DE4223658B4 - Testvorrichtung für Halbleiter-Chips - Google Patents

Testvorrichtung für Halbleiter-Chips Download PDF

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Publication number
DE4223658B4
DE4223658B4 DE4223658A DE4223658A DE4223658B4 DE 4223658 B4 DE4223658 B4 DE 4223658B4 DE 4223658 A DE4223658 A DE 4223658A DE 4223658 A DE4223658 A DE 4223658A DE 4223658 B4 DE4223658 B4 DE 4223658B4
Authority
DE
Germany
Prior art keywords
test
semiconductor chip
semiconductor chips
test device
probes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE4223658A
Other languages
German (de)
English (en)
Other versions
DE4223658A1 (de
Inventor
Jun Soo Ko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MagnaChip Semiconductor Ltd
Original Assignee
MagnaChip Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MagnaChip Semiconductor Ltd filed Critical MagnaChip Semiconductor Ltd
Publication of DE4223658A1 publication Critical patent/DE4223658A1/de
Application granted granted Critical
Publication of DE4223658B4 publication Critical patent/DE4223658B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
DE4223658A 1991-07-18 1992-07-17 Testvorrichtung für Halbleiter-Chips Expired - Fee Related DE4223658B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019910012274A KR940001809B1 (ko) 1991-07-18 1991-07-18 반도체 칩의 테스터
KR12274/91 1991-07-18

Publications (2)

Publication Number Publication Date
DE4223658A1 DE4223658A1 (de) 1993-01-21
DE4223658B4 true DE4223658B4 (de) 2005-11-03

Family

ID=19317441

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4223658A Expired - Fee Related DE4223658B4 (de) 1991-07-18 1992-07-17 Testvorrichtung für Halbleiter-Chips

Country Status (5)

Country Link
US (1) US5428298A (OSRAM)
JP (1) JP3148370B2 (OSRAM)
KR (1) KR940001809B1 (OSRAM)
DE (1) DE4223658B4 (OSRAM)
TW (1) TW221719B (OSRAM)

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7109731B2 (en) 1996-08-08 2006-09-19 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US7148711B2 (en) 2000-02-25 2006-12-12 Cascade Microtech, Inc. Membrane probing system
US7161363B2 (en) 2002-05-23 2007-01-09 Cascade Microtech, Inc. Probe for testing a device under test
US7178236B2 (en) 1999-06-04 2007-02-20 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US7233160B2 (en) 2000-12-04 2007-06-19 Cascade Microtech, Inc. Wafer probe
US7266889B2 (en) 1998-07-14 2007-09-11 Cascade Microtech, Inc. Membrane probing system
US7285969B2 (en) 2002-11-13 2007-10-23 Cascade Microtech, Inc. Probe for combined signals
US7368927B2 (en) 2004-07-07 2008-05-06 Cascade Microtech, Inc. Probe head having a membrane suspended probe
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US7427868B2 (en) 2003-12-24 2008-09-23 Cascade Microtech, Inc. Active wafer probe
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
US7492175B2 (en) 2001-08-21 2009-02-17 Cascade Microtech, Inc. Membrane probing system
US7498829B2 (en) 2003-05-23 2009-03-03 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7504842B2 (en) 1997-05-28 2009-03-17 Cascade Microtech, Inc. Probe holder for testing of a test device
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7609077B2 (en) 2006-06-09 2009-10-27 Cascade Microtech, Inc. Differential signal probe with integral balun
US7619419B2 (en) 2005-06-13 2009-11-17 Cascade Microtech, Inc. Wideband active-passive differential signal probe
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR940001341A (ko) * 1992-06-29 1994-01-11 디. 아이. 캐플란 전자 장치로의 빠른 전기 접근을 위한 순간 접속법
US5876580A (en) * 1996-01-12 1999-03-02 Micromodule Systems Rough electrical contact surface
US5929521A (en) * 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
US5926029A (en) * 1997-05-27 1999-07-20 International Business Machines Corporation Ultra fine probe contacts
US6137299A (en) * 1997-06-27 2000-10-24 International Business Machines Corporation Method and apparatus for testing integrated circuit chips
US6807734B2 (en) * 1998-02-13 2004-10-26 Formfactor, Inc. Microelectronic contact structures, and methods of making same
US6107812A (en) * 1998-03-05 2000-08-22 International Business Machines Corporation Apparatus and method for testing integrated circuit components of a multi-component card
JP3553791B2 (ja) 1998-04-03 2004-08-11 株式会社ルネサステクノロジ 接続装置およびその製造方法、検査装置並びに半導体素子の製造方法
US6441315B1 (en) 1998-11-10 2002-08-27 Formfactor, Inc. Contact structures with blades having a wiping motion
JP4007704B2 (ja) 1998-11-10 2007-11-14 ナブテスコ株式会社 光学的立体造形用の光硬化性樹脂組成物
US6426638B1 (en) * 2000-05-02 2002-07-30 Decision Track Llc Compliant probe apparatus
US8039277B2 (en) 2001-08-13 2011-10-18 Finisar Corporation Providing current control over wafer borne semiconductor devices using overlayer patterns
JP2005500690A (ja) * 2001-08-13 2005-01-06 ハネウェル・インターナショナル・インコーポレーテッド オーバーレイヤーパターンを使用してウェハに担持された半導体デバイスの電流制御を提供すること
US7700379B2 (en) 2001-08-13 2010-04-20 Finisar Corporation Methods of conducting wafer level burn-in of electronic devices
US7554347B2 (en) * 2002-03-19 2009-06-30 Georgia Tech Research Corporation High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use
KR100996924B1 (ko) * 2008-04-21 2010-11-26 윌테크놀러지(주) 프로브 기판 및 이를 포함하는 프로브 카드
US10680383B2 (en) 2013-03-14 2020-06-09 Apex Technologies, Inc. Linear electrode systems for module attachment with non-uniform axial spacing
US10132452B2 (en) * 2013-03-14 2018-11-20 Apex Technologies, Inc. Suspended track and planar electrode systems and methods
CN108562766B (zh) * 2018-03-15 2025-06-03 昆山精讯电子技术有限公司 芯片测试压接头及其探针机构
US11315652B1 (en) * 2020-11-19 2022-04-26 Winbond Electronics Corp. Semiconductor chip burn-in test with mutli-channel

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU964556A1 (ru) * 1977-03-21 1982-10-07 Феб Електромат,Дрезден (Инопредприятие) Иглоноситель дл контрол полупроводниковых микросхем
DE3702184A1 (de) * 1986-01-27 1987-07-30 Feinmetall Gmbh Pruefeinrichtung zur wafer-pruefung
US4785137A (en) * 1984-04-30 1988-11-15 Allied Corporation Novel nickel/indium/other metal alloy for use in the manufacture of electrical contact areas of electrical devices
EP0294939A2 (en) * 1987-06-09 1988-12-14 Tektronix Inc. Multiple lead probe for integrated circuits in wafer form
US5008614A (en) * 1988-10-11 1991-04-16 Hewlett-Packard Company TAB frame and process of testing same
US5087877A (en) * 1991-02-25 1992-02-11 Motorola Inc. Test contact fixture using flexible circuit tape
EP0475050A2 (en) * 1990-09-14 1992-03-18 International Business Machines Corporation Flexible tape probe

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4443755A (en) * 1981-12-07 1984-04-17 Wooten James F Test apparatus for circuit board racks
US4804132A (en) * 1987-08-28 1989-02-14 Difrancesco Louis Method for cold bonding
JPH075545Y2 (ja) * 1989-01-18 1995-02-08 ティアツク株式会社 光学ヘッド
US5196785A (en) * 1990-12-12 1993-03-23 Hewlett-Packard Company Tape automated bonding test apparatus for thermal, mechanical and electrical coupling

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU964556A1 (ru) * 1977-03-21 1982-10-07 Феб Електромат,Дрезден (Инопредприятие) Иглоноситель дл контрол полупроводниковых микросхем
US4785137A (en) * 1984-04-30 1988-11-15 Allied Corporation Novel nickel/indium/other metal alloy for use in the manufacture of electrical contact areas of electrical devices
DE3702184A1 (de) * 1986-01-27 1987-07-30 Feinmetall Gmbh Pruefeinrichtung zur wafer-pruefung
EP0294939A2 (en) * 1987-06-09 1988-12-14 Tektronix Inc. Multiple lead probe for integrated circuits in wafer form
US5008614A (en) * 1988-10-11 1991-04-16 Hewlett-Packard Company TAB frame and process of testing same
EP0475050A2 (en) * 1990-09-14 1992-03-18 International Business Machines Corporation Flexible tape probe
US5087877A (en) * 1991-02-25 1992-02-11 Motorola Inc. Test contact fixture using flexible circuit tape

Cited By (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7541821B2 (en) 1996-08-08 2009-06-02 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US7109731B2 (en) 1996-08-08 2006-09-19 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US7893704B2 (en) 1996-08-08 2011-02-22 Cascade Microtech, Inc. Membrane probing structure with laterally scrubbing contacts
US7504842B2 (en) 1997-05-28 2009-03-17 Cascade Microtech, Inc. Probe holder for testing of a test device
US7761986B2 (en) 1998-07-14 2010-07-27 Cascade Microtech, Inc. Membrane probing method using improved contact
US7681312B2 (en) 1998-07-14 2010-03-23 Cascade Microtech, Inc. Membrane probing system
US7266889B2 (en) 1998-07-14 2007-09-11 Cascade Microtech, Inc. Membrane probing system
US7400155B2 (en) 1998-07-14 2008-07-15 Cascade Microtech, Inc. Membrane probing system
US7533462B2 (en) 1999-06-04 2009-05-19 Cascade Microtech, Inc. Method of constructing a membrane probe
US7178236B2 (en) 1999-06-04 2007-02-20 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US7148711B2 (en) 2000-02-25 2006-12-12 Cascade Microtech, Inc. Membrane probing system
US7403025B2 (en) 2000-02-25 2008-07-22 Cascade Microtech, Inc. Membrane probing system
US7495461B2 (en) 2000-12-04 2009-02-24 Cascade Microtech, Inc. Wafer probe
US7456646B2 (en) 2000-12-04 2008-11-25 Cascade Microtech, Inc. Wafer probe
US7233160B2 (en) 2000-12-04 2007-06-19 Cascade Microtech, Inc. Wafer probe
US7761983B2 (en) 2000-12-04 2010-07-27 Cascade Microtech, Inc. Method of assembling a wafer probe
US7688097B2 (en) 2000-12-04 2010-03-30 Cascade Microtech, Inc. Wafer probe
US7492175B2 (en) 2001-08-21 2009-02-17 Cascade Microtech, Inc. Membrane probing system
US7436194B2 (en) 2002-05-23 2008-10-14 Cascade Microtech, Inc. Shielded probe with low contact resistance for testing a device under test
US7482823B2 (en) 2002-05-23 2009-01-27 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7489149B2 (en) 2002-05-23 2009-02-10 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7518387B2 (en) 2002-05-23 2009-04-14 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7161363B2 (en) 2002-05-23 2007-01-09 Cascade Microtech, Inc. Probe for testing a device under test
US7453276B2 (en) 2002-11-13 2008-11-18 Cascade Microtech, Inc. Probe for combined signals
US7417446B2 (en) 2002-11-13 2008-08-26 Cascade Microtech, Inc. Probe for combined signals
US7285969B2 (en) 2002-11-13 2007-10-23 Cascade Microtech, Inc. Probe for combined signals
US7498829B2 (en) 2003-05-23 2009-03-03 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7501842B2 (en) 2003-05-23 2009-03-10 Cascade Microtech, Inc. Shielded probe for testing a device under test
US7898273B2 (en) 2003-05-23 2011-03-01 Cascade Microtech, Inc. Probe for testing a device under test
US7427868B2 (en) 2003-12-24 2008-09-23 Cascade Microtech, Inc. Active wafer probe
US7759953B2 (en) 2003-12-24 2010-07-20 Cascade Microtech, Inc. Active wafer probe
US7514944B2 (en) 2004-07-07 2009-04-07 Cascade Microtech, Inc. Probe head having a membrane suspended probe
US7368927B2 (en) 2004-07-07 2008-05-06 Cascade Microtech, Inc. Probe head having a membrane suspended probe
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US8013623B2 (en) 2004-09-13 2011-09-06 Cascade Microtech, Inc. Double sided probing structures
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7940069B2 (en) 2005-01-31 2011-05-10 Cascade Microtech, Inc. System for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7898281B2 (en) 2005-01-31 2011-03-01 Cascade Mircotech, Inc. Interface for testing semiconductors
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
US7619419B2 (en) 2005-06-13 2009-11-17 Cascade Microtech, Inc. Wideband active-passive differential signal probe
US7609077B2 (en) 2006-06-09 2009-10-27 Cascade Microtech, Inc. Differential signal probe with integral balun
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7750652B2 (en) 2006-06-12 2010-07-06 Cascade Microtech, Inc. Test structure and probe for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US9429638B2 (en) 2008-11-21 2016-08-30 Cascade Microtech, Inc. Method of replacing an existing contact of a wafer probing assembly

Also Published As

Publication number Publication date
JP3148370B2 (ja) 2001-03-19
KR930003311A (ko) 1993-02-24
JPH05196691A (ja) 1993-08-06
TW221719B (OSRAM) 1994-03-11
US5428298A (en) 1995-06-27
KR940001809B1 (ko) 1994-03-09
DE4223658A1 (de) 1993-01-21

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Legal Events

Date Code Title Description
OR8 Request for search as to paragraph 43 lit. 1 sentence 1 patent law
8105 Search report available
8110 Request for examination paragraph 44
8127 New person/name/address of the applicant

Owner name: HYNIX SEMICONDUCTOR INC., ICHON, KYONGGI, KR

8127 New person/name/address of the applicant

Owner name: MAGNACHIP SEMICONDUCTOR, LTD., CHEONGJU, KR

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee