DE3854679D1 - Supraleitfähiges Gerät. - Google Patents

Supraleitfähiges Gerät.

Info

Publication number
DE3854679D1
DE3854679D1 DE3854679T DE3854679T DE3854679D1 DE 3854679 D1 DE3854679 D1 DE 3854679D1 DE 3854679 T DE3854679 T DE 3854679T DE 3854679 T DE3854679 T DE 3854679T DE 3854679 D1 DE3854679 D1 DE 3854679D1
Authority
DE
Germany
Prior art keywords
superconducting device
superconducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3854679T
Other languages
English (en)
Other versions
DE3854679T2 (de
Inventor
Shoei Kataoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62153841A external-priority patent/JPS6427281A/ja
Priority claimed from JP62174443A external-priority patent/JPH0828533B2/ja
Application filed by Sharp Corp filed Critical Sharp Corp
Application granted granted Critical
Publication of DE3854679D1 publication Critical patent/DE3854679D1/de
Publication of DE3854679T2 publication Critical patent/DE3854679T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/80—Constructional details
    • H10N60/81—Containers; Mountings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/93—Thermoelectric, e.g. peltier effect cooling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/825—Apparatus per se, device per se, or process of making or operating same
    • Y10S505/872—Magnetic field shield
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/825—Apparatus per se, device per se, or process of making or operating same
    • Y10S505/888—Refrigeration
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/825—Apparatus per se, device per se, or process of making or operating same
    • Y10S505/888—Refrigeration
    • Y10S505/889—Utilizing rare earth material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/825—Apparatus per se, device per se, or process of making or operating same
    • Y10S505/888—Refrigeration
    • Y10S505/891—Magnetic or electrical effect cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
DE3854679T 1987-04-22 1988-04-20 Supraleitfähiges Gerät. Expired - Fee Related DE3854679T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9932587 1987-04-22
JP62153841A JPS6427281A (en) 1987-04-22 1987-06-19 Superconducting device
JP62174443A JPH0828533B2 (ja) 1987-07-13 1987-07-13 超電導装置

Publications (2)

Publication Number Publication Date
DE3854679D1 true DE3854679D1 (de) 1995-12-21
DE3854679T2 DE3854679T2 (de) 1996-07-18

Family

ID=27308920

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3854679T Expired - Fee Related DE3854679T2 (de) 1987-04-22 1988-04-20 Supraleitfähiges Gerät.

Country Status (4)

Country Link
US (1) US5166777A (de)
EP (1) EP0288022B1 (de)
CN (1) CN1029888C (de)
DE (1) DE3854679T2 (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0617225B2 (ja) * 1987-06-26 1994-03-09 シャープ株式会社 熱電変換材料
US5237821A (en) * 1987-08-20 1993-08-24 Kabushiki Kaisha Komatsu Seisakusho Multistep electronic cooler
EP0377740A4 (en) * 1987-08-20 1992-12-02 Kabushiki Kaisha Komatsu Seisakusho Multistep electronic cooler
JPH0298979A (ja) * 1988-10-05 1990-04-11 Sharp Corp 超電導装置
JPH06350146A (ja) * 1993-06-14 1994-12-22 Sharp Corp 超電導装置
JP2953273B2 (ja) * 1993-10-22 1999-09-27 住友電気工業株式会社 低温に冷却する素子の接続方法
US5818097A (en) * 1995-01-05 1998-10-06 Superconductor Technologies, Inc. Temperature controlling cryogenic package system
JP2954908B2 (ja) * 1997-09-30 1999-09-27 エスエムシー株式会社 基板の温度調整装置
US5857342A (en) * 1998-02-10 1999-01-12 Superconductor Technologies, Inc. Temperature controlling cryogenic package system
US6082115A (en) * 1998-12-18 2000-07-04 National Semiconductor Corporation Temperature regulator circuit and precision voltage reference for integrated circuit
US6281120B1 (en) 1998-12-18 2001-08-28 National Semiconductor Corporation Temperature control structure for integrated circuit
US6246100B1 (en) 1999-02-03 2001-06-12 National Semiconductor Corp. Thermal coupler utilizing peltier and seebeck effects
DE10132763B4 (de) * 2001-07-10 2007-10-11 Robert Bosch Gmbh Integrierte Halbleiterschaltung, Verfahren zum Kühlen eines Mikrowellenschaltungsbereiches und Verfahren zum Herstellen einer integrierten Halbleiterschaltung
KR20030017269A (ko) * 2001-08-24 2003-03-03 이용남 열전 반도체를 이용한 침대 상판재의 냉온장치
KR20030085781A (ko) * 2002-05-02 2003-11-07 고석철 고온 초전도체를 사용한 전자 냉/온풍기 장치
US20060107986A1 (en) * 2004-01-29 2006-05-25 Abramov Vladimir S Peltier cooling systems with high aspect ratio
JP4550375B2 (ja) 2003-05-30 2010-09-22 独立行政法人理化学研究所 ビーム電流計
US7587901B2 (en) 2004-12-20 2009-09-15 Amerigon Incorporated Control system for thermal module in vehicle
US20060179849A1 (en) * 2005-02-14 2006-08-17 Abramov Vladimir S Peltier based heat transfer systems
DE102005021590A1 (de) * 2005-05-10 2006-11-16 BSH Bosch und Siemens Hausgeräte GmbH Kältegerät mit Rahmenheizung
US8211011B2 (en) * 2006-11-09 2012-07-03 Ncontact Surgical, Inc. Diaphragm entry for posterior surgical access
US20080087316A1 (en) 2006-10-12 2008-04-17 Masa Inaba Thermoelectric device with internal sensor
EP2102564B1 (de) 2007-01-10 2015-09-02 Gentherm Incorporated Thermoelektrische vorrichtung
WO2009036077A1 (en) 2007-09-10 2009-03-19 Amerigon, Inc. Operational control schemes for ventilated seat or bed assemblies
GB2453734B (en) * 2007-10-16 2009-10-28 Siemens Magnet Technology Ltd Method for cooling superconductive joints
EP2234839B1 (de) 2008-02-01 2016-06-29 Gentherm Incorporated Kondensations- und feuchtigkeitssensoren für thermoelektrische geräte
EP2341800B8 (de) 2008-07-18 2012-12-26 Gentherm Incorporated Klimatisierte bettanordnung
WO2013052823A1 (en) 2011-10-07 2013-04-11 Gentherm Incorporated Thermoelectric device controls and methods
US9989267B2 (en) 2012-02-10 2018-06-05 Gentherm Incorporated Moisture abatement in heating operation of climate controlled systems
US9662962B2 (en) 2013-11-05 2017-05-30 Gentherm Incorporated Vehicle headliner assembly for zonal comfort
WO2015123585A1 (en) 2014-02-14 2015-08-20 Gentherm Incorporated Conductive convective climate controlled seat
US11639816B2 (en) 2014-11-14 2023-05-02 Gentherm Incorporated Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system
US11033058B2 (en) 2014-11-14 2021-06-15 Gentherm Incorporated Heating and cooling technologies
US11857004B2 (en) 2014-11-14 2024-01-02 Gentherm Incorporated Heating and cooling technologies
US10991869B2 (en) 2018-07-30 2021-04-27 Gentherm Incorporated Thermoelectric device having a plurality of sealing materials
KR20210095206A (ko) 2018-11-30 2021-07-30 젠썸 인코포레이티드 열전 공조 시스템 및 방법
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
CN113192747B (zh) * 2021-06-30 2021-09-21 江苏知行科技有限公司 一种非晶磁粉芯的冷处理方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2930904A (en) * 1956-12-31 1960-03-29 Minnesota Mining & Mfg Temperature modifying means for semiconductor device
US2938357A (en) * 1959-05-08 1960-05-31 Carrier Corp Method and apparatus for mounting thermoelectric element
US2994203A (en) * 1960-01-14 1961-08-01 Westinghouse Electric Corp Thermoelectric cooling device
NL260487A (de) * 1960-05-17
US3109290A (en) * 1961-06-27 1963-11-05 Kolenko Evgeny Andreevich High-vacuum trap for diffusion pumps
GB1015985A (en) * 1962-06-12 1966-01-05 Monsanto Co Semiconductor materials and applications thereof
FR1393040A (fr) * 1964-05-08 1965-03-19 Siemens Ag Dispositif thermo-électrique
DE1244209B (de) * 1964-07-02 1967-07-13 Siemens Ag Elektrothermische Kuehlvorrichtung fuer ein supraleitendes Kabel
US3414405A (en) * 1965-08-16 1968-12-03 Semi Elements Inc Alloys for making thermoelectric devices
GB1126092A (en) * 1966-09-02 1968-09-05 Mining & Chemical Products Ltd Thermoelectric device
US3751709A (en) * 1972-04-25 1973-08-07 Us Army Internal tube peltier cooling of image intensification photocathodes
US3814964A (en) * 1973-01-19 1974-06-04 Ace Sophisticates Inc External photodetector cooling techniques
FR2261639B1 (de) * 1974-02-15 1976-11-26 Cit Alcatel
IT1042975B (it) * 1975-09-30 1980-01-30 Snam Progetti Metodo per la costruzione di un modulo termoelettrico e modulo cosi ottenuto
US3998592A (en) * 1975-12-24 1976-12-21 Ford Motor Company Thermoelectric heat pump for chemiluminescence detectors
US4259843A (en) * 1979-10-09 1981-04-07 Cromemco Inc. Isolation chamber for electronic devices
US4362023A (en) * 1981-07-29 1982-12-07 The United States Of America As Represented By The United States Department Of Energy Thermoelectric refrigerator having improved temperature stabilization means
US4375157A (en) * 1981-12-23 1983-03-01 Borg-Warner Corporation Downhole thermoelectric refrigerator
US4483341A (en) * 1982-12-09 1984-11-20 Atlantic Richfield Company Therapeutic hypothermia instrument
US4512758A (en) * 1984-04-30 1985-04-23 Beckman Instruments, Inc. Thermoelectric temperature control assembly for centrifuges
JPS63263751A (ja) * 1987-04-22 1988-10-31 Hitachi Ltd 超電導体用パツケ−ジ
US4907060A (en) * 1987-06-02 1990-03-06 Nelson John L Encapsulated thermoelectric heat pump and method of manufacture
US4855810A (en) * 1987-06-02 1989-08-08 Gelb Allan S Thermoelectric heat pump
JPH01295449A (ja) * 1988-05-24 1989-11-29 Toshiba Corp 冷却型固体撮像装置
US4833889A (en) * 1988-06-17 1989-05-30 Microluminetics Thermoelectric refrigeration apparatus

Also Published As

Publication number Publication date
EP0288022A3 (en) 1990-04-04
EP0288022A2 (de) 1988-10-26
DE3854679T2 (de) 1996-07-18
EP0288022B1 (de) 1995-11-15
CN88102434A (zh) 1988-11-09
US5166777A (en) 1992-11-24
CN1029888C (zh) 1995-09-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee