DE3786743D1 - Kuehlungsanordnung mit hohem waermewirkungsgrad und hoher umgebungssicherheit. - Google Patents
Kuehlungsanordnung mit hohem waermewirkungsgrad und hoher umgebungssicherheit.Info
- Publication number
- DE3786743D1 DE3786743D1 DE8787111962T DE3786743T DE3786743D1 DE 3786743 D1 DE3786743 D1 DE 3786743D1 DE 8787111962 T DE8787111962 T DE 8787111962T DE 3786743 T DE3786743 T DE 3786743T DE 3786743 D1 DE3786743 D1 DE 3786743D1
- Authority
- DE
- Germany
- Prior art keywords
- cooling arrangement
- heat efficiency
- environmental safety
- high heat
- high environmental
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title 1
- 230000007613 environmental effect Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/923,456 US4715430A (en) | 1986-10-27 | 1986-10-27 | Environmentally secure and thermally efficient heat sink assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3786743D1 true DE3786743D1 (de) | 1993-09-02 |
DE3786743T2 DE3786743T2 (de) | 1994-02-17 |
Family
ID=25448706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE87111962T Expired - Fee Related DE3786743T2 (de) | 1986-10-27 | 1987-08-18 | Kühlungsanordnung mit hohem Wärmewirkungsgrad und hoher Umgebungssicherheit. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4715430A (de) |
EP (1) | EP0265615B1 (de) |
JP (1) | JPS63111654A (de) |
DE (1) | DE3786743T2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4852646A (en) * | 1987-06-16 | 1989-08-01 | Raychem Corporation | Thermally conductive gel materials |
GB2246471B (en) * | 1988-08-23 | 1993-07-28 | Nobuo Mikoshiba | Cooling semiconductor devices |
GB2246472A (en) * | 1988-08-23 | 1992-01-29 | Nobuo Mikoshiba | Cooling semiconductor devices |
US5003429A (en) * | 1990-07-09 | 1991-03-26 | International Business Machines Corporation | Electronic assembly with enhanced heat sinking |
JPH0521670A (ja) * | 1991-07-12 | 1993-01-29 | Sumitomo Electric Ind Ltd | ヒートシンク、ヒートシンクの製造方法および製造装置 |
US5344795A (en) * | 1992-09-22 | 1994-09-06 | Microelectronics And Computer Technology Corporation | Method for encapsulating an integrated circuit using a removable heatsink support block |
US5265321A (en) * | 1992-09-22 | 1993-11-30 | Microelectronics And Computer Technology Corporation | Integrated circuit structure with heat exchanger elements secured thereto and method of making |
US5309321A (en) * | 1992-09-22 | 1994-05-03 | Microelectronics And Computer Technology Corporation | Thermally conductive screen mesh for encapsulated integrated circuit packages |
US5288203A (en) * | 1992-10-23 | 1994-02-22 | Thomas Daniel L | Low profile fan body with heat transfer characteristics |
US5484262A (en) * | 1992-10-23 | 1996-01-16 | Nidec Corporation | Low profile fan body with heat transfer characteristics |
CA2120468A1 (en) * | 1993-04-05 | 1994-10-06 | Kenneth Alan Salisbury | Electronic module containing an internally ribbed, integral heat sink and bonded, flexible printed wiring board with two-sided component population |
US5452181A (en) * | 1994-02-07 | 1995-09-19 | Nidec Corporation | Detachable apparatus for cooling integrated circuits |
US5587882A (en) * | 1995-08-30 | 1996-12-24 | Hewlett-Packard Company | Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate |
US5785116A (en) * | 1996-02-01 | 1998-07-28 | Hewlett-Packard Company | Fan assisted heat sink device |
US5740013A (en) * | 1996-07-03 | 1998-04-14 | Hewlett-Packard Company | Electronic device enclosure having electromagnetic energy containment and heat removal characteristics |
US5794685A (en) * | 1996-12-17 | 1998-08-18 | Hewlett-Packard Company | Heat sink device having radial heat and airflow paths |
DE19805930A1 (de) * | 1997-02-13 | 1998-08-20 | Furukawa Electric Co Ltd | Kühlvorrichtung |
US6275381B1 (en) * | 1998-12-10 | 2001-08-14 | International Business Machines Corporation | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof |
US6176299B1 (en) | 1999-02-22 | 2001-01-23 | Agilent Technologies, Inc. | Cooling apparatus for electronic devices |
US7397664B2 (en) * | 2006-05-22 | 2008-07-08 | Sun Microsystems, Inc. | Heatspreader for single-device and multi-device modules |
US7449775B1 (en) | 2006-05-22 | 2008-11-11 | Sun Microsystems, Inc. | Integrated thermal solution for electronic packages with materials having mismatched coefficient of thermal expansion |
JP4878981B2 (ja) * | 2006-10-18 | 2012-02-15 | トヨタ自動車株式会社 | ガス分析装置 |
CN101277599A (zh) * | 2007-03-30 | 2008-10-01 | 富准精密工业(深圳)有限公司 | 散热装置 |
KR102270980B1 (ko) | 2017-01-12 | 2021-06-29 | 다이슨 테크놀러지 리미티드 | 휴대용 기구 |
GB2562276B (en) * | 2017-05-10 | 2021-04-28 | Dyson Technology Ltd | A heater |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3414775A (en) * | 1967-03-03 | 1968-12-03 | Ibm | Heat dissipating module assembly and method |
US4483389A (en) * | 1982-03-10 | 1984-11-20 | International Business Machines Corporation | Telescoping thermal conduction element for semiconductor devices |
JPS5944854A (ja) * | 1982-09-06 | 1984-03-13 | Mitsubishi Electric Corp | 半導体モジユ−ル装置 |
US4561011A (en) * | 1982-10-05 | 1985-12-24 | Mitsubishi Denki Kabushiki Kaisha | Dimensionally stable semiconductor device |
US4607685A (en) * | 1984-07-06 | 1986-08-26 | Burroughs Corporation | Heat sink for integrated circuit package |
-
1986
- 1986-10-27 US US06/923,456 patent/US4715430A/en not_active Expired - Fee Related
-
1987
- 1987-07-09 JP JP62169947A patent/JPS63111654A/ja active Granted
- 1987-08-18 EP EP87111962A patent/EP0265615B1/de not_active Expired - Lifetime
- 1987-08-18 DE DE87111962T patent/DE3786743T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0265615B1 (de) | 1993-07-28 |
JPH0454381B2 (de) | 1992-08-31 |
DE3786743T2 (de) | 1994-02-17 |
US4715430A (en) | 1987-12-29 |
EP0265615A3 (en) | 1988-10-05 |
EP0265615A2 (de) | 1988-05-04 |
JPS63111654A (ja) | 1988-05-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |