DE4103375C1 - - Google Patents
Info
- Publication number
- DE4103375C1 DE4103375C1 DE19914103375 DE4103375A DE4103375C1 DE 4103375 C1 DE4103375 C1 DE 4103375C1 DE 19914103375 DE19914103375 DE 19914103375 DE 4103375 A DE4103375 A DE 4103375A DE 4103375 C1 DE4103375 C1 DE 4103375C1
- Authority
- DE
- Germany
- Prior art keywords
- flexible
- rigid
- layer
- composite
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010410 layer Substances 0.000 claims description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000002131 composite material Substances 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 11
- 239000011889 copper foil Substances 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 10
- 239000002356 single layer Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 4
- 238000005470 impregnation Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 2
- 239000004114 Ammonium polyphosphate Substances 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 229920003180 amino resin Polymers 0.000 claims description 2
- 235000019826 ammonium polyphosphate Nutrition 0.000 claims description 2
- 229920001276 ammonium polyphosphate Polymers 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 238000010382 chemical cross-linking Methods 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 claims description 2
- 230000009477 glass transition Effects 0.000 claims description 2
- -1 methylol groups Chemical group 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 2
- 229930185605 Bisphenol Natural products 0.000 claims 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 229920006337 unsaturated polyester resin Polymers 0.000 claims 1
- 239000013039 cover film Substances 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000011888 foil Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0284—Paper, e.g. as reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19914103375 DE4103375C1 (enExample) | 1991-02-05 | 1991-02-05 | |
| EP19910119107 EP0498043A3 (en) | 1991-02-05 | 1991-11-09 | Printed circuit board comprising rigid and flexible parts and process for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19914103375 DE4103375C1 (enExample) | 1991-02-05 | 1991-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE4103375C1 true DE4103375C1 (enExample) | 1992-06-11 |
Family
ID=6424386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19914103375 Expired - Lifetime DE4103375C1 (enExample) | 1991-02-05 | 1991-02-05 |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0498043A3 (enExample) |
| DE (1) | DE4103375C1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4206746C1 (en) * | 1992-03-04 | 1993-06-24 | Degussa Ag, 6000 Frankfurt, De | Manufacture of circuit board with rigid and flexible sections - has flexible sections created by having non-bonding insert of insulation broken away |
| DE4423893A1 (de) * | 1994-07-07 | 1996-01-11 | Freudenberg Carl Fa | Flachdichtung |
| DE10248112B4 (de) * | 2002-09-09 | 2007-01-04 | Ruwel Ag | Verfahren zur Herstellung von gedruckten elektrischen Schaltungen |
| US7238891B2 (en) | 2002-09-19 | 2007-07-03 | Ruwel Ag | Circuit board with at least one rigid and at least one flexible area and process for producing rigid-flexible circuit boards |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9119795D0 (en) * | 1991-09-17 | 1991-10-30 | Albright & Wilson | Flame retardant plastics material |
| TWI419091B (zh) | 2009-02-10 | 2013-12-11 | 財團法人工業技術研究院 | 可轉移的可撓式電子裝置結構及可撓式電子裝置的製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0217311A2 (en) * | 1985-09-27 | 1987-04-08 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Glass fiber-reinforced electrical laminates and a continuous production method therefor |
| EP0408773A1 (de) * | 1989-07-15 | 1991-01-23 | Firma Carl Freudenberg | Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten oder Leiterplatten-Innenlagen |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4026011A (en) * | 1975-08-28 | 1977-05-31 | Burroughs Corporation | Flexible circuit assembly |
| DE3119884C1 (de) * | 1981-05-19 | 1982-11-04 | Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München | Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten |
| DE3141094A1 (de) * | 1981-10-16 | 1983-04-28 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur herstellung eines basismaterials fuer leiterplatten |
-
1991
- 1991-02-05 DE DE19914103375 patent/DE4103375C1/de not_active Expired - Lifetime
- 1991-11-09 EP EP19910119107 patent/EP0498043A3/de not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0217311A2 (en) * | 1985-09-27 | 1987-04-08 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Glass fiber-reinforced electrical laminates and a continuous production method therefor |
| EP0408773A1 (de) * | 1989-07-15 | 1991-01-23 | Firma Carl Freudenberg | Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten oder Leiterplatten-Innenlagen |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4206746C1 (en) * | 1992-03-04 | 1993-06-24 | Degussa Ag, 6000 Frankfurt, De | Manufacture of circuit board with rigid and flexible sections - has flexible sections created by having non-bonding insert of insulation broken away |
| DE4423893A1 (de) * | 1994-07-07 | 1996-01-11 | Freudenberg Carl Fa | Flachdichtung |
| DE10248112B4 (de) * | 2002-09-09 | 2007-01-04 | Ruwel Ag | Verfahren zur Herstellung von gedruckten elektrischen Schaltungen |
| US7238891B2 (en) | 2002-09-19 | 2007-07-03 | Ruwel Ag | Circuit board with at least one rigid and at least one flexible area and process for producing rigid-flexible circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0498043A2 (de) | 1992-08-12 |
| EP0498043A3 (en) | 1992-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8100 | Publication of the examined application without publication of unexamined application | ||
| D1 | Grant (no unexamined application published) patent law 81 | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: KOBER, HORST, 69469 WEINHEIM, DE |
|
| 8370 | Indication of lapse of patent is to be deleted | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: NEUST SCHALTUNGS-ELEKTRONIK NEUWEGER & STEINHAUS K |
|
| 8339 | Ceased/non-payment of the annual fee |