DE50100847D1 - Thermoelektrisches element - Google Patents

Thermoelektrisches element

Info

Publication number
DE50100847D1
DE50100847D1 DE50100847T DE50100847T DE50100847D1 DE 50100847 D1 DE50100847 D1 DE 50100847D1 DE 50100847 T DE50100847 T DE 50100847T DE 50100847 T DE50100847 T DE 50100847T DE 50100847 D1 DE50100847 D1 DE 50100847D1
Authority
DE
Germany
Prior art keywords
thermoelectric element
thermoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50100847T
Other languages
German (de)
English (en)
Inventor
Gerhard Span
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of DE50100847D1 publication Critical patent/DE50100847D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/8556—Thermoelectric active materials comprising inorganic compositions comprising compounds containing germanium or silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/93—Thermoelectric, e.g. peltier effect cooling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE50100847T 2000-05-02 2001-04-25 Thermoelektrisches element Expired - Lifetime DE50100847D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT0076300A AT410492B (de) 2000-05-02 2000-05-02 Thermoelektrisches element mit mindestens einer n-schicht und mindestens einer p-schicht
PCT/AT2001/000123 WO2001084641A1 (de) 2000-05-02 2001-04-25 Thermoelektrisches element

Publications (1)

Publication Number Publication Date
DE50100847D1 true DE50100847D1 (de) 2003-11-27

Family

ID=3680572

Family Applications (1)

Application Number Title Priority Date Filing Date
DE50100847T Expired - Lifetime DE50100847D1 (de) 2000-05-02 2001-04-25 Thermoelektrisches element

Country Status (10)

Country Link
US (1) US6762484B2 (https=)
EP (1) EP1287566B1 (https=)
JP (1) JP3921602B2 (https=)
KR (1) KR100581978B1 (https=)
CN (1) CN100352073C (https=)
AT (1) AT410492B (https=)
AU (1) AU2001250149A1 (https=)
DE (1) DE50100847D1 (https=)
RU (1) RU2248647C2 (https=)
WO (1) WO2001084641A1 (https=)

Families Citing this family (35)

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US6828579B2 (en) * 2001-12-12 2004-12-07 Hi-Z Technology, Inc. Thermoelectric device with Si/SiC superlattice N-legs
US7038234B2 (en) * 2001-12-12 2006-05-02 Hi-Z Technology, Inc. Thermoelectric module with Si/SiGe and B4C/B9C super-lattice legs
WO2006005126A1 (en) * 2004-07-12 2006-01-19 Newsouth Innovations Pty Limited Reversible thermoelectric nanomaterials
EP4704539A1 (en) 2024-08-27 2026-03-04 Nikolay Iosad Thermoelectric elements, thermoelectric modules, and methods for manufacturing thereof
US20060048809A1 (en) * 2004-09-09 2006-03-09 Onvural O R Thermoelectric devices with controlled current flow and related methods
US20060090787A1 (en) * 2004-10-28 2006-05-04 Onvural O R Thermoelectric alternators and thermoelectric climate control devices with controlled current flow for motor vehicles
DE102005036407A1 (de) * 2005-07-29 2007-02-01 Endress + Hauser Wetzer Gmbh + Co. Kg Auswerteeinheit für kontinuierliche Thermoelemente
US20080017238A1 (en) * 2006-07-21 2008-01-24 Caterpillar Inc. Thermoelectric device
AT505168B1 (de) * 2007-06-29 2008-11-15 Span Gerhard Dipl Ing Dr Thermoelektrisches element
US8283553B1 (en) 2007-09-21 2012-10-09 Hrl Laboratories, Llc Photon enhanced thermoelectric power generation
DE102007050741A1 (de) 2007-10-22 2009-04-23 O-Flexx Technologies Gmbh Thermoelektrischer Generator
DE102008032856A1 (de) 2008-07-14 2010-01-28 O-Flexx Technologies Gmbh Wärmeüberträger für ein thermoelektrisches Dünnschichtelement
DE102009032906A1 (de) * 2009-07-10 2011-01-20 O-Flexx Technologies Gmbh Modul mit mehreren thermoelektrischen Elementen
JP5560610B2 (ja) * 2009-08-26 2014-07-30 富士通株式会社 発電装置及びそのような発電装置を備えた発電システム
DE102009048985A1 (de) 2009-10-09 2011-04-21 O-Flexx Technologies Gmbh Modul mit mehreren thermoelektrischen Elementen
DE102010005340A1 (de) 2010-01-21 2011-07-28 O-Flexx Technologies GmbH, 47228 Verfahren und Vorrichtung zur Strukturierung einer auf einem Substrat angeordneten Lage
KR101701349B1 (ko) * 2010-06-10 2017-02-01 엘지이노텍 주식회사 냉각전용 열전소자 및 그 제조 방법
WO2012006301A1 (en) * 2010-07-07 2012-01-12 Dynamic Connections, Llc Renewable energy extraction
FR2963165A1 (fr) * 2010-07-22 2012-01-27 St Microelectronics Crolles 2 Procede de generation d'energie electrique dans un dispositif semi-conducteur, et dispositif correspondant
FR2968134B1 (fr) 2010-11-26 2013-05-17 Schneider Electric Ind Sas Module thermoélectrique a rendement amélioré
RU2444814C1 (ru) * 2011-03-29 2012-03-10 Юрий Феликсович Верниковский Термоэлектрический кластер, способ его работы, устройство соединения в нем активного элемента с теплоэлектропроводом, генератор (варианты) и тепловой насос (варианты) на его основе
DE102011001653A1 (de) * 2011-03-30 2012-10-04 O-Flexx Technologies Gmbh Thermoelektrische Anordnung
CN102779936A (zh) * 2011-05-12 2012-11-14 冯建明 Pn结四极管式热电转换和制冷制热装置
RU2477828C1 (ru) * 2011-10-25 2013-03-20 Святослав Михайлович Сергеев Тепловой диод
DE102012209619A1 (de) 2012-06-08 2013-12-12 Robert Bosch Gmbh Thermoelektrisches Element zur Umwandlung von Energie zwischen thermischer Energie und elektrischer Energie und ein Verfahren zum Auseinanderbauen des thermoelektrischen Elements
US9627601B2 (en) 2013-01-24 2017-04-18 O-Flexx Technologies Gmbh Thermoelectric element and method for the production thereof
WO2014114559A1 (de) 2013-01-24 2014-07-31 O-Flexx Technologies Gmbh Thermoelektrisches bauteil, verfahren zu dessen herstellung und thermoelektrischer generator
RU2576414C2 (ru) * 2014-05-21 2016-03-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Курганский государственный университет" Охлаждающее устройство
CN106876569B (zh) * 2015-12-10 2019-04-23 廖建能 热电模块
WO2018022922A1 (en) * 2016-07-27 2018-02-01 Novus Energy Technologies, Inc. Thermoelectric heat pump system
US12181351B2 (en) 2018-02-28 2024-12-31 Arthur Beckman Thermopile assembly providing a massive electrical series of wire thermocouple elements
JP2020088028A (ja) * 2018-11-19 2020-06-04 トヨタ自動車株式会社 熱電変換素子、熱電変換システム、及びそれらを用いる発電方法
UA120025C2 (uk) 2019-03-26 2019-09-10 Андрій Дмитрович Хворостяний Напівпровідниковий термоелектричний генератор
DE102021209656B3 (de) 2021-09-02 2022-09-29 Nikolay Iosad Thermoelektrisches Element, thermoelektrischer Generator und Verfahren zu deren Herstellung
DE102023104908A1 (de) 2023-02-28 2024-08-29 Nikolay Iosad Thermoelektrische Elemente, thermoelektrische Module und Verfahren zu deren Herstellung

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US2981775A (en) * 1958-11-12 1961-04-25 Steatite Res Corp Oxide thermocouple device
US3564860A (en) * 1966-10-13 1971-02-23 Borg Warner Thermoelectric elements utilizing distributed peltier effect
IT1042975B (it) * 1975-09-30 1980-01-30 Snam Progetti Metodo per la costruzione di un modulo termoelettrico e modulo cosi ottenuto
JPS571276A (en) * 1980-06-02 1982-01-06 Tdk Corp Thermoelectric element and manufacture thereof
JPS57169283A (en) * 1981-04-11 1982-10-18 Tdk Corp Thermoelectric element
JPS59980A (ja) * 1982-06-26 1984-01-06 Tdk Corp 熱電素子
DE3315960A1 (de) * 1983-05-02 1984-11-08 Bschorr, Oskar, Dipl.-Ing. Dr.rer.nat., 8000 München Erzeugung von spannungsdifferenzen
FR2598803B1 (fr) * 1986-05-16 1988-09-02 Anvar Dispositif pour mesurer l'intensite d'un flux radiatif
JPH01208876A (ja) * 1988-02-17 1989-08-22 Matsushita Electric Ind Co Ltd 熱電装置とその製造方法
EP0369670A3 (en) * 1988-11-18 1992-06-03 Aspden, Harold Dr. Thermoelectric energy conversion
US5009717A (en) * 1989-07-18 1991-04-23 Mitsubishi Metal Corporation Thermoelectric element and method of manufacturing same
JPH0463481A (ja) * 1990-03-08 1992-02-28 Mitsubishi Materials Corp 絶縁被覆型熱発電素子及びその製造法
GB2267995B (en) * 1992-06-17 1995-11-08 Harold Aspden Thermoelectric heat transfer apparatus
JPH0738158A (ja) * 1993-07-16 1995-02-07 Vacuum Metallurgical Co Ltd 一体化焼結型シリコンゲルマニウム熱電変換素子及びその製造法
US5834828A (en) * 1993-09-20 1998-11-10 The United States Of America, As Represented By The Secretary Of The Army Nanoporous semiconductor material and fabrication technique for use as thermoelectric elements
GB2283361B (en) * 1993-10-12 1997-04-16 Harold Aspden Refrigeration and electrical power generation
US5644184A (en) * 1996-02-15 1997-07-01 Thermodyne, Inc. Piezo-pyroelectric energy converter and method
JP3642885B2 (ja) 1996-06-28 2005-04-27 ジャパンゴアテックス株式会社 Ｉｃチップ実装用インターポーザ及びｉｃチップパッケージ
JPH1022531A (ja) * 1996-07-01 1998-01-23 Sumitomo Special Metals Co Ltd 熱電変換素子
JPH1022530A (ja) * 1996-07-01 1998-01-23 Sumitomo Special Metals Co Ltd 熱電変換素子
JPH10144969A (ja) * 1996-11-08 1998-05-29 Sumitomo Special Metals Co Ltd 熱電変換素子
AU6783598A (en) * 1997-03-31 1998-10-22 Research Triangle Institute Thin-film thermoelectric device and fabrication method of same
JP4285665B2 (ja) * 1997-12-27 2009-06-24 日立金属株式会社 熱電変換素子
JPH11195817A (ja) * 1997-12-27 1999-07-21 Sumitomo Special Metals Co Ltd 熱電変換素子

Also Published As

Publication number Publication date
CN100352073C (zh) 2007-11-28
WO2001084641A1 (de) 2001-11-08
AU2001250149A1 (en) 2001-11-12
JP2003533031A (ja) 2003-11-05
ATA7632000A (de) 2002-09-15
CN1441972A (zh) 2003-09-10
JP3921602B2 (ja) 2007-05-30
RU2248647C2 (ru) 2005-03-20
US20030042497A1 (en) 2003-03-06
KR100581978B1 (ko) 2006-05-23
EP1287566B1 (de) 2003-10-22
US6762484B2 (en) 2004-07-13
EP1287566A1 (de) 2003-03-05
AT410492B (de) 2003-05-26
KR20020093070A (ko) 2002-12-12

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