DE3885213D1 - Mittel, um eine optische Fiber an ein opto-elektronisches Bauelement anzukoppeln. - Google Patents

Mittel, um eine optische Fiber an ein opto-elektronisches Bauelement anzukoppeln.

Info

Publication number
DE3885213D1
DE3885213D1 DE88307663T DE3885213T DE3885213D1 DE 3885213 D1 DE3885213 D1 DE 3885213D1 DE 88307663 T DE88307663 T DE 88307663T DE 3885213 T DE3885213 T DE 3885213T DE 3885213 D1 DE3885213 D1 DE 3885213D1
Authority
DE
Germany
Prior art keywords
opto
coupling
optical fiber
electronic component
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE88307663T
Other languages
English (en)
Other versions
DE3885213T2 (de
Inventor
Richard Joseph Pimpinella
John Maurice Segelken
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Publication of DE3885213D1 publication Critical patent/DE3885213D1/de
Application granted granted Critical
Publication of DE3885213T2 publication Critical patent/DE3885213T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3644—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the coupling means being through-holes or wall apertures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3696—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier by moulding, e.g. injection moulding, casting, embossing, stamping, stenciling, printing, or with metallic mould insert manufacturing using LIGA or MIGA techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE88307663T 1987-08-27 1988-08-18 Mittel, um eine optische Fiber an ein opto-elektronisches Bauelement anzukoppeln. Expired - Lifetime DE3885213T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/090,263 US4826272A (en) 1987-08-27 1987-08-27 Means for coupling an optical fiber to an opto-electronic device

Publications (2)

Publication Number Publication Date
DE3885213D1 true DE3885213D1 (de) 1993-12-02
DE3885213T2 DE3885213T2 (de) 1994-04-21

Family

ID=22222018

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88307663T Expired - Lifetime DE3885213T2 (de) 1987-08-27 1988-08-18 Mittel, um eine optische Fiber an ein opto-elektronisches Bauelement anzukoppeln.

Country Status (7)

Country Link
US (1) US4826272A (de)
EP (1) EP0305112B1 (de)
JP (1) JP2644303B2 (de)
KR (1) KR890004182A (de)
CA (1) CA1302551C (de)
DE (1) DE3885213T2 (de)
DK (1) DK476488A (de)

Families Citing this family (86)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0219359B1 (de) * 1985-10-16 1990-03-07 BRITISH TELECOMMUNICATIONS public limited company Fabry-Perot-Interferometer
DE3728077A1 (de) * 1987-08-22 1989-03-02 Philips Patentverwaltung Anordnung zur ankopplung eines in einem steckerstift gefassten lichtwellenleiters an eine photodiode
US5933608A (en) * 1988-02-04 1999-08-03 The City University Multiway signal switching device including a WSIC and optical communication ports
US4945400A (en) * 1988-03-03 1990-07-31 At&T Bell Laboratories Subassembly for optoelectronic devices
EP0361153A3 (de) * 1988-09-29 1991-07-24 Siemens Aktiengesellschaft Anordnung zum Koppeln einer optischen Faser an ein Koppelfenster eines planar integriert optischen Bauteils und Verfahren zur Herstellung einer solchen Anordnung
GB8823010D0 (en) * 1988-09-30 1988-11-09 Marconi Gec Ltd Matching arrangement
US5073003A (en) * 1988-12-23 1991-12-17 At&T Bell Laboratories Optoelectronic device package method and apparatus
US4926545A (en) * 1989-05-17 1990-05-22 At&T Bell Laboratories Method of manufacturing optical assemblies
US5243673A (en) * 1989-08-02 1993-09-07 E. I. Du Pont De Nemours And Company Opto-electronic component having positioned optical fiber associated therewith
US4995695A (en) * 1989-08-17 1991-02-26 At&T Bell Laboratories Optical assembly comprising optical fiber coupling means
US5066090A (en) * 1989-09-12 1991-11-19 Siemens Aktiengesellschaft Optical coupling element having a convex microlens and the method of manufacture
DE3939723C1 (en) * 1989-12-01 1991-02-14 Ant Nachrichtentechnik Gmbh, 7150 Backnang, De Optical or opto-electronic coupling - uses spherical lens received in frusto-pyramidal recess of one part and groove of other part
US5007702A (en) * 1990-01-30 1991-04-16 Segerson Eugene E Fiber optic cable retainer
EP0522417A1 (de) * 1991-07-09 1993-01-13 Sumitomo Electric Industries, Limited Licht-Empfangseinrichtung mit Glasfaser-Anschluss
US5217906A (en) * 1991-12-03 1993-06-08 At&T Bell Laboratories Method of manufacturing an article comprising an opto-electronic device
US5259054A (en) * 1992-01-10 1993-11-02 At&T Bell Laboratories Self-aligned optical subassembly
EP0562211A1 (de) * 1992-03-25 1993-09-29 International Business Machines Corporation Selbstausrichtende Faserkoppler
EP0565999A2 (de) * 1992-04-16 1993-10-20 Siemens Aktiengesellschaft Anordnung zur optischen Kopplung von zwei Gruppen von Wellenleitern
US5257336A (en) * 1992-08-21 1993-10-26 At&T Bell Laboratories Optical subassembly with passive optical alignment
US5337398A (en) * 1992-11-30 1994-08-09 At&T Bell Laboratories Single in-line optical package
US5373261A (en) * 1993-01-21 1994-12-13 The United States Of America As Represented By The Secretary Of The Army Direct optical injection locked fet oscillator
JPH06237016A (ja) * 1993-02-09 1994-08-23 Matsushita Electric Ind Co Ltd 光ファイバモジュールおよびその製造方法
US5337391A (en) * 1993-05-03 1994-08-09 Motorola, Inc. Optoelectronic sub-module and method of making same
US5416872A (en) * 1993-07-06 1995-05-16 At&T Corp. Arrangement for interconnecting an optical fiber an optoelectronic component
US5428704A (en) * 1993-07-19 1995-06-27 Motorola, Inc. Optoelectronic interface and method of making
US5369529A (en) * 1993-07-19 1994-11-29 Motorola, Inc. Reflective optoelectronic interface device and method of making
US5479540A (en) * 1994-06-30 1995-12-26 The Whitaker Corporation Passively aligned bi-directional optoelectronic transceiver module assembly
US5546413A (en) * 1994-09-01 1996-08-13 Motorola Integrated light emitting device
EP0708347A1 (de) * 1994-10-21 1996-04-24 Hewlett-Packard GmbH Vorrichtung zum Justieren, Abschwächungsvorrichtung, Kopplungsvorrichtung und Filtervorrichtung
US5790730A (en) * 1994-11-10 1998-08-04 Kravitz; Stanley H. Package for integrated optic circuit and method
DE19601949B4 (de) * 1995-01-13 2004-08-12 Stratos Lightwave, Inc. (n.d.Ges.d. Staates Delaware), Harwood Heights System zum Schaffen einer statischen Entladung und einer elektromagnetischen Abschirmung
US5590232A (en) * 1995-02-16 1996-12-31 Motorola, Inc. Optical package and method of making
GB2298956B (en) * 1995-03-11 1999-05-19 Northern Telecom Ltd Improvements in crystal substrate processing
JP3166564B2 (ja) * 1995-06-27 2001-05-14 松下電器産業株式会社 半導体レーザ実装体およびその製造方法
GB9521100D0 (en) * 1995-10-16 1995-12-20 Hewlett Packard Ltd Optical connector
FR2767389B1 (fr) * 1997-08-18 1999-10-29 St Microelectronics Sa Dispositif semi-conducteur a moyen optoelectronique d'echanges a distance de signaux
US6117794A (en) * 1998-01-16 2000-09-12 Lucent Technologies, Inc. Method for improved metal oxide bonding of optical elements
JP3542268B2 (ja) * 1998-04-16 2004-07-14 富士通株式会社 チップ実装用光伝送機構およびチップ実装方法
US6175124B1 (en) 1998-06-30 2001-01-16 Lsi Logic Corporation Method and apparatus for a wafer level system
US6151430A (en) 1998-07-08 2000-11-21 Gore Enterprise Holdings, Inc. Photonic device having an integal guide and method of manufacturing
US7208725B2 (en) * 1998-11-25 2007-04-24 Rohm And Haas Electronic Materials Llc Optoelectronic component with encapsulant
EP1161700A2 (de) 1999-03-16 2001-12-12 Framatome Connectors International Modularer optoelektronischer verbinder
JP2001059923A (ja) * 1999-06-16 2001-03-06 Seiko Epson Corp 光モジュール及びその製造方法、半導体装置並びに光伝達装置
US6595700B2 (en) * 2000-04-04 2003-07-22 Shipley Company, L.L.C. Optoelectronic packages having insulation layers
EP1146571A1 (de) * 2000-04-14 2001-10-17 Infineon Technologies AG Lichtemittierendes Halbleiterbauelement und Verfahren zu seiner Herstellung
US7345316B2 (en) * 2000-10-25 2008-03-18 Shipley Company, L.L.C. Wafer level packaging for optoelectronic devices
US6932519B2 (en) 2000-11-16 2005-08-23 Shipley Company, L.L.C. Optical device package
US6827503B2 (en) * 2000-12-01 2004-12-07 Shipley Company, L.L.C. Optical device package having a configured frame
FR2817975B1 (fr) * 2000-12-07 2003-01-10 Commissariat Energie Atomique Procede et dispositif d'alignement passif de fibres optiques et de composants, utilisant des entailles en croix
US6883977B2 (en) 2000-12-14 2005-04-26 Shipley Company, L.L.C. Optical device package for flip-chip mounting
JP2002250846A (ja) * 2001-02-26 2002-09-06 Seiko Epson Corp 光モジュール及びその製造方法並びに光伝達装置
US20030086661A1 (en) * 2001-11-02 2003-05-08 Boudreau Robert A. Silicon waferboard
US20040021214A1 (en) * 2002-04-16 2004-02-05 Avner Badehi Electro-optic integrated circuits with connectors and methods for the production thereof
EP1502135A2 (de) * 2002-04-16 2005-02-02 Xloom Photonics Ltd. Elektrooptische schaltkreise mit integriertem verbinder und verfahren zu ihrer herstellung
JP3896951B2 (ja) * 2002-11-13 2007-03-22 松下電器産業株式会社 光通信用送受光モジュール
US6969204B2 (en) * 2002-11-26 2005-11-29 Hymite A/S Optical package with an integrated lens and optical assemblies incorporating the package
DE20321664U1 (de) * 2003-02-04 2008-09-04 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optoelektronisches Bauelement zur Verwendung in einem modularen System
US7538358B2 (en) * 2003-10-15 2009-05-26 Xloom Communications, Ltd. Electro-optical circuitry having integrated connector and methods for the production thereof
US7305159B1 (en) 2004-08-18 2007-12-04 Edmund Optics, Inc. Dual-reflector light coupler
US20060204182A1 (en) * 2005-03-14 2006-09-14 Applied Optoelectronics, Inc. Apparatus and method for coupling a fiber to a photodetector
FR2886744B1 (fr) * 2005-06-02 2007-12-28 Commissariat Energie Atomique Couplage optique
CN100561757C (zh) * 2005-08-15 2009-11-18 中华电信股份有限公司 一种提高光电元件及其阵列光学耦合容忍度的封装方法
FR2890456B1 (fr) * 2005-09-02 2009-06-12 Commissariat Energie Atomique Dispositif de couplage hermetique
US9250399B2 (en) * 2006-08-31 2016-02-02 Optogig, Inc. High density active modular optoelectronic device for use with push-release mechanism and method for using same
US7543994B2 (en) 2006-10-19 2009-06-09 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Multi-optical fiber connector module for use with a transceiver module and method for coupling optical signals between the transceiver module and multiple optical fibers
GB2446185A (en) 2006-10-30 2008-08-06 Sensl Technologies Ltd Optical assembly and method of assembly
DE102007019033A1 (de) * 2007-04-18 2008-10-23 Infineon Technologies Ag Optoelektronische Baugruppen, Verfahren zur optischen Kopplung eines optoelektronischen Bauelementes mit einer optischen Faser und Verfahren zur Herstellung einer optoelektronischen Baugruppe
DE102007039291A1 (de) 2007-08-20 2009-02-26 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleitermodul und Verfahren zur Herstellung eines solchen
US20090093137A1 (en) * 2007-10-08 2009-04-09 Xloom Communications, (Israel) Ltd. Optical communications module
JP4404141B2 (ja) * 2008-01-07 2010-01-27 オムロン株式会社 光伝送モジュールの基板を補強する補強部品を備えた光伝送モジュールおよび該光伝送モジュールを備えた電子機器
WO2009144645A1 (en) 2008-05-27 2009-12-03 Nxp B.V. Light sensor device and manufacturing method
US9151917B2 (en) * 2008-09-30 2015-10-06 Ytel Photonics Inc. Optical interconnection apparatus and method
US8985865B2 (en) 2008-11-28 2015-03-24 Us Conec, Ltd. Unitary fiber optic ferrule and adapter therefor
EP2230542A1 (de) * 2009-03-16 2010-09-22 Tyco Electronics Nederland B.V. Anordnung mit einer optischen Faseranordnung
DE102009042479A1 (de) 2009-09-24 2011-03-31 Msg Lithoglas Ag Verfahren zum Herstellen einer Anordnung mit einem Bauelement auf einem Trägersubstrat und Anordnung sowie Verfahren zum Herstellen eines Halbzeuges und Halbzeug
CN101915965B (zh) * 2010-08-23 2013-11-06 清华大学 光栅耦合器及其封装结构
JP2013003558A (ja) * 2011-06-22 2013-01-07 Yazaki Corp 光通信部品及びその製造方法
US20140029890A1 (en) * 2012-07-25 2014-01-30 LaXense, Inc. Optical system with integrated photodetectors
US9057594B2 (en) * 2012-12-10 2015-06-16 The Johns Hopkins University Sapphire lens-based optical fiber probe for optical coherence tomography
WO2014141451A1 (ja) * 2013-03-14 2014-09-18 株式会社日立製作所 光コネクタ装置、光ケーブル装置、及び光インターコネクト装置
SG10201805058VA (en) 2014-10-29 2018-07-30 Acacia Communications Inc Optoelectronic ball grid array package with fiber
US9658404B2 (en) * 2015-04-14 2017-05-23 Honeywell International Inc. Optical bench
US9678289B1 (en) * 2015-12-02 2017-06-13 International Business Machines Corporation Thermal management of optical coupling systems
DE102016124270A1 (de) * 2016-12-13 2018-06-14 Infineon Technologies Ag Halbleiter-package und verfahren zum fertigen eines halbleiter-package
US10291332B2 (en) * 2017-04-11 2019-05-14 Innovatice Micro Technology Self-aligned silicon fiber optic connector
JPWO2020171058A1 (ja) * 2019-02-21 2021-10-21 株式会社フジクラ 光ファイバ固定構造、光ファイバ固定構造を用いたレーザ伝送ケーブル、及び、レーザ装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3950075A (en) * 1974-02-06 1976-04-13 Corning Glass Works Light source for optical waveguide bundle
US4130343A (en) * 1977-02-22 1978-12-19 Bell Telephone Laboratories, Incorporated Coupling arrangements between a light-emitting diode and an optical fiber waveguide and between an optical fiber waveguide and a semiconductor optical detector
JPS53139990A (en) * 1977-05-13 1978-12-06 Toshiba Corp Substrate for photoelectric transducers
FR2440563A1 (fr) * 1978-11-02 1980-05-30 Labo Electronique Physique Dispositif de liaison entre fibres optiques et/ou dispositifs electro-optiques, et procede pour assurer leur positionnement optimal
US4257672A (en) * 1978-12-28 1981-03-24 International Business Machines Corporation Optical coupler for connecting a light source to an optical transmission line
US4483067A (en) * 1981-09-11 1984-11-20 U.S. Philips Corporation Method of manufacturing an identification card and an identification manufactured, for example, by this method
JPS5885579A (ja) * 1981-11-17 1983-05-21 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JPS5925282A (ja) * 1982-08-02 1984-02-09 Fujitsu Ltd 光伝送路付光半導体パツケ−ジ
DE3566169D1 (en) * 1984-09-24 1988-12-15 Siemens Ag Opto-electronic device
US4675717A (en) * 1984-10-09 1987-06-23 American Telephone And Telegraph Company, At&T Bell Laboratories Water-scale-integrated assembly
US4779946A (en) * 1986-02-14 1988-10-25 American Telephone And Telegraph Company, At&T Bell Laboratories Microminiature optical assembly

Also Published As

Publication number Publication date
EP0305112B1 (de) 1993-10-27
JPS6470714A (en) 1989-03-16
KR890004182A (ko) 1989-04-20
US4826272A (en) 1989-05-02
CA1302551C (en) 1992-06-02
DK476488D0 (da) 1988-08-26
EP0305112A3 (de) 1991-04-03
DE3885213T2 (de) 1994-04-21
JP2644303B2 (ja) 1997-08-25
DK476488A (da) 1989-02-28
EP0305112A2 (de) 1989-03-01

Similar Documents

Publication Publication Date Title
DE3885213D1 (de) Mittel, um eine optische Fiber an ein opto-elektronisches Bauelement anzukoppeln.
DE3784419D1 (de) Optische faser.
DE3780481D1 (de) Koppler fuer optische fasern.
DE3885827D1 (de) Hermetisch verschlossene, optische Fasern.
DE3750707D1 (de) Apparat, eine ramanaktive optische Faser enthaltend.
IT8722495A0 (it) Contenitore di fibre ottiche.
DE3777935D1 (de) Herstellungsverfahren fuer optische fasern.
DE3585795D1 (de) Optische faserlinse-kupplung.
DE3786828D1 (de) Faseroptischer verbinder.
DE69020592D1 (de) Polarisationserhaltende optische Faser.
DE3782713D1 (de) Faseroptisches spleissverfahren.
DE3854059D1 (de) Optische Wellenleitervorrichtung.
DE3788917D1 (de) Eine optisch bistabile Photodiodevorrichtung.
DE68913188D1 (de) Festverbindung für optische fasern.
DE3875708D1 (de) Optische faserkabel.
DE3785245D1 (de) Optischer fiberverbinder.
DE3854175D1 (de) Fiberoptischer Adapter.
DE3581250D1 (de) Optische faser.
DE3786217D1 (de) Verbinder fuer optische fasern.
DE3784476D1 (de) Optische faserdurchfuehrung.
DE69018616D1 (de) Faseroptischer koppler.
DE69014493D1 (de) Faseroptischer Kuppler.
DE3785470D1 (de) Optische faser.
NO902872L (no) Optisk fiber.
DE3751454D1 (de) Optische Hochleistungsfaser.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: BLUMBACH, KRAMER & PARTNER, 65193 WIESBADEN