DE3788442D1 - Keramisches Verbindungssubstrat und Verfahren zu seiner Herstellung. - Google Patents
Keramisches Verbindungssubstrat und Verfahren zu seiner Herstellung.Info
- Publication number
- DE3788442D1 DE3788442D1 DE87301224T DE3788442T DE3788442D1 DE 3788442 D1 DE3788442 D1 DE 3788442D1 DE 87301224 T DE87301224 T DE 87301224T DE 3788442 T DE3788442 T DE 3788442T DE 3788442 D1 DE3788442 D1 DE 3788442D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- bonding substrate
- ceramic bonding
- ceramic
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
- Y10T428/24331—Composite web or sheet including nonapertured component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61031184A JPS62188399A (ja) | 1986-02-14 | 1986-02-14 | セラミツク配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3788442D1 true DE3788442D1 (de) | 1994-01-27 |
DE3788442T2 DE3788442T2 (de) | 1994-04-07 |
Family
ID=12324355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE87301224T Expired - Lifetime DE3788442T2 (de) | 1986-02-14 | 1987-02-12 | Keramisches Verbindungssubstrat und Verfahren zu seiner Herstellung. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4783358A (de) |
EP (1) | EP0233085B1 (de) |
JP (1) | JPS62188399A (de) |
DE (1) | DE3788442T2 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63249394A (ja) * | 1987-04-06 | 1988-10-17 | 日本電気株式会社 | 多層回路基板 |
JPH01235254A (ja) * | 1988-03-15 | 1989-09-20 | Nec Corp | 半導体装置及びその製造方法 |
JP2644845B2 (ja) * | 1988-09-21 | 1997-08-25 | 株式会社日立製作所 | セラミツク多層回路基板及びその用途 |
US5134247A (en) * | 1989-02-21 | 1992-07-28 | Cray Research Inc. | Reduced capacitance chip carrier |
GB2229572A (en) * | 1989-03-14 | 1990-09-26 | Oxley Dev Co Ltd | Ceramic multilayer structure |
US5288535A (en) * | 1989-04-28 | 1994-02-22 | Tonen Corporation | Electrode for electroviscous fluid |
JPH03150895A (ja) * | 1989-11-08 | 1991-06-27 | Hitachi Ltd | 多層回路基板及びその製造方法 |
US5369059A (en) * | 1989-12-08 | 1994-11-29 | Cray Research, Inc. | Method for constructing a reduced capacitance chip carrier |
WO1991009423A1 (en) * | 1989-12-08 | 1991-06-27 | Cray Research, Inc. | Improved reduced capacitance chip carrier |
JP3031966B2 (ja) * | 1990-07-02 | 2000-04-10 | 株式会社東芝 | 集積回路装置 |
DE4026225A1 (de) * | 1990-08-18 | 1992-02-20 | Bosch Gmbh Robert | Schichttraeger |
JP2500235B2 (ja) * | 1991-02-07 | 1996-05-29 | 富士通株式会社 | 薄膜回路基板及びその製造方法 |
JP2002368422A (ja) * | 2001-04-04 | 2002-12-20 | Murata Mfg Co Ltd | 多層セラミック基板及びその製造方法 |
JP4872663B2 (ja) * | 2006-12-28 | 2012-02-08 | 株式会社日立製作所 | 接合用材料及び接合方法 |
KR200458024Y1 (ko) * | 2009-12-24 | 2012-01-16 | 강영광 | 탄성보호대가 구비된 법단용 무속용구 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA728587A (en) * | 1966-02-22 | P. Smith Gail | Method of making ceramic articles | |
JPS4414980Y1 (de) * | 1966-11-26 | 1969-06-27 | ||
JPS543270A (en) * | 1977-06-08 | 1979-01-11 | Fujitsu Ltd | Method of making ceramic multiilayer wired substrate |
JPS542209A (en) * | 1977-06-09 | 1979-01-09 | Nippon Kokan Kk <Nkk> | Dehumidifying method for blast to blast furnace |
JPS558835A (en) * | 1978-07-04 | 1980-01-22 | Shinryo Air Conditioning Co Ltd | Treatment of surplus sludge |
US4488920A (en) * | 1982-05-18 | 1984-12-18 | Williams International Corporation | Process of making a ceramic heat exchanger element |
JPS60135756A (ja) * | 1983-12-24 | 1985-07-19 | Ngk Insulators Ltd | 電気化学的セルの製造方法 |
-
1986
- 1986-02-14 JP JP61031184A patent/JPS62188399A/ja active Pending
-
1987
- 1987-02-10 US US07/013,018 patent/US4783358A/en not_active Expired - Lifetime
- 1987-02-12 EP EP87301224A patent/EP0233085B1/de not_active Expired - Lifetime
- 1987-02-12 DE DE87301224T patent/DE3788442T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE3788442T2 (de) | 1994-04-07 |
EP0233085A3 (en) | 1988-11-09 |
EP0233085A2 (de) | 1987-08-19 |
US4783358A (en) | 1988-11-08 |
EP0233085B1 (de) | 1993-12-15 |
JPS62188399A (ja) | 1987-08-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |