DE60029376D1 - Verfahren zur Regenerierung und Entfernung von Kupfer aus einer Lösung - Google Patents

Verfahren zur Regenerierung und Entfernung von Kupfer aus einer Lösung

Info

Publication number
DE60029376D1
DE60029376D1 DE60029376T DE60029376T DE60029376D1 DE 60029376 D1 DE60029376 D1 DE 60029376D1 DE 60029376 T DE60029376 T DE 60029376T DE 60029376 T DE60029376 T DE 60029376T DE 60029376 D1 DE60029376 D1 DE 60029376D1
Authority
DE
Germany
Prior art keywords
regeneration
copper
removal
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60029376T
Other languages
English (en)
Inventor
Martin Goosey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Rohm and Haas Electronic Materials LLC
Original Assignee
Shipley Co Inc
Shipley Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc, Shipley Co LLC filed Critical Shipley Co Inc
Application granted granted Critical
Publication of DE60029376D1 publication Critical patent/DE60029376D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
    • C22B3/20—Treatment or purification of solutions, e.g. obtained by leaching
    • C22B3/22—Treatment or purification of solutions, e.g. obtained by leaching by physical processes, e.g. by filtration, by magnetic means, or by thermal decomposition
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00—Obtaining copper
    • C22B15/0063—Hydrometallurgy
    • C22B15/0084—Treating solutions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Geology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
DE60029376T 1999-04-07 2000-04-06 Verfahren zur Regenerierung und Entfernung von Kupfer aus einer Lösung Expired - Lifetime DE60029376D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9907848.7A GB9907848D0 (en) 1999-04-07 1999-04-07 Processes and apparatus for removal of copper from fluids

Publications (1)

Publication Number Publication Date
DE60029376D1 true DE60029376D1 (de) 2006-08-31

Family

ID=10851028

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60029376T Expired - Lifetime DE60029376D1 (de) 1999-04-07 2000-04-06 Verfahren zur Regenerierung und Entfernung von Kupfer aus einer Lösung

Country Status (9)

Country Link
US (1) US6391188B1 (de)
EP (1) EP1043408B1 (de)
JP (1) JP2000317458A (de)
KR (1) KR20010020719A (de)
CN (1) CN1240879C (de)
DE (1) DE60029376D1 (de)
GB (1) GB9907848D0 (de)
SG (1) SG104920A1 (de)
TW (1) TW495379B (de)

Families Citing this family (48)

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US8475636B2 (en) 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US8308931B2 (en) * 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
US6527920B1 (en) 2000-05-10 2003-03-04 Novellus Systems, Inc. Copper electroplating apparatus
US7622024B1 (en) 2000-05-10 2009-11-24 Novellus Systems, Inc. High resistance ionic current source
US6821407B1 (en) 2000-05-10 2004-11-23 Novellus Systems, Inc. Anode and anode chamber for copper electroplating
GB0025990D0 (en) * 2000-10-24 2000-12-13 Shipley Co Llc Plating catalysts and electronic packaging substrates plated therewith
AU2002951283A0 (en) * 2002-09-09 2002-09-19 Occtech Engineering Pty Ltd Process and apparatus for recovery of cynanide and metals
GB0318017D0 (en) * 2003-08-01 2003-09-03 Shipley Co Llc Methods for recovering metals
CN1584129B (zh) * 2003-08-20 2010-11-24 李德良 从含铜废液中分离铜的方法
US7972970B2 (en) 2003-10-20 2011-07-05 Novellus Systems, Inc. Fabrication of semiconductor interconnect structure
US8372757B2 (en) 2003-10-20 2013-02-12 Novellus Systems, Inc. Wet etching methods for copper removal and planarization in semiconductor processing
US8158532B2 (en) * 2003-10-20 2012-04-17 Novellus Systems, Inc. Topography reduction and control by selective accelerator removal
US8530359B2 (en) 2003-10-20 2013-09-10 Novellus Systems, Inc. Modulated metal removal using localized wet etching
US7444838B2 (en) * 2003-10-30 2008-11-04 Virginia Tech Intellectual Properties, Inc. Holey optical fiber with random pattern of holes and method for making same
US8623193B1 (en) 2004-06-16 2014-01-07 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
JP4632350B2 (ja) * 2004-12-02 2011-02-16 ミヨシ油脂株式会社 水産加工残滓中の重金属除去方法
JP2006341213A (ja) * 2005-06-10 2006-12-21 Es Adviser:Kk 無電解銅めっき廃液の電解処理装置及びその電解処理方法
US7605082B1 (en) 2005-10-13 2009-10-20 Novellus Systems, Inc. Capping before barrier-removal IC fabrication method
SE531697C2 (sv) * 2007-07-11 2009-07-07 Sigma Engineering Ab Etsnings- och återvinningsförfarande
US8475637B2 (en) * 2008-12-17 2013-07-02 Novellus Systems, Inc. Electroplating apparatus with vented electrolyte manifold
US8262871B1 (en) 2008-12-19 2012-09-11 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
CN102127766A (zh) * 2009-07-15 2011-07-20 深圳市惠尔能科技有限公司 电路板微蚀废液再生循环工艺
KR20120080595A (ko) * 2009-09-02 2012-07-17 노벨러스 시스템즈, 인코포레이티드 감소된 등방성 에칭제 물질 소비 및 폐기물 발생
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
JP5911145B2 (ja) * 2010-12-03 2016-04-27 株式会社Ｊｃｕ エッチング液の維持管理方法
US8961770B2 (en) 2011-10-27 2015-02-24 Pentair Residential Filtration, Llc Controller and method of operation of a capacitive deionization system
US9695070B2 (en) 2011-10-27 2017-07-04 Pentair Residential Filtration, Llc Regeneration of a capacitive deionization system
US9637397B2 (en) 2011-10-27 2017-05-02 Pentair Residential Filtration, Llc Ion removal using a capacitive deionization system
US9010361B2 (en) 2011-10-27 2015-04-21 Pentair Residential Filtration, Llc Control valve assembly
US8671985B2 (en) 2011-10-27 2014-03-18 Pentair Residential Filtration, Llc Control valve assembly
CN102534657A (zh) * 2012-02-17 2012-07-04 重庆重冶铜业有限公司 一种阴极铜生产中电解废液的处理方法
US9670588B2 (en) 2013-05-01 2017-06-06 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
US9677190B2 (en) 2013-11-01 2017-06-13 Lam Research Corporation Membrane design for reducing defects in electroplating systems
CN104152944B (zh) * 2014-07-02 2017-04-26 深圳市新锐思环保科技有限公司 酸性蚀刻液电解多组分添加剂
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
CN104724795B (zh) * 2015-03-23 2017-11-10 轻工业环境保护研究所 一种处理含镍废水的电化学处理系统和电化学方法
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
TWI705159B (zh) * 2015-09-30 2020-09-21 日商三菱綜合材料股份有限公司 高純度銅電解精煉用添加劑、高純度銅之製造方法、及高純度電解銅
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
CN110344058A (zh) * 2019-07-08 2019-10-18 深圳市华星光电技术有限公司 提高刻蚀液使用寿命的方法及金属导线刻蚀装置
CN113387494A (zh) * 2021-06-10 2021-09-14 深圳星河环境股份有限公司 一种基于有机物去除精制硫酸铜的方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3737381A (en) * 1967-12-18 1973-06-05 Mutual Mining And Refining Ltd Apparatus for treating copper ores
BE789944A (fr) * 1971-10-12 1973-02-01 Shipley Co Regeneration d'une solution usagee d'attaque du cuivre
US4073708A (en) * 1976-06-18 1978-02-14 The Boeing Company Apparatus and method for regeneration of chromosulfuric acid etchants
JPS55145176A (en) * 1979-04-28 1980-11-12 Kagaku Gijutsu Shinkoukai Regeneration of copper chloride etching waste solution by electrolysis and recovering method of copper
GB2133806B (en) * 1983-01-20 1986-06-04 Electricity Council Regenerating solutions for etching copper
JPS60128271A (ja) * 1983-12-15 1985-07-09 Tsurumi Soda Kk 金属銅及び塩素の製造方法
US4684453A (en) * 1984-10-26 1987-08-04 Vaughan Daniel J Purification of dye baths
FR2703676B1 (fr) * 1993-04-05 1995-06-23 Electricite De France Procédé et dispositif de décontamination d'effluents liquides contenant des métaux sous forme ionique .
DE4326854A1 (de) * 1993-08-11 1995-02-16 Heraeus Elektrochemie Verfahren zur Regenerierung einer Metallionen und Schwefelsäure enthaltenden wässrigen Lösung sowie Vorrchtung
US5667557A (en) * 1994-03-25 1997-09-16 E. I. Du Pont De Nemours And Company Hydrometallurgical extraction and recovery of copper, gold, and silver via cyanidation and electrowinning
JPH11229172A (ja) * 1998-02-16 1999-08-24 Permelec Electrode Ltd 高純度銅の製造方法及び製造装置

Also Published As

Publication number Publication date
EP1043408A2 (de) 2000-10-11
SG104920A1 (en) 2004-07-30
EP1043408B1 (de) 2006-07-19
US6391188B1 (en) 2002-05-21
JP2000317458A (ja) 2000-11-21
GB9907848D0 (en) 1999-06-02
EP1043408A3 (de) 2001-01-10
CN1278564A (zh) 2001-01-03
KR20010020719A (ko) 2001-03-15
TW495379B (en) 2002-07-21
CN1240879C (zh) 2006-02-08

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Legal Events

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8332 No legal effect for de