DE60030208T8 - Waferinspektionsvorrichtung - Google Patents

Waferinspektionsvorrichtung Download PDF

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Publication number
DE60030208T8
DE60030208T8 DE60030208T DE60030208T DE60030208T8 DE 60030208 T8 DE60030208 T8 DE 60030208T8 DE 60030208 T DE60030208 T DE 60030208T DE 60030208 T DE60030208 T DE 60030208T DE 60030208 T8 DE60030208 T8 DE 60030208T8
Authority
DE
Germany
Prior art keywords
inspection device
wafer inspection
wafer
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE60030208T
Other languages
English (en)
Other versions
DE60030208D1 (de
DE60030208T2 (de
Inventor
Naoya Shinagawa Eguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of DE60030208D1 publication Critical patent/DE60030208D1/de
Application granted granted Critical
Publication of DE60030208T2 publication Critical patent/DE60030208T2/de
Publication of DE60030208T8 publication Critical patent/DE60030208T8/de
Active legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
DE60030208T 1999-06-10 2000-06-08 Waferinspektionsvorrichtung Active DE60030208T8 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16444899A JP4332933B2 (ja) 1999-06-10 1999-06-10 検査装置
JP16444899 1999-06-10

Publications (3)

Publication Number Publication Date
DE60030208D1 DE60030208D1 (de) 2006-10-05
DE60030208T2 DE60030208T2 (de) 2007-08-09
DE60030208T8 true DE60030208T8 (de) 2007-11-22

Family

ID=15793372

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60030208T Active DE60030208T8 (de) 1999-06-10 2000-06-08 Waferinspektionsvorrichtung

Country Status (6)

Country Link
US (1) US6937754B1 (de)
EP (1) EP1061359B1 (de)
JP (1) JP4332933B2 (de)
KR (1) KR100709156B1 (de)
DE (1) DE60030208T8 (de)
TW (1) TW434398B (de)

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US6956644B2 (en) * 1997-09-19 2005-10-18 Kla-Tencor Technologies Corporation Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination
DE10025751A1 (de) * 2000-05-24 2001-12-06 Atg Test Systems Gmbh Verfahren zum Untersuchen einer leiterplatte an einem vorbestimmten Bereich der Leiterplatte und Vorrichtung zum Durchführen des Verfahrens
WO2002001596A1 (en) 2000-06-27 2002-01-03 Ebara Corporation Charged particle beam inspection apparatus and method for fabricating device using that inspection apparatus
WO2002045153A1 (en) 2000-12-01 2002-06-06 Ebara Corporation Inspection method and apparatus using electron beam, and device production method using it
KR20020053621A (ko) * 2000-12-27 2002-07-05 이 창 세 웨이퍼 표면의 미세 결함 측정 장치
US6635872B2 (en) * 2001-04-05 2003-10-21 Applied Materials, Inc. Defect inspection efficiency improvement with in-situ statistical analysis of defect data during inspection
JP2003066341A (ja) * 2001-08-28 2003-03-05 Nec Corp レチクル検査装置
WO2003096387A2 (en) 2002-05-08 2003-11-20 Phoseon Technology, Inc. High efficiency solid-state light source and methods of use and manufacture
US6959251B2 (en) * 2002-08-23 2005-10-25 Kla-Tencor Technologies, Corporation Inspection system setup techniques
JP4121849B2 (ja) * 2002-12-26 2008-07-23 オリンパス株式会社 欠陥検査装置及び欠陥検査方法
JP4049723B2 (ja) * 2003-09-04 2008-02-20 沖電気工業株式会社 窒化物半導体素子の製造方法及び窒化物半導体素子の製造装置
EP2256487B1 (de) * 2003-09-04 2019-11-06 KLA-Tencor Corporation Verfahren zur Prüfung einer Probe mit verschiedenen Prüfparametern
US7524085B2 (en) * 2003-10-31 2009-04-28 Phoseon Technology, Inc. Series wiring of highly reliable light sources
US7819550B2 (en) * 2003-10-31 2010-10-26 Phoseon Technology, Inc. Collection optics for led array with offset hemispherical or faceted surfaces
EP1735844B1 (de) 2004-03-18 2019-06-19 Phoseon Technology, Inc. Verwendung eines hochdichten leuchtdioden-arrays mit mikro-reflektoren für aushärtungsverfahren
WO2005100961A2 (en) * 2004-04-19 2005-10-27 Phoseon Technology, Inc. Imaging semiconductor strucutures using solid state illumination
TWI352645B (en) * 2004-05-28 2011-11-21 Ebara Corp Apparatus for inspecting and polishing substrate r
US7650028B1 (en) * 2004-10-26 2010-01-19 Sandia Corporation Vicinal light inspection of translucent materials
US9281001B2 (en) * 2004-11-08 2016-03-08 Phoseon Technology, Inc. Methods and systems relating to light sources for use in industrial processes
US7554656B2 (en) 2005-10-06 2009-06-30 Kla-Tencor Technologies Corp. Methods and systems for inspection of a wafer
JP2007113992A (ja) * 2005-10-19 2007-05-10 Renesas Technology Corp プロービング装置
US7642527B2 (en) * 2005-12-30 2010-01-05 Phoseon Technology, Inc. Multi-attribute light effects for use in curing and other applications involving photoreactions and processing
JP2007258293A (ja) * 2006-03-22 2007-10-04 Fuji Electric Holdings Co Ltd はんだ濡れ性評価装置およびはんだ濡れ性評価方法
US7541572B2 (en) * 2006-10-23 2009-06-02 Emhart Glass S.A. Machine for inspecting rotating glass containers with light source triggered multiple times during camera exposure time
US20100295939A1 (en) * 2008-01-28 2010-11-25 Innovative Imaging, Inc Table gauge
CN101493425B (zh) * 2008-10-31 2011-07-20 东莞康视达自动化科技有限公司 微观表面缺陷全自动紫外光学检测方法及其系统
CN102538674B (zh) * 2011-12-23 2014-10-15 中国科学院长春光学精密机械与物理研究所 挂弹车实时对准测量装置
CN102519360B (zh) * 2011-12-23 2014-07-09 中国科学院长春光学精密机械与物理研究所 一种全自动挂弹车对准测量装置
US8896827B2 (en) 2012-06-26 2014-11-25 Kla-Tencor Corporation Diode laser based broad band light sources for wafer inspection tools
KR101555580B1 (ko) * 2014-08-12 2015-09-24 주식회사 에이피에스 대면적 평면 검사 장치
KR101660481B1 (ko) * 2016-01-29 2016-09-27 최봉석 압축링의 전후면 판별을 위한 비젼 검사방법 및 장치
JP6321703B2 (ja) * 2016-03-04 2018-05-09 ファナック株式会社 ワイヤ放電加工機の検査システム
KR102492053B1 (ko) 2017-08-23 2023-01-25 삼성전자주식회사 반도체 제조 장치 및 이를 이용한 반도체 장치 제조 방법
US10732424B2 (en) 2018-02-15 2020-08-04 Kla Corporation Inspection-beam shaping on a sample surface at an oblique angle of incidence
TWI825608B (zh) * 2022-03-04 2023-12-11 江政慶 異常檢測系統及異常檢測方法

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US4514858A (en) * 1983-03-15 1985-04-30 Micronix Partners Lithography system
IL96541A (en) * 1990-12-04 2000-08-13 Orbot Instr Ltd Apparatus and method for microscopic inspection of articles
JP3309430B2 (ja) * 1992-07-28 2002-07-29 ソニー株式会社 レーザ光発生装置
US5479252A (en) * 1993-06-17 1995-12-26 Ultrapointe Corporation Laser imaging system for inspection and analysis of sub-micron particles
KR950009292A (ko) * 1993-09-29 1995-04-21 유모토 다이죠 공초점형 광학현미경 및 이 현미경을 사용한 측정장치
US5774222A (en) * 1994-10-07 1998-06-30 Hitachi, Ltd. Manufacturing method of semiconductor substrative and method and apparatus for inspecting defects of patterns on an object to be inspected
US5761336A (en) * 1996-01-16 1998-06-02 Ultrapointe Corporation Aperture optimization method providing improved defect detection and characterization
US5742626A (en) * 1996-08-14 1998-04-21 Aculight Corporation Ultraviolet solid state laser, method of using same and laser surgery apparatus
US6381356B1 (en) * 1996-10-23 2002-04-30 Nec Corporation Method and apparatus for inspecting high-precision patterns
US5912735A (en) * 1997-07-29 1999-06-15 Kla-Tencor Corporation Laser/white light viewing laser imaging system
KR100278291B1 (ko) * 1998-11-11 2001-01-15 이계철 이동통신시스템에서의 시스템 데이터 처리방법 및 그를 이용한진단장치
JP4258058B2 (ja) * 1999-03-23 2009-04-30 ソニー株式会社 円盤状記録媒体の検査装置及び検査方法

Also Published As

Publication number Publication date
US6937754B1 (en) 2005-08-30
EP1061359B1 (de) 2006-08-23
JP4332933B2 (ja) 2009-09-16
EP1061359A3 (de) 2002-04-03
DE60030208D1 (de) 2006-10-05
KR100709156B1 (ko) 2007-04-19
EP1061359A2 (de) 2000-12-20
TW434398B (en) 2001-05-16
JP2000352507A (ja) 2000-12-19
KR20010007337A (ko) 2001-01-26
DE60030208T2 (de) 2007-08-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8381 Inventor (new situation)

Inventor name: EGUCHI, NAOYA, SHINAGAWA, TOKYO, JP