DE3778639D1 - Verfahren zum stapelverbinden von draehten. - Google Patents

Verfahren zum stapelverbinden von draehten.

Info

Publication number
DE3778639D1
DE3778639D1 DE8787115823T DE3778639T DE3778639D1 DE 3778639 D1 DE3778639 D1 DE 3778639D1 DE 8787115823 T DE8787115823 T DE 8787115823T DE 3778639 T DE3778639 T DE 3778639T DE 3778639 D1 DE3778639 D1 DE 3778639D1
Authority
DE
Germany
Prior art keywords
stacking wires
stacking
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787115823T
Other languages
German (de)
English (en)
Inventor
Hiroshi Hasegawa
Koichi Sugimoto
Takeshi Yano
Tositada Netsu
Mitsukiyo Tani
Tosaku Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3778639D1 publication Critical patent/DE3778639D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
DE8787115823T 1986-10-31 1987-10-28 Verfahren zum stapelverbinden von draehten. Expired - Lifetime DE3778639D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61258232A JPS63114138A (ja) 1986-10-31 1986-10-31 ワイヤ積層ボンデイング方法

Publications (1)

Publication Number Publication Date
DE3778639D1 true DE3778639D1 (de) 1992-06-04

Family

ID=17317352

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787115823T Expired - Lifetime DE3778639D1 (de) 1986-10-31 1987-10-28 Verfahren zum stapelverbinden von draehten.

Country Status (4)

Country Link
US (1) US4875618A (https=)
EP (1) EP0265927B1 (https=)
JP (1) JPS63114138A (https=)
DE (1) DE3778639D1 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2636179B1 (fr) * 1988-09-02 1990-09-07 Mitnikoff Michel Procede de realisation de mise en forme de raccordement d'une tresse et produit ainsi obtenu
JPH02101754A (ja) * 1988-10-11 1990-04-13 Hitachi Ltd ボンディング方法及びボンディング装置
JPH03209733A (ja) * 1990-01-11 1991-09-12 Fujitsu Ltd 半導体装置
KR940001149B1 (ko) * 1991-04-16 1994-02-14 삼성전자 주식회사 반도체 장치의 칩 본딩 방법
JP2558976B2 (ja) * 1991-11-08 1996-11-27 松下電器産業株式会社 電子部品の電極とリードとの接合方法
US5295619A (en) * 1992-05-22 1994-03-22 Rohm Co., Ltd. Method and apparatus for performing wire bonding by using solder wire
US5455461A (en) * 1992-09-21 1995-10-03 Fujitsu Limited Semiconductor device having reformed pad
DE4307162C2 (de) * 1993-03-06 2000-06-08 Amatech Advanced Micromechanic Verbindung, Verfahren und Vorrichtung zur Herstellung einer Verbindung auf einer Chipanschlußfläche
US5328079A (en) * 1993-03-19 1994-07-12 National Semiconductor Corporation Method of and arrangement for bond wire connecting together certain integrated circuit components
JP3248778B2 (ja) * 1993-05-21 2002-01-21 ローム株式会社 半田ワイヤーにボール部を形成する方法
US5842628A (en) * 1995-04-10 1998-12-01 Fujitsu Limited Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method
KR100186752B1 (ko) * 1995-09-04 1999-04-15 황인길 반도체 칩 본딩방법
JP3146345B2 (ja) * 1996-03-11 2001-03-12 アムコー テクノロジー コリア インコーポレーティド バンプチップスケール半導体パッケージのバンプ形成方法
DE19916177B4 (de) * 1999-04-10 2006-01-26 Sokymat Gmbh Verfahren zum Kontaktieren des Halbleiterchips und Halbleiterchip mit drahtförmigen Anschlußstücken
US6651322B1 (en) * 2000-12-28 2003-11-25 Unisys Corporation Method of reworking a multilayer printed circuit board assembly
DE10324069B4 (de) * 2003-05-27 2005-06-23 Infineon Technologies Ag Schaltungsanordnung und Verfahren zur leitenden Verbindung von Kontaktflecken bei Halbleiterchips
DE102004047306B4 (de) * 2004-09-29 2008-02-07 Infineon Technologies Ag Leistungs-Halbleiterbauteil mit mehreren Bauteilkomponenten
DE102005006333B4 (de) * 2005-02-10 2007-10-18 Infineon Technologies Ag Halbleiterbauteil mit mehreren Bondanschlüssen und gebondeten Kontaktelementen unterschiedlicher Metallzusammensetzung und Verfahren zur Herstellung desselben
US20060186179A1 (en) * 2005-02-23 2006-08-24 Levine Lee R Apparatus and method for bonding wires
US8022522B1 (en) 2005-04-01 2011-09-20 Marvell International Ltd. Semiconductor package
DE102005020087A1 (de) * 2005-04-29 2006-11-09 Infineon Technologies Ag Verfahren und Vorrichtung zur Erzeugung von einem bondbaren Flächenbereich auf einem Träger
DE102005031836B4 (de) * 2005-07-06 2007-11-22 Infineon Technologies Ag Halbleiterleistungsmodul mit SiC-Leistungsdioden und Verfahren zur Herstellung desselben
US8168458B2 (en) * 2008-12-08 2012-05-01 Stats Chippac, Ltd. Semiconductor device and method of forming bond wires and stud bumps in recessed region of peripheral area around the device for electrical interconnection to other devices
US8008785B2 (en) * 2009-12-22 2011-08-30 Tessera Research Llc Microelectronic assembly with joined bond elements having lowered inductance

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1590345B1 (de) * 1966-05-10 1970-12-23 Electro Mechanismus Inc Verfahren zum Herstellen elektrischer Verbindungen zwischen gedruckten Schaltungen und Verbindungselemente zum Durchfuehren des Verfahrens
US3669333A (en) * 1970-02-02 1972-06-13 Western Electric Co Bonding with a compliant medium
DE2622000A1 (de) * 1976-05-18 1977-12-01 Bosch Gmbh Robert Verfahren und vorrichtung zum anloeten eines drahtes
JPS5512712A (en) * 1978-07-12 1980-01-29 Toshiba Corp Wire bonding method for semiconductor element
JPS5588348A (en) * 1978-12-27 1980-07-04 Toshiba Corp Semiconductor device
US4388512A (en) * 1981-03-09 1983-06-14 Raytheon Company Aluminum wire ball bonding apparatus and method
US4390771A (en) * 1981-05-11 1983-06-28 Fairchild Camera & Instrument Corp. Bonding wire ball forming method and apparatus
US4465913A (en) * 1981-10-06 1984-08-14 Augat Inc. Parallel gap welder
DE3577371D1 (de) * 1984-07-27 1990-05-31 Toshiba Kawasaki Kk Apparat zum herstellen einer halbleiteranordnung.
DE3519418C1 (de) * 1985-05-30 1986-07-17 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum Stapelloeten
JPH118643A (ja) * 1997-06-16 1999-01-12 Nec Corp タイミングソース切替方法及びシステム

Also Published As

Publication number Publication date
US4875618A (en) 1989-10-24
EP0265927B1 (en) 1992-04-29
EP0265927A3 (en) 1988-09-14
JPH0563020B2 (https=) 1993-09-09
EP0265927A2 (en) 1988-05-04
JPS63114138A (ja) 1988-05-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition