DE3781573T2 - Selbstausrichtender kontakt auf einer diffundierten zone des p-typs. - Google Patents

Selbstausrichtender kontakt auf einer diffundierten zone des p-typs.

Info

Publication number
DE3781573T2
DE3781573T2 DE8787100548T DE3781573T DE3781573T2 DE 3781573 T2 DE3781573 T2 DE 3781573T2 DE 8787100548 T DE8787100548 T DE 8787100548T DE 3781573 T DE3781573 T DE 3781573T DE 3781573 T2 DE3781573 T2 DE 3781573T2
Authority
DE
Germany
Prior art keywords
self
type
aligning contact
diffused zone
diffused
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787100548T
Other languages
English (en)
Other versions
DE3781573D1 (de
Inventor
George Richard Goth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE3781573D1 publication Critical patent/DE3781573D1/de
Application granted granted Critical
Publication of DE3781573T2 publication Critical patent/DE3781573T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/911—Differential oxidation and etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/981—Utilizing varying dielectric thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Bipolar Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Integrated Circuits (AREA)
DE8787100548T 1986-03-07 1987-01-16 Selbstausrichtender kontakt auf einer diffundierten zone des p-typs. Expired - Fee Related DE3781573T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/837,125 US4717678A (en) 1986-03-07 1986-03-07 Method of forming self-aligned P contact

Publications (2)

Publication Number Publication Date
DE3781573D1 DE3781573D1 (de) 1992-10-15
DE3781573T2 true DE3781573T2 (de) 1993-04-08

Family

ID=25273587

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787100548T Expired - Fee Related DE3781573T2 (de) 1986-03-07 1987-01-16 Selbstausrichtender kontakt auf einer diffundierten zone des p-typs.

Country Status (5)

Country Link
US (1) US4717678A (de)
EP (1) EP0236687B1 (de)
JP (1) JP2673943B2 (de)
CA (1) CA1240411A (de)
DE (1) DE3781573T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4839302A (en) * 1986-10-13 1989-06-13 Matsushita Electric Industrial Co., Ltd. Method for fabricating bipolar semiconductor device
FR2636474B1 (fr) * 1988-09-09 1990-11-30 Sgs Thomson Microelectronics Procede de fabrication d'une diode de regulation et de protection
GB2237445B (en) * 1989-10-04 1994-01-12 Seagate Microelectron Ltd A semiconductor device fabrication process
EP0490236A3 (en) * 1990-12-13 1992-08-12 National Semiconductor Corporation Fabrication process for schottky barrier diodes on a substrate
TW214610B (en) * 1992-08-31 1993-10-11 Siemens Ag Method of making contact for semiconductor device
US5374569A (en) * 1992-09-21 1994-12-20 Siliconix Incorporated Method for forming a BiCDMOS
JP3206419B2 (ja) * 1996-02-19 2001-09-10 富士電機株式会社 半導体装置の製造方法
IT1301729B1 (it) * 1998-06-16 2000-07-07 St Microelectronics Srl Processo per il drogaggio selettivo di una fetta di materialesemiconduttore mediante impiantazione ionica.
US6423598B1 (en) * 1998-10-08 2002-07-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device, a method of manufacturing the same, and a semiconductor device protective circuit
US6503851B2 (en) 2000-08-31 2003-01-07 Micron Technology, Inc. Use of linear injectors to deposit uniform selective ozone TEOS oxide film by pulsing reactants on and off
US6368986B1 (en) * 2000-08-31 2002-04-09 Micron Technology, Inc. Use of selective ozone TEOS oxide to create variable thickness layers and spacers
US7118443B2 (en) * 2002-09-27 2006-10-10 Mattel, Inc. Animated multi-persona toy
US6844225B2 (en) * 2003-01-15 2005-01-18 International Business Machines Corporation Self-aligned mask formed utilizing differential oxidation rates of materials
JP4310657B2 (ja) * 2006-05-26 2009-08-12 セイコーエプソン株式会社 光素子
US8759188B2 (en) * 2010-12-29 2014-06-24 Stmicroelectronics S.R.L. Radiation hardened bipolar injunction transistor

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3212162A (en) * 1962-01-05 1965-10-19 Fairchild Camera Instr Co Fabricating semiconductor devices
GB1133422A (en) * 1967-01-19 1968-11-13 Marconi Co Ltd Improvements in or relating to methods of manufacturing planar transistors
US4032957A (en) * 1972-12-29 1977-06-28 Sony Corporation Semiconductor device
JPS5128777A (en) * 1974-09-04 1976-03-11 Hitachi Ltd Kisei pnpn sairisutanohatsuseioboshishita shusekikairosochi no seizohoho
JPS51127682A (en) * 1975-04-30 1976-11-06 Fujitsu Ltd Manufacturing process of semiconductor device
US4110125A (en) * 1977-03-03 1978-08-29 International Business Machines Corporation Method for fabricating semiconductor devices
US4233337A (en) * 1978-05-01 1980-11-11 International Business Machines Corporation Method for forming semiconductor contacts
US4151010A (en) * 1978-06-30 1979-04-24 International Business Machines Corporation Forming adjacent impurity regions in a semiconductor by oxide masking
US4325180A (en) * 1979-02-15 1982-04-20 Texas Instruments Incorporated Process for monolithic integration of logic, control, and high voltage interface circuitry
JPS5669844A (en) * 1979-11-10 1981-06-11 Toshiba Corp Manufacture of semiconductor device
JPS5685848A (en) * 1979-12-15 1981-07-13 Toshiba Corp Manufacture of bipolar integrated circuit
DE3174638D1 (en) * 1980-10-29 1986-06-19 Fairchild Camera Instr Co A method of fabricating a self-aligned integrated circuit structure using differential oxide growth
US4475280A (en) * 1980-12-24 1984-10-09 General Electric Company Method of making an integrated circuit incorporating low voltage and high voltage semiconductor devices

Also Published As

Publication number Publication date
EP0236687A2 (de) 1987-09-16
US4717678A (en) 1988-01-05
DE3781573D1 (de) 1992-10-15
EP0236687B1 (de) 1992-09-09
EP0236687A3 (en) 1988-10-26
CA1240411A (en) 1988-08-09
JPS62211917A (ja) 1987-09-17
JP2673943B2 (ja) 1997-11-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee