DE3783345D1 - Waermesenke mit gestaffelten radialkuehlrippen fuer integrierte schaltungspackung. - Google Patents

Waermesenke mit gestaffelten radialkuehlrippen fuer integrierte schaltungspackung.

Info

Publication number
DE3783345D1
DE3783345D1 DE8787903169T DE3783345T DE3783345D1 DE 3783345 D1 DE3783345 D1 DE 3783345D1 DE 8787903169 T DE8787903169 T DE 8787903169T DE 3783345 T DE3783345 T DE 3783345T DE 3783345 D1 DE3783345 D1 DE 3783345D1
Authority
DE
Germany
Prior art keywords
heat sink
integrated circuit
circuit pack
cooling ribs
radial cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787903169T
Other languages
English (en)
Other versions
DE3783345T2 (de
Inventor
G Gabuzda
V Terrell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Unisys Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unisys Corp filed Critical Unisys Corp
Publication of DE3783345D1 publication Critical patent/DE3783345D1/de
Application granted granted Critical
Publication of DE3783345T2 publication Critical patent/DE3783345T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
DE8787903169T 1986-06-30 1987-04-29 Waermesenke mit gestaffelten radialkuehlrippen fuer integrierte schaltungspackung. Expired - Fee Related DE3783345T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/880,427 US4715438A (en) 1986-06-30 1986-06-30 Staggered radial-fin heat sink device for integrated circuit package
PCT/US1987/000949 WO1988000394A1 (en) 1986-06-30 1987-04-29 Staggered radial-fin heat sink device for integrated circuit package

Publications (2)

Publication Number Publication Date
DE3783345D1 true DE3783345D1 (de) 1993-02-11
DE3783345T2 DE3783345T2 (de) 1993-04-22

Family

ID=25376261

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787903169T Expired - Fee Related DE3783345T2 (de) 1986-06-30 1987-04-29 Waermesenke mit gestaffelten radialkuehlrippen fuer integrierte schaltungspackung.

Country Status (8)

Country Link
US (1) US4715438A (de)
EP (1) EP0271509B1 (de)
JP (1) JPS63501326A (de)
KR (1) KR910002301B1 (de)
AT (1) ATE84167T1 (de)
CA (1) CA1278105C (de)
DE (1) DE3783345T2 (de)
WO (1) WO1988000394A1 (de)

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US5019880A (en) * 1988-01-07 1991-05-28 Prime Computer, Inc. Heat sink apparatus
US5132780A (en) * 1988-01-07 1992-07-21 Prime Computer, Inc. Heat sink apparatus with an air deflection member
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US4909315A (en) * 1988-09-30 1990-03-20 Microelectronics And Computer Technology Corporation Fluid heat exchanger for an electronic component
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US4953634A (en) * 1989-04-20 1990-09-04 Microelectronics And Computer Technology Corporation Low pressure high heat transfer fluid heat exchanger
US5304845A (en) * 1991-04-09 1994-04-19 Digital Equipment Corporation Apparatus for an air impingement heat sink using secondary flow generators
US5256902A (en) * 1991-08-14 1993-10-26 Vlsi Technology, Inc. Metal heatsink attach system
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US5309983B1 (en) * 1992-06-23 1997-02-04 Pcubid Computer Tech Low profile integrated heat sink and fan assembly
US5597034A (en) * 1994-07-01 1997-01-28 Digital Equipment Corporation High performance fan heatsink assembly
US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
US5957194A (en) * 1996-06-27 1999-09-28 Advanced Thermal Solutions, Inc. Plate fin heat exchanger having fluid control means
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IT1294293B1 (it) 1997-07-31 1999-03-24 Maurizio Checchetti Dissipatore di calore
CN1274518A (zh) 1997-10-07 2000-11-22 可靠公司 具有高功耗的老化板
KR20010024447A (ko) 1997-10-07 2001-03-26 릴라이어빌리티 인코포레이티드 적응성 있는 방열 장치를 구비한 번인 보드
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US6407919B1 (en) * 2000-12-18 2002-06-18 Fargo Chou Structure of computer CPU heat dissipation module
US20020121365A1 (en) * 2001-03-05 2002-09-05 Kozyra Kazimierz L. Radial folded fin heat sink
US6424531B1 (en) * 2001-03-13 2002-07-23 Delphi Technologies, Inc. High performance heat sink for electronics cooling
US6418020B1 (en) * 2001-03-30 2002-07-09 Advanced Thermal Technologies Heat dissipation device with ribbed fin plates
US20020166654A1 (en) 2001-05-02 2002-11-14 Smalc Martin D. Finned Heat Sink Assemblies
US6538892B2 (en) 2001-05-02 2003-03-25 Graftech Inc. Radial finned heat sink
US6972950B1 (en) * 2002-06-06 2005-12-06 Raytheon Company Method and apparatus for cooling a portable computer
US7046515B1 (en) * 2002-06-06 2006-05-16 Raytheon Company Method and apparatus for cooling a circuit component
TW540985U (en) * 2002-07-16 2003-07-01 Delta Electronics Inc Improved heat sink
US6631756B1 (en) * 2002-09-10 2003-10-14 Hewlett-Packard Development Company, L.P. High performance passive cooling device with ducting
US6712128B1 (en) 2002-11-20 2004-03-30 Thermal Corp. Cylindrical fin tower heat sink and heat exchanger
US7063130B2 (en) * 2003-08-08 2006-06-20 Chu-Tsai Huang Circular heat sink assembly
US6899164B1 (en) * 2004-02-27 2005-05-31 Datech Technology Co., Ltd. Heat sink with guiding fins
US20050225938A1 (en) * 2004-04-08 2005-10-13 Richard Montgomery Cold plate
US7280363B2 (en) * 2005-01-21 2007-10-09 Delphi Technologies, Inc. Apparatus for controlling thermal interface between cold plate and integrated circuit chip
KR100719702B1 (ko) * 2005-05-25 2007-05-17 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP2008010761A (ja) * 2006-06-30 2008-01-17 Fanuc Ltd 電子部品のヒートシンク
CN101408300B (zh) * 2007-10-10 2011-06-08 富准精密工业(深圳)有限公司 具有散热结构的发光二极管灯具
CN101413649B (zh) * 2007-10-19 2011-07-27 富准精密工业(深圳)有限公司 发光二极管灯具
JP5537777B2 (ja) * 2008-02-08 2014-07-02 日本モレックス株式会社 ヒートシンク、冷却モジュールおよび冷却可能な電子基板
US20100108292A1 (en) * 2008-10-31 2010-05-06 Teledyne Scientific & Imaging, Llc Heat sink system with fin structure
US7972037B2 (en) 2008-11-26 2011-07-05 Deloren E. Anderson High intensity replaceable light emitting diode module and array
KR101506070B1 (ko) 2010-04-05 2015-03-25 쿠퍼 테크놀로지스 컴파니 제어된 방향성 열 전달을 가지는 조명 어셈블리
USD671257S1 (en) * 2010-04-10 2012-11-20 Lg Innotek Co., Ltd. LED lamp
US10852069B2 (en) 2010-05-04 2020-12-01 Fractal Heatsink Technologies, LLC System and method for maintaining efficiency of a fractal heat sink
US10041745B2 (en) 2010-05-04 2018-08-07 Fractal Heatsink Technologies LLC Fractal heat transfer device
US9228785B2 (en) 2010-05-04 2016-01-05 Alexander Poltorak Fractal heat transfer device
TWM407546U (en) * 2010-11-11 2011-07-11 Victory Ind Corp Improved structure of heat sink module
WO2012106605A2 (en) 2011-02-04 2012-08-09 Lockheed Martin Corporation Staged graphite foam heat exchangers
US9513059B2 (en) * 2011-02-04 2016-12-06 Lockheed Martin Corporation Radial-flow heat exchanger with foam heat exchange fins
WO2012106603A2 (en) 2011-02-04 2012-08-09 Lockheed Martin Corporation Shell-and-tube heat exchangers with foam heat transfer units
TWI458932B (zh) * 2011-09-02 2014-11-01 Giga Byte Tech Co Ltd 散熱器
JP6128563B2 (ja) * 2012-05-31 2017-05-24 国立大学法人 鹿児島大学 ヒートシンク
USD702394S1 (en) * 2013-07-17 2014-04-08 All Real Technology Co., Ltd. Illumination device
JP6291923B2 (ja) * 2014-03-11 2018-03-14 富士通株式会社 放熱装置
AT515828B1 (de) 2014-05-23 2022-02-15 Fronius Int Gmbh Kühlvorrichtung und Wechselrichtergehäuse mit einer solchen Kühlvorrichtung
CN105864681A (zh) * 2015-01-22 2016-08-17 全亿大科技（佛山）有限公司 Led照明装置
JP6508468B2 (ja) * 2015-07-24 2019-05-08 東芝ライテック株式会社 車両用照明装置、および車両用灯具
US9736966B1 (en) * 2016-02-10 2017-08-15 International Business Machines Corporation Heat sink with integrated threaded lid
WO2018013668A1 (en) 2016-07-12 2018-01-18 Alexander Poltorak System and method for maintaining efficiency of a heat sink
GB201621690D0 (en) 2016-12-20 2017-02-01 Element Six Tech Ltd A heat sink comprising synthetic diamond material
US11031312B2 (en) 2017-07-17 2021-06-08 Fractal Heatsink Technologies, LLC Multi-fractal heatsink system and method
JP7081203B2 (ja) * 2018-02-26 2022-06-07 トヨタ自動車株式会社 放熱フィン構造及びこれを用いた電子基板の冷却構造
US11158566B2 (en) 2019-05-24 2021-10-26 Google Llc Integrated circuit with a ring-shaped hot spot area and multidirectional cooling
TWD210771S (zh) * 2020-04-09 2021-04-01 宏碁股份有限公司 散熱鰭片
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US11920874B2 (en) * 2021-02-09 2024-03-05 Ngk Insulators, Ltd. Heat exchange member, heat exchanger and heat conductive member

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Also Published As

Publication number Publication date
WO1988000394A1 (en) 1988-01-14
EP0271509B1 (de) 1992-12-30
US4715438A (en) 1987-12-29
EP0271509A1 (de) 1988-06-22
JPH0373143B2 (de) 1991-11-20
ATE84167T1 (de) 1993-01-15
KR910002301B1 (ko) 1991-04-11
CA1278105C (en) 1990-12-18
KR880701519A (ko) 1988-07-27
JPS63501326A (ja) 1988-05-19
DE3783345T2 (de) 1993-04-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee