EP0265615A3 - Environmentally secure and thermally efficient heat sink assembly - Google Patents
Environmentally secure and thermally efficient heat sink assembly Download PDFInfo
- Publication number
- EP0265615A3 EP0265615A3 EP87111962A EP87111962A EP0265615A3 EP 0265615 A3 EP0265615 A3 EP 0265615A3 EP 87111962 A EP87111962 A EP 87111962A EP 87111962 A EP87111962 A EP 87111962A EP 0265615 A3 EP0265615 A3 EP 0265615A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat sink
- efficient heat
- sink assembly
- thermally efficient
- environmentally secure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US923456 | 1986-10-27 | ||
US06/923,456 US4715430A (en) | 1986-10-27 | 1986-10-27 | Environmentally secure and thermally efficient heat sink assembly |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0265615A2 EP0265615A2 (en) | 1988-05-04 |
EP0265615A3 true EP0265615A3 (en) | 1988-10-05 |
EP0265615B1 EP0265615B1 (en) | 1993-07-28 |
Family
ID=25448706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP87111962A Expired - Lifetime EP0265615B1 (en) | 1986-10-27 | 1987-08-18 | Environmentally secure and thermally efficient heat sink assembly |
Country Status (4)
Country | Link |
---|---|
US (1) | US4715430A (en) |
EP (1) | EP0265615B1 (en) |
JP (1) | JPS63111654A (en) |
DE (1) | DE3786743T2 (en) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4852646A (en) * | 1987-06-16 | 1989-08-01 | Raychem Corporation | Thermally conductive gel materials |
GB2246471B (en) * | 1988-08-23 | 1993-07-28 | Nobuo Mikoshiba | Cooling semiconductor devices |
GB2246472A (en) * | 1988-08-23 | 1992-01-29 | Nobuo Mikoshiba | Cooling semiconductor devices |
US5003429A (en) * | 1990-07-09 | 1991-03-26 | International Business Machines Corporation | Electronic assembly with enhanced heat sinking |
JPH0521670A (en) * | 1991-07-12 | 1993-01-29 | Sumitomo Electric Ind Ltd | Heat sink, and method and apparatus for manufacture thereof |
US5309321A (en) * | 1992-09-22 | 1994-05-03 | Microelectronics And Computer Technology Corporation | Thermally conductive screen mesh for encapsulated integrated circuit packages |
US5344795A (en) * | 1992-09-22 | 1994-09-06 | Microelectronics And Computer Technology Corporation | Method for encapsulating an integrated circuit using a removable heatsink support block |
US5265321A (en) * | 1992-09-22 | 1993-11-30 | Microelectronics And Computer Technology Corporation | Integrated circuit structure with heat exchanger elements secured thereto and method of making |
US5484262A (en) * | 1992-10-23 | 1996-01-16 | Nidec Corporation | Low profile fan body with heat transfer characteristics |
US5288203A (en) * | 1992-10-23 | 1994-02-22 | Thomas Daniel L | Low profile fan body with heat transfer characteristics |
CA2120468A1 (en) * | 1993-04-05 | 1994-10-06 | Kenneth Alan Salisbury | Electronic module containing an internally ribbed, integral heat sink and bonded, flexible printed wiring board with two-sided component population |
US5452181A (en) * | 1994-02-07 | 1995-09-19 | Nidec Corporation | Detachable apparatus for cooling integrated circuits |
US5587882A (en) * | 1995-08-30 | 1996-12-24 | Hewlett-Packard Company | Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate |
US5785116A (en) * | 1996-02-01 | 1998-07-28 | Hewlett-Packard Company | Fan assisted heat sink device |
US5740013A (en) * | 1996-07-03 | 1998-04-14 | Hewlett-Packard Company | Electronic device enclosure having electromagnetic energy containment and heat removal characteristics |
US5794685A (en) * | 1996-12-17 | 1998-08-18 | Hewlett-Packard Company | Heat sink device having radial heat and airflow paths |
US6082443A (en) * | 1997-02-13 | 2000-07-04 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
US6275381B1 (en) * | 1998-12-10 | 2001-08-14 | International Business Machines Corporation | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof |
US6176299B1 (en) | 1999-02-22 | 2001-01-23 | Agilent Technologies, Inc. | Cooling apparatus for electronic devices |
US7449775B1 (en) | 2006-05-22 | 2008-11-11 | Sun Microsystems, Inc. | Integrated thermal solution for electronic packages with materials having mismatched coefficient of thermal expansion |
US7397664B2 (en) * | 2006-05-22 | 2008-07-08 | Sun Microsystems, Inc. | Heatspreader for single-device and multi-device modules |
JP4878981B2 (en) * | 2006-10-18 | 2012-02-15 | トヨタ自動車株式会社 | Gas analyzer |
CN101277599A (en) * | 2007-03-30 | 2008-10-01 | 富准精密工业(深圳)有限公司 | Cooling device |
EP3568038B1 (en) | 2017-01-12 | 2023-09-06 | Dyson Technology Limited | A hand held appliance |
GB2562276B (en) * | 2017-05-10 | 2021-04-28 | Dyson Technology Ltd | A heater |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4561011A (en) * | 1982-10-05 | 1985-12-24 | Mitsubishi Denki Kabushiki Kaisha | Dimensionally stable semiconductor device |
WO1986000754A1 (en) * | 1984-07-06 | 1986-01-30 | Burroughs Corporation | Heat sink for integrated circuit package |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3414775A (en) * | 1967-03-03 | 1968-12-03 | Ibm | Heat dissipating module assembly and method |
US4483389A (en) * | 1982-03-10 | 1984-11-20 | International Business Machines Corporation | Telescoping thermal conduction element for semiconductor devices |
JPS5944854A (en) * | 1982-09-06 | 1984-03-13 | Mitsubishi Electric Corp | Semiconductor module device |
-
1986
- 1986-10-27 US US06/923,456 patent/US4715430A/en not_active Expired - Fee Related
-
1987
- 1987-07-09 JP JP62169947A patent/JPS63111654A/en active Granted
- 1987-08-18 EP EP87111962A patent/EP0265615B1/en not_active Expired - Lifetime
- 1987-08-18 DE DE87111962T patent/DE3786743T2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4561011A (en) * | 1982-10-05 | 1985-12-24 | Mitsubishi Denki Kabushiki Kaisha | Dimensionally stable semiconductor device |
WO1986000754A1 (en) * | 1984-07-06 | 1986-01-30 | Burroughs Corporation | Heat sink for integrated circuit package |
Non-Patent Citations (2)
Title |
---|
IBM TECHNICAL DISCLOSURE BULLETIN, vol. 22, no. 6, November 1979, pages 2294-2296, New York, US; A.J. ARNOLD: "Structure for the removal of heat from an intergrated circuit module" * |
IBM TECHNICAL DISCLOSURE BULLETIN, vol. 27, no. 4A, September 1984, pages 1880-1881, New York, US; H. GRUBER et al.: "Heat sink for thermal conduction module" * |
Also Published As
Publication number | Publication date |
---|---|
JPS63111654A (en) | 1988-05-16 |
DE3786743T2 (en) | 1994-02-17 |
EP0265615B1 (en) | 1993-07-28 |
EP0265615A2 (en) | 1988-05-04 |
DE3786743D1 (en) | 1993-09-02 |
JPH0454381B2 (en) | 1992-08-31 |
US4715430A (en) | 1987-12-29 |
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Legal Events
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: KIRBY, DIANE NEIL Inventor name: ARNOLD, ALLEN JOSEPH Inventor name: SUTTON, KERRY LOUIS Inventor name: COURTNEY, MARK GERARD Inventor name: MIS, KATHERINE HEINZ |
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