DE4201931C1 - - Google Patents

Info

Publication number
DE4201931C1
DE4201931C1 DE4201931A DE4201931A DE4201931C1 DE 4201931 C1 DE4201931 C1 DE 4201931C1 DE 4201931 A DE4201931 A DE 4201931A DE 4201931 A DE4201931 A DE 4201931A DE 4201931 C1 DE4201931 C1 DE 4201931C1
Authority
DE
Germany
Prior art keywords
substrate
bonded
wires
metal
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE4201931A
Other languages
German (de)
English (en)
Inventor
Franz Dipl.-Phys. Dr. 4788 Warstein De Kaussen
Martin Dipl.-Ing. 4784 Ruethen De Figura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
EUPEC GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUPEC GmbH filed Critical EUPEC GmbH
Priority to DE4201931A priority Critical patent/DE4201931C1/de
Priority to US08/003,539 priority patent/US5310701A/en
Priority to ITMI930071A priority patent/IT1263769B/it
Priority to JP5024868A priority patent/JPH07249645A/ja
Application granted granted Critical
Publication of DE4201931C1 publication Critical patent/DE4201931C1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W70/68—
    • H10W72/07327—
    • H10W72/07331—
    • H10W72/07336—
    • H10W72/07337—
    • H10W72/352—
    • H10W72/385—
    • H10W90/734—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Die Bonding (AREA)
DE4201931A 1992-01-24 1992-01-24 Expired - Lifetime DE4201931C1 (cg-RX-API-DMAC10.html)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE4201931A DE4201931C1 (cg-RX-API-DMAC10.html) 1992-01-24 1992-01-24
US08/003,539 US5310701A (en) 1992-01-24 1993-01-13 Method for fixing semiconductor bodies on a substrate using wires
ITMI930071A IT1263769B (it) 1992-01-24 1993-01-19 Procedimento per fissare corpi semiconduttori su un substrato
JP5024868A JPH07249645A (ja) 1992-01-24 1993-01-20 基板上での半導体の取り付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4201931A DE4201931C1 (cg-RX-API-DMAC10.html) 1992-01-24 1992-01-24

Publications (1)

Publication Number Publication Date
DE4201931C1 true DE4201931C1 (cg-RX-API-DMAC10.html) 1993-05-27

Family

ID=6450189

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4201931A Expired - Lifetime DE4201931C1 (cg-RX-API-DMAC10.html) 1992-01-24 1992-01-24

Country Status (4)

Country Link
US (1) US5310701A (cg-RX-API-DMAC10.html)
JP (1) JPH07249645A (cg-RX-API-DMAC10.html)
DE (1) DE4201931C1 (cg-RX-API-DMAC10.html)
IT (1) IT1263769B (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19510003A1 (de) * 1995-03-22 1996-09-26 Inst Mikrotechnik Mainz Gmbh Verfahren zum hochgenauen Anordnen mehrerer Plättchen auf einem Träger sowie ein Träger für die Durchführung des Verfahrens

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07249723A (ja) * 1994-03-11 1995-09-26 Fujitsu Miyagi Electron:Kk 半導体装置の実装構造及び半導体装置の実装方法及びリードフレーム
US5601675A (en) * 1994-12-06 1997-02-11 International Business Machines Corporation Reworkable electronic apparatus having a fusible layer for adhesively attached components, and method therefor
JP2992873B2 (ja) * 1995-12-26 1999-12-20 サンケン電気株式会社 半導体装置
US5917245A (en) * 1995-12-26 1999-06-29 Mitsubishi Electric Corp. Semiconductor device with brazing mount
US5891756A (en) 1997-06-27 1999-04-06 Delco Electronics Corporation Process for converting a wire bond pad to a flip chip solder bump pad and pad formed thereby
FR2787920B1 (fr) * 1998-12-28 2003-10-17 Alstom Procede d'assemblage d'une puce a un element de circuit par brasage
DE102005047055A1 (de) * 2005-09-30 2007-04-05 Infineon Technologies Austria Ag Ansteuerschaltung mit einem Transformator für ein Halbleiterschaltelement
DE112014006446B4 (de) 2014-03-07 2021-08-05 Mitsubishi Electric Corporation Halbleiteranordnung

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3715633A (en) * 1971-07-15 1973-02-06 J Nier Semiconductor unit with integrated circuit
DE2814642A1 (de) * 1978-04-05 1979-10-18 Bosch Gmbh Robert Verfahren zum befestigen mindestens eines halbleiterkoerpers auf einen traeger
DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
DE3217345C2 (cg-RX-API-DMAC10.html) * 1981-05-18 1987-07-02 N.V. Philips' Gloeilampenfabrieken, Eindhoven, Nl
US4949148A (en) * 1989-01-11 1990-08-14 Bartelink Dirk J Self-aligning integrated circuit assembly

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3370203A (en) * 1965-07-19 1968-02-20 United Aircraft Corp Integrated circuit modules
US3962669A (en) * 1974-07-24 1976-06-08 Tyco Laboratories, Inc. Electrical contact structure for semiconductor body

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3715633A (en) * 1971-07-15 1973-02-06 J Nier Semiconductor unit with integrated circuit
DE2814642A1 (de) * 1978-04-05 1979-10-18 Bosch Gmbh Robert Verfahren zum befestigen mindestens eines halbleiterkoerpers auf einen traeger
DE3217345C2 (cg-RX-API-DMAC10.html) * 1981-05-18 1987-07-02 N.V. Philips' Gloeilampenfabrieken, Eindhoven, Nl
DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
US4949148A (en) * 1989-01-11 1990-08-14 Bartelink Dirk J Self-aligning integrated circuit assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19510003A1 (de) * 1995-03-22 1996-09-26 Inst Mikrotechnik Mainz Gmbh Verfahren zum hochgenauen Anordnen mehrerer Plättchen auf einem Träger sowie ein Träger für die Durchführung des Verfahrens

Also Published As

Publication number Publication date
US5310701A (en) 1994-05-10
ITMI930071A0 (it) 1993-01-19
JPH07249645A (ja) 1995-09-26
IT1263769B (it) 1996-08-29
ITMI930071A1 (it) 1994-07-19

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Legal Events

Date Code Title Description
8100 Publication of patent without earlier publication of application
D1 Grant (no unexamined application published) patent law 81
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: INFINEON TECHNOLOGIES AG, 81669 MUENCHEN, DE

R071 Expiry of right
R071 Expiry of right