DE4480216T1 - Vorrichtung zum automatischen Bestücken einer Halterung mit Sonden - Google Patents

Vorrichtung zum automatischen Bestücken einer Halterung mit Sonden

Info

Publication number
DE4480216T1
DE4480216T1 DE4480216T DE4480216T DE4480216T1 DE 4480216 T1 DE4480216 T1 DE 4480216T1 DE 4480216 T DE4480216 T DE 4480216T DE 4480216 T DE4480216 T DE 4480216T DE 4480216 T1 DE4480216 T1 DE 4480216T1
Authority
DE
Germany
Prior art keywords
probes
holder
automatically loading
loading
automatically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4480216T
Other languages
English (en)
Inventor
Joseph M Creeden
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Methode Electronics Inc
Original Assignee
Methode Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Methode Electronics Inc filed Critical Methode Electronics Inc
Publication of DE4480216T1 publication Critical patent/DE4480216T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
DE4480216T 1993-12-22 1994-12-21 Vorrichtung zum automatischen Bestücken einer Halterung mit Sonden Withdrawn DE4480216T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/172,034 US5453702A (en) 1993-12-22 1993-12-22 Automatic probe fixture loading apparatus with gimballing compensation
PCT/US1994/014752 WO1995017681A1 (en) 1993-12-22 1994-12-21 Automatic probe fixture loading apparatus with gimballing compensation

Publications (1)

Publication Number Publication Date
DE4480216T1 true DE4480216T1 (de) 1997-07-31

Family

ID=22626096

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4480216T Withdrawn DE4480216T1 (de) 1993-12-22 1994-12-21 Vorrichtung zum automatischen Bestücken einer Halterung mit Sonden

Country Status (3)

Country Link
US (1) US5453702A (de)
DE (1) DE4480216T1 (de)
WO (1) WO1995017681A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5939892A (en) * 1996-04-12 1999-08-17 Methode Electronics, Inc. Circuit board testing fixture
US5841292A (en) * 1997-03-04 1998-11-24 Star Technology Group, Inc. Automated test pin loading apparatus
US6127832A (en) * 1998-01-06 2000-10-03 International Business Machines Corporation Electrical test tool having easily replaceable electrical probe
US6325078B2 (en) 1998-01-07 2001-12-04 Qc Solutions, Inc., Apparatus and method for rapid photo-thermal surface treatment
AU2003212410A1 (en) 2002-02-26 2003-09-09 Ciphergen Biosystems, Inc. Device and methods for automating transfer of multiple samples to an analytical instrument
EP2237052A1 (de) * 2009-03-31 2010-10-06 Capres A/S Automatisierte Mehrpunktsondenmanipulation

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2344239B2 (de) * 1973-09-01 1977-11-03 Luther, Erich, 3050 Wunstorf; Maelzer, Fritz; Maelzer, Martin; 7910 Reutti Post Neu-Ulm; Türkkan, Tamer, 3011 Laatzen Kontaktvorrichtung zum anschliessen einer gedruckten schaltung an ein pruefgeraet
DE2812976C2 (de) * 1978-03-23 1980-03-06 Erich Ing.(Grad.) 3003 Ronnenberg Luther Verfahren zur Feststellung des Versatzes zwischen Leiterbahnen und Kontaktlöchern bei einer Leiterplatte sowie eine Leiterplatte zur Verwendung in diesem Verfahren
DE2814954C2 (de) * 1978-04-06 1984-05-24 Erich Ing.(Grad.) 3003 Ronnenberg Luther Vorrichtung zum Vereinzeln von Leiterplatten aus einem Plattenmagazin
DE2814955C2 (de) * 1978-04-06 1983-05-05 Erich Ing.(Grad.) Luther Vorrichtung zum Sortieren geprüfter Leiterplatten bei einem Leiterplattenprüfgerät
US4352061A (en) * 1979-05-24 1982-09-28 Fairchild Camera & Instrument Corp. Universal test fixture employing interchangeable wired personalizers
DE3013215A1 (de) * 1980-04-03 1981-10-15 Luther & Maelzer Gmbh, 3050 Wunstorf Adapter fuer ein selbstprogrammierbares leiterplattenpruefgeraet
US4535536A (en) * 1983-11-03 1985-08-20 Augat Inc. Method of assembling adaptor for automatic testing equipment
US4749943A (en) * 1984-06-11 1988-06-07 Thomas Black Automatic test system
US5247246A (en) * 1987-04-17 1993-09-21 Everett Charles Technologies, Inc. Testing of integrated circuit devices on loaded printed circuit boards
US4803424A (en) * 1987-08-31 1989-02-07 Augat Inc. Short-wire bed-of-nails test fixture

Also Published As

Publication number Publication date
WO1995017681A1 (en) 1995-06-29
US5453702A (en) 1995-09-26

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee