DE4243040A1 - - Google Patents

Info

Publication number
DE4243040A1
DE4243040A1 DE4243040A DE4243040A DE4243040A1 DE 4243040 A1 DE4243040 A1 DE 4243040A1 DE 4243040 A DE4243040 A DE 4243040A DE 4243040 A DE4243040 A DE 4243040A DE 4243040 A1 DE4243040 A1 DE 4243040A1
Authority
DE
Germany
Prior art keywords
ceramic
glass
circuit board
metal
bonding layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE4243040A
Other languages
German (de)
English (en)
Other versions
DE4243040C2 (de
Inventor
Satyam Choudary Cherukuri
Lubomyr Stephen Onyshkevych
Ashok Narayan Prabu
Barry Jay Thaler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/809,371 external-priority patent/US5256469A/en
Priority claimed from US07/809,372 external-priority patent/US5277724A/en
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE4243040A1 publication Critical patent/DE4243040A1/de
Application granted granted Critical
Publication of DE4243040C2 publication Critical patent/DE4243040C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0054—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing PbO, SnO2, B2O3
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Ceramic Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Products (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Glass Compositions (AREA)
DE4243040A 1991-12-18 1992-12-18 Mehrschichtige Metall-Keramik-Leiterplatte und Verfahren zu ihrer Herstellung Expired - Fee Related DE4243040C2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/809,371 US5256469A (en) 1991-12-18 1991-12-18 Multi-layered, co-fired, ceramic-on-metal circuit board for microelectronic packaging
US07/809,372 US5277724A (en) 1991-12-18 1991-12-18 Method of minimizing lateral shrinkage in a co-fired, ceramic-on-metal circuit board

Publications (2)

Publication Number Publication Date
DE4243040A1 true DE4243040A1 (enExample) 1993-06-24
DE4243040C2 DE4243040C2 (de) 1999-06-17

Family

ID=27123219

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4243040A Expired - Fee Related DE4243040C2 (de) 1991-12-18 1992-12-18 Mehrschichtige Metall-Keramik-Leiterplatte und Verfahren zu ihrer Herstellung

Country Status (5)

Country Link
JP (1) JP2922375B2 (enExample)
KR (1) KR970008145B1 (enExample)
DE (1) DE4243040C2 (enExample)
GB (1) GB2263253B (enExample)
SG (1) SG50478A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1020909A3 (en) * 1999-01-17 2003-07-09 Delphi Technologies, Inc. Thick-film hybrid circuit on a metal circuit board and method therefor

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100382416B1 (ko) * 1999-09-28 2003-05-01 가부시끼가이샤 도시바 세라믹 회로기판
KR100696861B1 (ko) * 1999-12-10 2007-03-19 고등기술연구원연구조합 금속상 저온 동시 소성 세라믹 기판 제조 방법
KR100696859B1 (ko) * 1999-12-10 2007-03-19 고등기술연구원연구조합 금속상 저온 동시 소성 세라믹 기판 제조 방법
DE10148751A1 (de) * 2001-10-02 2003-04-17 Siemens Ag Verfahren zur Herstellung einer Elektronikeinheit sowie Elektronikeinheit
US20100089620A1 (en) * 2006-11-30 2010-04-15 Richard Matz Electronic Component Module and Method for the Production Thereof
JP5585649B2 (ja) * 2010-03-30 2014-09-10 株式会社村田製作所 金属ベース基板およびその製造方法
JP6285271B2 (ja) * 2014-04-24 2018-02-28 株式会社ノリタケカンパニーリミテド 接合材およびその利用
JP6577763B2 (ja) * 2015-06-23 2019-09-18 イビデン株式会社 エンジンバルブ及びその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4185139A (en) * 1977-12-30 1980-01-22 International Standard Electric Corporation Filler for a glass-ceramic material comprising CaF2 granules overcoated with a silicon dioxide film
US4256796A (en) * 1979-11-05 1981-03-17 Rca Corporation Partially devitrified porcelain composition and articles prepared with same
DE2533687C2 (de) * 1974-07-30 1982-11-04 Owens-Illinois, Inc., 43666 Toledo, Ohio Gemisch von Bleiborat-Lötglaspartikeln und einem hochschmelzenden Füllstoff niedrigerer Wärmeausdehnung und seine Verwendung
DE3324933C2 (de) * 1982-07-12 1985-01-03 Hitachi, Ltd., Tokio/Tokyo Keramische Mehrschicht-Leiterplatte
US5047371A (en) * 1988-09-02 1991-09-10 Olin Corporation Glass/ceramic sealing system

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0018190A1 (en) * 1979-04-19 1980-10-29 Chloride Silent Power Limited Glass seals for sealing beta-alumina in electro-chemical cells or other energy conversion devices, glasses for use in such seals and cells or other energy conversion devices with such seals
US5041695A (en) * 1989-06-01 1991-08-20 Westinghouse Electric Corp. Co-fired ceramic package for a power circuit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2533687C2 (de) * 1974-07-30 1982-11-04 Owens-Illinois, Inc., 43666 Toledo, Ohio Gemisch von Bleiborat-Lötglaspartikeln und einem hochschmelzenden Füllstoff niedrigerer Wärmeausdehnung und seine Verwendung
US4185139A (en) * 1977-12-30 1980-01-22 International Standard Electric Corporation Filler for a glass-ceramic material comprising CaF2 granules overcoated with a silicon dioxide film
US4256796A (en) * 1979-11-05 1981-03-17 Rca Corporation Partially devitrified porcelain composition and articles prepared with same
DE3324933C2 (de) * 1982-07-12 1985-01-03 Hitachi, Ltd., Tokio/Tokyo Keramische Mehrschicht-Leiterplatte
US5047371A (en) * 1988-09-02 1991-09-10 Olin Corporation Glass/ceramic sealing system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1020909A3 (en) * 1999-01-17 2003-07-09 Delphi Technologies, Inc. Thick-film hybrid circuit on a metal circuit board and method therefor

Also Published As

Publication number Publication date
GB2263253A (en) 1993-07-21
JP2922375B2 (ja) 1999-07-19
DE4243040C2 (de) 1999-06-17
GB9226220D0 (en) 1993-02-10
SG50478A1 (en) 1998-07-20
KR970008145B1 (ko) 1997-05-21
JPH05270934A (ja) 1993-10-19
GB2263253B (en) 1996-02-07
KR930015993A (ko) 1993-07-24

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee