DE3776927D1 - Mehrschichtige platten mit zwischenlagen zur versorgung von chip-modulen fuer hohe stromstaerken. - Google Patents
Mehrschichtige platten mit zwischenlagen zur versorgung von chip-modulen fuer hohe stromstaerken.Info
- Publication number
- DE3776927D1 DE3776927D1 DE8787102192T DE3776927T DE3776927D1 DE 3776927 D1 DE3776927 D1 DE 3776927D1 DE 8787102192 T DE8787102192 T DE 8787102192T DE 3776927 T DE3776927 T DE 3776927T DE 3776927 D1 DE3776927 D1 DE 3776927D1
- Authority
- DE
- Germany
- Prior art keywords
- interlayers
- supply
- current power
- high current
- chip modules
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/838,065 US4688151A (en) | 1986-03-10 | 1986-03-10 | Multilayered interposer board for powering high current chip modules |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3776927D1 true DE3776927D1 (de) | 1992-04-09 |
Family
ID=25276163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787102192T Expired - Fee Related DE3776927D1 (de) | 1986-03-10 | 1987-02-17 | Mehrschichtige platten mit zwischenlagen zur versorgung von chip-modulen fuer hohe stromstaerken. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4688151A (de) |
EP (1) | EP0237808B1 (de) |
JP (1) | JPS62211941A (de) |
DE (1) | DE3776927D1 (de) |
Families Citing this family (64)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0257119B1 (de) * | 1986-08-22 | 1991-02-20 | Ibm Deutschland Gmbh | Integriertes Verdrahtungssystem für sehr hochintegrierte Schaltungen |
US4771366A (en) * | 1987-07-06 | 1988-09-13 | International Business Machines Corporation | Ceramic card assembly having enhanced power distribution and cooling |
US5159536A (en) * | 1988-05-13 | 1992-10-27 | Mupac Corporation | Panel board |
US5068715A (en) * | 1990-06-29 | 1991-11-26 | Digital Equipment Corporation | High-power, high-performance integrated circuit chip package |
US5061192A (en) * | 1990-12-17 | 1991-10-29 | International Business Machines Corporation | High density connector |
US5177594A (en) * | 1991-01-09 | 1993-01-05 | International Business Machines Corporation | Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance |
US5102343A (en) * | 1991-02-22 | 1992-04-07 | International Business Machines Corporation | Fluid pressure actuated electrical connector |
EP0506225A3 (en) * | 1991-03-26 | 1993-11-24 | Ibm | Integrated circuit chip package |
US5276587A (en) * | 1991-04-30 | 1994-01-04 | Sundstrand Corporation | Pivotable electrical connection apparatus |
US5199879A (en) * | 1992-02-24 | 1993-04-06 | International Business Machines Corporation | Electrical assembly with flexible circuit |
US5854534A (en) * | 1992-08-05 | 1998-12-29 | Fujitsu Limited | Controlled impedence interposer substrate |
EP0586888B1 (de) * | 1992-08-05 | 2001-07-18 | Fujitsu Limited | Dreidimensionaler Multichipmodul |
US5386627A (en) * | 1992-09-29 | 1995-02-07 | International Business Machines Corporation | Method of fabricating a multi-layer integrated circuit chip interposer |
JPH0828580B2 (ja) * | 1993-04-21 | 1996-03-21 | 日本電気株式会社 | 配線基板構造及びその製造方法 |
DE69634376D1 (de) * | 1995-05-12 | 2005-03-31 | St Microelectronics Inc | IC-Packungsfassungssystem mit niedrigem Profil |
US6509807B1 (en) | 1997-04-08 | 2003-01-21 | X2Y Attenuators, Llc | Energy conditioning circuit assembly |
US6606011B2 (en) | 1998-04-07 | 2003-08-12 | X2Y Attenuators, Llc | Energy conditioning circuit assembly |
US7042703B2 (en) * | 2000-03-22 | 2006-05-09 | X2Y Attenuators, Llc | Energy conditioning structure |
US6018448A (en) | 1997-04-08 | 2000-01-25 | X2Y Attenuators, L.L.C. | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
US7301748B2 (en) | 1997-04-08 | 2007-11-27 | Anthony Anthony A | Universal energy conditioning interposer with circuit architecture |
US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US7110227B2 (en) * | 1997-04-08 | 2006-09-19 | X2Y Attenuators, Llc | Universial energy conditioning interposer with circuit architecture |
US6603646B2 (en) | 1997-04-08 | 2003-08-05 | X2Y Attenuators, Llc | Multi-functional energy conditioner |
US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
US7336467B2 (en) * | 2000-10-17 | 2008-02-26 | X2Y Attenuators, Llc | Energy pathway arrangement |
US6650525B2 (en) * | 1997-04-08 | 2003-11-18 | X2Y Attenuators, Llc | Component carrier |
US6995983B1 (en) | 1997-04-08 | 2006-02-07 | X2Y Attenuators, Llc | Component carrier |
US20020079116A1 (en) | 2000-10-17 | 2002-06-27 | X2Y Attenuators, Llc | Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node |
US7274549B2 (en) * | 2000-12-15 | 2007-09-25 | X2Y Attenuators, Llc | Energy pathway arrangements for energy conditioning |
US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US6894884B2 (en) * | 1997-04-08 | 2005-05-17 | Xzy Attenuators, Llc | Offset pathway arrangements for energy conditioning |
US20030161086A1 (en) * | 2000-07-18 | 2003-08-28 | X2Y Attenuators, Llc | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
US7110235B2 (en) * | 1997-04-08 | 2006-09-19 | Xzy Altenuators, Llc | Arrangement for energy conditioning |
US7106570B2 (en) * | 1997-04-08 | 2006-09-12 | Xzy Altenuators, Llc | Pathway arrangement |
DE69937677T2 (de) * | 1998-04-07 | 2008-11-20 | X2Y Attenuators, L.L.C. | Bauelementeträger |
US7427816B2 (en) | 1998-04-07 | 2008-09-23 | X2Y Attenuators, Llc | Component carrier |
US6157528A (en) * | 1999-01-28 | 2000-12-05 | X2Y Attenuators, L.L.C. | Polymer fuse and filter apparatus |
JP2001102479A (ja) * | 1999-09-27 | 2001-04-13 | Toshiba Corp | 半導体集積回路装置およびその製造方法 |
US6392428B1 (en) * | 1999-11-16 | 2002-05-21 | Eaglestone Partners I, Llc | Wafer level interposer |
US7113383B2 (en) * | 2000-04-28 | 2006-09-26 | X2Y Attenuators, Llc | Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning |
US6812048B1 (en) | 2000-07-31 | 2004-11-02 | Eaglestone Partners I, Llc | Method for manufacturing a wafer-interposer assembly |
US6537831B1 (en) | 2000-07-31 | 2003-03-25 | Eaglestone Partners I, Llc | Method for selecting components for a matched set using a multi wafer interposer |
AU2001283565A1 (en) * | 2000-08-15 | 2002-02-25 | X2Y Attenuators, L.L.C. | An electrode arrangement for circuit energy conditioning |
US6483330B1 (en) | 2000-09-11 | 2002-11-19 | Eaglestone Partners I, Llc | Method for selecting components for a matched set using wafer interposers |
US6815712B1 (en) | 2000-10-02 | 2004-11-09 | Eaglestone Partners I, Llc | Method for selecting components for a matched set from a wafer-interposer assembly |
US7193831B2 (en) | 2000-10-17 | 2007-03-20 | X2Y Attenuators, Llc | Energy pathway arrangement |
US6686657B1 (en) | 2000-11-07 | 2004-02-03 | Eaglestone Partners I, Llc | Interposer for improved handling of semiconductor wafers and method of use of same |
US20020078401A1 (en) * | 2000-12-15 | 2002-06-20 | Fry Michael Andrew | Test coverage analysis system |
US20020076854A1 (en) * | 2000-12-15 | 2002-06-20 | Pierce John L. | System, method and apparatus for constructing a semiconductor wafer-interposer using B-Stage laminates |
US6524885B2 (en) * | 2000-12-15 | 2003-02-25 | Eaglestone Partners I, Llc | Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques |
US6529022B2 (en) * | 2000-12-15 | 2003-03-04 | Eaglestone Pareners I, Llc | Wafer testing interposer for a conventional package |
US6673653B2 (en) * | 2001-02-23 | 2004-01-06 | Eaglestone Partners I, Llc | Wafer-interposer using a ceramic substrate |
US7180718B2 (en) | 2003-01-31 | 2007-02-20 | X2Y Attenuators, Llc | Shielded energy conditioner |
US6839965B2 (en) * | 2003-02-06 | 2005-01-11 | R-Tec Corporation | Method of manufacturing a resistor connector |
US7440252B2 (en) | 2003-05-29 | 2008-10-21 | X2Y Attenuators, Llc | Connector related structures including an energy conditioner |
KR20060036103A (ko) | 2003-07-21 | 2006-04-27 | 엑스2와이 어테뉴에이터스, 엘.엘.씨 | 필터 어셈블리 |
WO2005065097A2 (en) | 2003-12-22 | 2005-07-21 | X2Y Attenuators, Llc | Internally shielded energy conditioner |
KR20070107746A (ko) | 2005-03-01 | 2007-11-07 | 엑스2와이 어테뉴에이터스, 엘.엘.씨 | 내부 중첩된 조절기 |
US7817397B2 (en) | 2005-03-01 | 2010-10-19 | X2Y Attenuators, Llc | Energy conditioner with tied through electrodes |
WO2006099297A2 (en) | 2005-03-14 | 2006-09-21 | X2Y Attenuators, Llc | Conditioner with coplanar conductors |
US8026777B2 (en) | 2006-03-07 | 2011-09-27 | X2Y Attenuators, Llc | Energy conditioner structures |
FR2976424B1 (fr) * | 2011-06-09 | 2013-06-28 | Valeo Sys Controle Moteur Sas | Circuit electronique, procede de fabrication et module de pilotage d'un moteur electrique correspondants |
US9984968B2 (en) | 2016-06-30 | 2018-05-29 | Semiconductor Components Industries, Llc | Semiconductor package and related methods |
CN111698829B (zh) * | 2020-06-19 | 2022-02-18 | 浪潮电子信息产业股份有限公司 | 一种电流传输装置、系统 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2740097A (en) * | 1951-04-19 | 1956-03-27 | Hughes Aircraft Co | Electrical hinge connector for circuit boards |
US3072874A (en) * | 1960-11-17 | 1963-01-08 | Sylvania Electric Prod | Chassis construction |
US4054939A (en) * | 1975-06-06 | 1977-10-18 | Elfab Corporation | Multi-layer backpanel including metal plate ground and voltage planes |
JPS53129863A (en) * | 1977-04-19 | 1978-11-13 | Fujitsu Ltd | Multilayer printed board |
US4250616A (en) * | 1979-03-23 | 1981-02-17 | Methode Electronics, Inc. | Method of producing multilayer backplane |
US4322778A (en) * | 1980-01-25 | 1982-03-30 | International Business Machines Corp. | High performance semiconductor package assembly |
JPS59202654A (ja) * | 1983-05-02 | 1984-11-16 | Nippon Telegr & Teleph Corp <Ntt> | 集積回路パツケ−ジ |
-
1986
- 1986-03-10 US US06/838,065 patent/US4688151A/en not_active Expired - Fee Related
-
1987
- 1987-02-06 JP JP62024898A patent/JPS62211941A/ja active Granted
- 1987-02-17 EP EP87102192A patent/EP0237808B1/de not_active Expired
- 1987-02-17 DE DE8787102192T patent/DE3776927D1/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0237808B1 (de) | 1992-03-04 |
JPH0477468B2 (de) | 1992-12-08 |
EP0237808A2 (de) | 1987-09-23 |
EP0237808A3 (en) | 1988-07-20 |
US4688151A (en) | 1987-08-18 |
JPS62211941A (ja) | 1987-09-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |