en) * 2003-11-07 2005-06-16 Madsen David D. Pick and place machine with improved setup and operation procedure
US20060016066A1 (en) * 2004-07-21 2006-01-26 Cyberoptics Corporation Pick and place machine with improved inspection
US20060075631A1 (en) * 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
US20070003126A1 (en) * 2005-05-19 2007-01-04 Case Steven K Method and apparatus for evaluating a component pick action in an electronics assembly machine
WO2007033349A1 (en) * 2005-09-14 2007-03-22 Cyberoptics Corporation Pick and place machine with improved component pick image processing
DE112006003019T5 (de) * 2005-10-31 2008-10-23 Cyberoptics Corp., Golden Valley Elektronikmontagevorrichtung mit eingebauter Lötpastenprüfung
US20070102478A1 (en) 2005-11-10 2007-05-10 Speedline Technologies, Inc. Optimal imaging system and method for a stencil printer
US20070102477A1 (en) 2005-11-10 2007-05-10 Speedline Technologies, Inc. Imaging system and method for a stencil printer
KR100958493B1 (ko) * 2005-12-06 2010-05-17 시바우라 메카트로닉스 가부시키가이샤 면 조잡도 검사 장치
US7458318B2 (en) 2006-02-01 2008-12-02 Speedline Technologies, Inc. Off-axis illumination assembly and method
US9068917B1 (en) * 2006-03-14 2015-06-30 Kla-Tencor Technologies Corp. Systems and methods for inspection of a specimen
CN101427127A (zh) 2006-04-26 2009-05-06 夏普株式会社 滤色器检测方法、滤色器制造方法和滤色器检测装置
US7549371B2 (en) * 2006-07-10 2009-06-23 Speedline Technologies, Inc. Method and apparatus for clamping a substrate
KR100892748B1 (ko) * 2006-09-13 2009-04-15 에이에스엠엘 마스크툴즈 비.브이. 피처 피치에 기초하여 패턴 분해를 수행하는 방법
JP2008139027A (ja) * 2006-11-29 2008-06-19 Sharp Corp 検査装置、検査方法、撮像検査システム、カラーフィルタの製造方法、検査プログラム
US7710611B2 (en) 2007-02-16 2010-05-04 Illinois Tool Works, Inc. Single and multi-spectral illumination system and method
US7861650B2 (en) * 2007-04-13 2011-01-04 Illinois Tool Works, Inc. Method and apparatus for adjusting a substrate support
JP5877639B2 (ja) * 2010-12-27 2016-03-08 富士機械製造株式会社 画像生成装置および画像生成方法
US8939074B2 (en) 2013-03-12 2015-01-27 Illinois Tool Works Inc. Color-based linear three dimensional acquisition system and method
KR102025184B1 (ko) * 2013-07-31 2019-09-25 엘지디스플레이 주식회사 데이터 변환 장치 및 이를 이용한 디스플레이 장치
US9370925B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Stencil printer having stencil shuttle assembly
US9370924B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Dual action stencil wiper assembly for stencil printer
US10723117B2 (en) 2015-04-07 2020-07-28 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10703089B2 (en) 2015-04-07 2020-07-07 Illinois Tool Works Inc. Edge lock assembly for a stencil printer
US9370923B1 (en) 2015-04-07 2016-06-21 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10576566B2 (en) * 2016-06-06 2020-03-03 International Business Machines Corporation Solder paste misprint cleaning
KR20190084167A (ko) * 2017-12-21 2019-07-16 주식회사 고영테크놀러지 인쇄 회로 기판 검사 장치, 스크린 프린터의 결함 유형 결정 방법 및 컴퓨터 판독 가능한 기록 매체
CN108960306B (zh) * 2018-06-22 2022-03-04 西安电子科技大学 基于smt大数据的锡膏检测阈值优化方法
US11033990B2 (en) 2018-11-29 2021-06-15 Raytheon Company Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies
WO2021144981A1 (ja) * 2020-01-17 2021-07-22 株式会社Ｆｕｊｉ 検査装置及び検査方法
US12056867B2 (en) 2021-06-17 2024-08-06 Kla Corporation Image contrast metrics for deriving and improving imaging conditions

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6361110A (ja) * 1986-05-27 1988-03-17 シンセテイツク　ヴイジヨン　システムズ　インコ−ポレ−テツド 高速三次元測定方法及び装置
JPH081373B2 (ja) * 1991-05-28 1996-01-10 エイ・ティ・アンド・ティ・コーポレーション 反射性のパタンの特質を監視するための検査方法
US5172420A (en) 1991-05-28 1992-12-15 At&T Bell Laboratories Method for monitoring the dimensions and other aspects linewidth thickness and discoloration of specular patterns
JPH05223532A (ja) 1991-07-10 1993-08-31 Raytheon Co 自動視覚検査システム
CN1050423C (zh) * 1993-04-21 2000-03-15 欧姆龙株式会社 目视检查辅助装置及基板检查装置
GB9325243D0 (en) 1993-12-09 1994-02-09 New Royal Holloway & Bedford Automatic monitoring system
JPH07201946A (ja) * 1993-12-28 1995-08-04 Hitachi Ltd 半導体装置等の製造方法及びその装置並びに検査方法及びその装置
DE4410603C1 (de) 1994-03-26 1995-06-14 Jenoptik Technologie Gmbh Verfahren zur Erkennung von Fehlern bei der Inspektion von strukturierten Oberflächen
JPH0834111A (ja) * 1994-05-18 1996-02-06 Sanyo Electric Co Ltd スクリーン印刷機
JPH1056569A (ja) * 1996-08-07 1998-02-24 Riso Kagaku Corp 画像処理方法および装置
US6066206A (en) 1997-02-21 2000-05-23 Speedline Technologies, Inc. Dual track stenciling system with solder gathering head
US5873939A (en) * 1997-02-21 1999-02-23 Doyle; Dennis G. Dual track stencil/screen printer

Also Published As

Publication number Publication date
US6738505B1 (en) 2004-05-18
EP1181535A1 (en) 2002-02-27
WO2000067005A1 (en) 2000-11-09
EP1181535B1 (en) 2007-03-21
AU4697800A (en) 2000-11-17
DE60034032D1 (de) 2007-05-03
DE60034032T2 (de) 2007-12-13
JP2002543421A (ja) 2002-12-17

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