DE3779142D1 - Verfahren zum herstellen eines filmtraegers mit podesten fuer automatische bandmontage und gemaess diesem verfahren hergestelltes produkt. - Google Patents
Verfahren zum herstellen eines filmtraegers mit podesten fuer automatische bandmontage und gemaess diesem verfahren hergestelltes produkt.Info
- Publication number
- DE3779142D1 DE3779142D1 DE8787300680T DE3779142T DE3779142D1 DE 3779142 D1 DE3779142 D1 DE 3779142D1 DE 8787300680 T DE8787300680 T DE 8787300680T DE 3779142 T DE3779142 T DE 3779142T DE 3779142 D1 DE3779142 D1 DE 3779142D1
- Authority
- DE
- Germany
- Prior art keywords
- platforms
- producing
- produced according
- product produced
- film carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12188—All metal or with adjacent metals having marginal feature for indexing or weakened portion for severing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12201—Width or thickness variation or marginal cuts repeating longitudinally
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/822,580 US4701363A (en) | 1986-01-27 | 1986-01-27 | Process for manufacturing bumped tape for tape automated bonding and the product produced thereby |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3779142D1 true DE3779142D1 (de) | 1992-06-25 |
Family
ID=25236418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787300680T Expired - Fee Related DE3779142D1 (de) | 1986-01-27 | 1987-01-27 | Verfahren zum herstellen eines filmtraegers mit podesten fuer automatische bandmontage und gemaess diesem verfahren hergestelltes produkt. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4701363A (de) |
EP (1) | EP0232108B1 (de) |
JP (1) | JPS62182288A (de) |
KR (1) | KR870007568A (de) |
DE (1) | DE3779142D1 (de) |
FI (1) | FI870359A (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4795694A (en) * | 1986-06-20 | 1989-01-03 | Siemens Aktiengesellschaft | Manufacture of fine structures for semiconductor contacting |
JPH0815193B2 (ja) * | 1986-08-12 | 1996-02-14 | 新光電気工業株式会社 | 半導体装置及びこれに用いるリードフレーム |
US5057461A (en) * | 1987-03-19 | 1991-10-15 | Texas Instruments Incorporated | Method of mounting integrated circuit interconnect leads releasably on film |
US4806409A (en) * | 1987-05-20 | 1989-02-21 | Olin Corporation | Process for providing an improved electroplated tape automated bonding tape and the product produced thereby |
US4849857A (en) * | 1987-10-05 | 1989-07-18 | Olin Corporation | Heat dissipating interconnect tape for use in tape automated bonding |
EP0364536A1 (de) * | 1988-03-28 | 1990-04-25 | Digital Equipment Corporation | Burn-in-anschlussfläche für automatische bandmontagestrukturen |
US5036380A (en) * | 1988-03-28 | 1991-07-30 | Digital Equipment Corp. | Burn-in pads for tab interconnects |
JPH0212937A (ja) * | 1988-06-30 | 1990-01-17 | Toshiba Corp | Tab用フィルムテープキャリア |
JPH04503891A (ja) * | 1989-10-13 | 1992-07-09 | ザ・フォックスボロ・カンパニー | 用途を特定したテープ自動ボンディング |
US5260168A (en) * | 1989-10-13 | 1993-11-09 | The Foxboro Company | Application specific tape automated bonding |
DE4017863C1 (de) * | 1990-06-02 | 1991-07-18 | Du Pont De Nemours (Deutschland) Gmbh, 4000 Duesseldorf, De | |
US5130275A (en) * | 1990-07-02 | 1992-07-14 | Digital Equipment Corp. | Post fabrication processing of semiconductor chips |
JPH0752744B2 (ja) * | 1991-04-04 | 1995-06-05 | チッソ株式会社 | リ−ド強度のすぐれたフィルムキャリアの製造方法 |
US5234536A (en) * | 1991-04-26 | 1993-08-10 | Olin Corporation | Process for the manufacture of an interconnect circuit |
JP3044872B2 (ja) * | 1991-09-25 | 2000-05-22 | ソニー株式会社 | 半導体装置 |
US6007668A (en) * | 1992-08-08 | 1999-12-28 | Shinko Electric Industries Co., Ltd. | Tab tape and method for producing same |
US5738928A (en) * | 1992-08-08 | 1998-04-14 | Shinko Electric Industries Co., Ltd. | Tab tape and method for producing same |
KR970009271B1 (en) * | 1992-08-08 | 1997-06-09 | Shinko Electric Ind Kk | Tab tape and method for producing it |
JP3199141B2 (ja) * | 1993-07-07 | 2001-08-13 | ソニー株式会社 | ドラムリード測定装置と測定方法 |
JP3257904B2 (ja) * | 1994-08-11 | 2002-02-18 | 新光電気工業株式会社 | リードフレームとその製造方法 |
JPH08116016A (ja) * | 1994-10-15 | 1996-05-07 | Toshiba Corp | リードフレーム及び半導体装置 |
KR100269219B1 (ko) * | 1996-02-28 | 2000-10-16 | 이중구 | 반도체 리드프레임 및 패키지 방법 |
JP2001156408A (ja) * | 1999-11-30 | 2001-06-08 | Fujitsu Ltd | プリント回路基板および配線形成方法 |
JP2002170838A (ja) * | 2000-11-30 | 2002-06-14 | Shinkawa Ltd | 半導体装置およびその製造方法 |
US6800947B2 (en) * | 2001-06-27 | 2004-10-05 | Intel Corporation | Flexible tape electronics packaging |
JP2006278837A (ja) * | 2005-03-30 | 2006-10-12 | Mitsui Mining & Smelting Co Ltd | フレキシブルプリント配線板の製造方法及びフレキシブルプリント配線板 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3292241A (en) * | 1964-05-20 | 1966-12-20 | Motorola Inc | Method for connecting semiconductor devices |
US3440027A (en) * | 1966-06-22 | 1969-04-22 | Frances Hugle | Automated packaging of semiconductors |
US3832769A (en) * | 1971-05-26 | 1974-09-03 | Minnesota Mining & Mfg | Circuitry and method |
US3781596A (en) * | 1972-07-07 | 1973-12-25 | R Galli | Semiconductor chip carriers and strips thereof |
US3838984A (en) * | 1973-04-16 | 1974-10-01 | Sperry Rand Corp | Flexible carrier and interconnect for uncased ic chips |
US3868724A (en) * | 1973-11-21 | 1975-02-25 | Fairchild Camera Instr Co | Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier |
US3984620A (en) * | 1975-06-04 | 1976-10-05 | Raytheon Company | Integrated circuit chip test and assembly package |
US4312117A (en) * | 1977-09-01 | 1982-01-26 | Raytheon Company | Integrated test and assembly device |
US4210926A (en) * | 1977-12-07 | 1980-07-01 | Siemens Aktiengesellschaft | Intermediate member for mounting and contacting a semiconductor body |
JPS5826828B2 (ja) * | 1978-04-26 | 1983-06-06 | 新光電気工業株式会社 | テ−プキヤリアの製造方法 |
US4209355A (en) * | 1978-07-26 | 1980-06-24 | National Semiconductor Corporation | Manufacture of bumped composite tape for automatic gang bonding of semiconductor devices |
JPS5526612A (en) * | 1978-08-11 | 1980-02-26 | Nitto Electric Ind Co Ltd | Manufacturing of carrier tape useful for ic |
JPS5526613A (en) * | 1978-08-11 | 1980-02-26 | Nitto Electric Ind Co Ltd | Manufacturing of carrier tape useful for ic |
FR2456390A1 (fr) * | 1979-05-11 | 1980-12-05 | Thomson Csf | Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier |
US4308339A (en) * | 1980-02-07 | 1981-12-29 | Westinghouse Electric Corp. | Method for manufacturing tape including lead frames |
US4411719A (en) * | 1980-02-07 | 1983-10-25 | Westinghouse Electric Corp. | Apparatus and method for tape bonding and testing of integrated circuit chips |
JPS57152147A (en) * | 1981-03-16 | 1982-09-20 | Matsushita Electric Ind Co Ltd | Formation of metal projection on metal lead |
JPS57204157A (en) * | 1981-06-11 | 1982-12-14 | Shindo Denshi Kogyo Kk | Manufacture of wiring section for mounting chip |
JPS57204158A (en) * | 1981-06-11 | 1982-12-14 | Shindo Denshi Kogyo Kk | Manufacture of wiring section for mounting chip |
US4396457A (en) * | 1982-03-17 | 1983-08-02 | E. I. Du Pont De Nemours And Company | Method of making bumped-beam tape |
-
1986
- 1986-01-27 US US06/822,580 patent/US4701363A/en not_active Expired - Fee Related
-
1987
- 1987-01-27 KR KR870000625A patent/KR870007568A/ko not_active Application Discontinuation
- 1987-01-27 DE DE8787300680T patent/DE3779142D1/de not_active Expired - Fee Related
- 1987-01-27 JP JP62015363A patent/JPS62182288A/ja active Pending
- 1987-01-27 FI FI870359A patent/FI870359A/fi not_active Application Discontinuation
- 1987-01-27 EP EP87300680A patent/EP0232108B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0232108A3 (en) | 1988-07-20 |
US4701363A (en) | 1987-10-20 |
FI870359A (fi) | 1987-07-28 |
FI870359A0 (fi) | 1987-01-27 |
EP0232108A2 (de) | 1987-08-12 |
EP0232108B1 (de) | 1992-05-20 |
KR870007568A (ko) | 1987-08-20 |
JPS62182288A (ja) | 1987-08-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |