DE3784149D1 - Entfernbare aetzresistente beschichtung fuer die laserprogrammierung integrierter schaltungen. - Google Patents

Entfernbare aetzresistente beschichtung fuer die laserprogrammierung integrierter schaltungen.

Info

Publication number
DE3784149D1
DE3784149D1 DE8787310277T DE3784149T DE3784149D1 DE 3784149 D1 DE3784149 D1 DE 3784149D1 DE 8787310277 T DE8787310277 T DE 8787310277T DE 3784149 T DE3784149 T DE 3784149T DE 3784149 D1 DE3784149 D1 DE 3784149D1
Authority
DE
Germany
Prior art keywords
integrated circuits
resistant coating
acid resistant
laser programming
programming integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787310277T
Other languages
English (en)
Other versions
DE3784149T2 (de
Inventor
Meir Israel Janai
Zvi Orbach
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quick Tech Ltd
Original Assignee
Quick Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from IL8079086A external-priority patent/IL80790A/en
Priority claimed from IL81850A external-priority patent/IL81850A0/xx
Application filed by Quick Tech Ltd filed Critical Quick Tech Ltd
Publication of DE3784149D1 publication Critical patent/DE3784149D1/de
Application granted granted Critical
Publication of DE3784149T2 publication Critical patent/DE3784149T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
    • H01L21/76894—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern using a laser, e.g. laser cutting, laser direct writing, laser repair

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Drying Of Semiconductors (AREA)
DE19873784149 1986-11-26 1987-11-20 Entfernbare aetzresistente beschichtung fuer die laserprogrammierung integrierter schaltungen. Expired - Fee Related DE3784149T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL8079086A IL80790A (en) 1986-11-26 1986-11-26 Ablative etch resistant coating for laser personalization of integrated circuits
IL81850A IL81850A0 (en) 1987-03-10 1987-03-10 Ablative etch resistant coating for laser personalization of integrated circuits

Publications (2)

Publication Number Publication Date
DE3784149D1 true DE3784149D1 (de) 1993-03-25
DE3784149T2 DE3784149T2 (de) 1993-06-03

Family

ID=26321619

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873784149 Expired - Fee Related DE3784149T2 (de) 1986-11-26 1987-11-20 Entfernbare aetzresistente beschichtung fuer die laserprogrammierung integrierter schaltungen.

Country Status (4)

Country Link
EP (1) EP0272799B1 (de)
JP (1) JP2708440B2 (de)
DE (1) DE3784149T2 (de)
HK (1) HK1001908A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5236551A (en) * 1990-05-10 1993-08-17 Microelectronics And Computer Technology Corporation Rework of polymeric dielectric electrical interconnect by laser photoablation
US5196376A (en) * 1991-03-01 1993-03-23 Polycon Corporation Laser lithography for integrated circuit and integrated circuit interconnect manufacture
WO1993018545A1 (en) * 1992-03-10 1993-09-16 Lasa Industries Inc. Method of laser etching of silicon dioxide
US5374590A (en) * 1993-04-28 1994-12-20 International Business Machines Corporation Fabrication and laser deletion of microfuses
US5922624A (en) * 1993-05-13 1999-07-13 Imec Vzw Method for semiconductor processing using mixtures of HF and carboxylic acid
US5518956A (en) * 1993-09-02 1996-05-21 General Electric Company Method of isolating vertical shorts in an electronic array using laser ablation
US6025256A (en) * 1997-01-06 2000-02-15 Electro Scientific Industries, Inc. Laser based method and system for integrated circuit repair or reconfiguration

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5694738A (en) * 1979-12-28 1981-07-31 Fujitsu Ltd Manufacturing method of semiconductor device
US4414059A (en) * 1982-12-09 1983-11-08 International Business Machines Corporation Far UV patterning of resist materials
US4628588A (en) * 1984-06-25 1986-12-16 Texas Instruments Incorporated Molybdenum-metal mask for definition and etch of oxide-encapsulated metal gate
JPS61119062A (ja) * 1984-11-15 1986-06-06 Nec Corp 金属配線パタ−ンの形成方法
GB2170649A (en) * 1985-01-18 1986-08-06 Intel Corp Sputtered silicon as an anti-reflective coating for metal layer lithography

Also Published As

Publication number Publication date
HK1001908A1 (en) 1998-07-17
JP2708440B2 (ja) 1998-02-04
EP0272799A1 (de) 1988-06-29
JPH01125937A (ja) 1989-05-18
EP0272799B1 (de) 1993-02-10
DE3784149T2 (de) 1993-06-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee