GB8629541D0 - Heat sink - Google Patents

Heat sink

Info

Publication number
GB8629541D0
GB8629541D0 GB8629541A GB8629541A GB8629541D0 GB 8629541 D0 GB8629541 D0 GB 8629541D0 GB 8629541 A GB8629541 A GB 8629541A GB 8629541 A GB8629541 A GB 8629541A GB 8629541 D0 GB8629541 D0 GB 8629541D0
Authority
GB
United Kingdom
Prior art keywords
heat sink
sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8629541A
Other versions
GB2184887A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marston Palmer Ltd
Original Assignee
Marston Palmer Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marston Palmer Ltd filed Critical Marston Palmer Ltd
Publication of GB8629541D0 publication Critical patent/GB8629541D0/en
Publication of GB2184887A publication Critical patent/GB2184887A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB8629541A 1985-12-21 1986-12-10 Heat sink Withdrawn GB2184887A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8531565A GB8531565D0 (en) 1985-12-21 1985-12-21 Heat sink

Publications (2)

Publication Number Publication Date
GB8629541D0 true GB8629541D0 (en) 1987-01-21
GB2184887A GB2184887A (en) 1987-07-01

Family

ID=10590144

Family Applications (2)

Application Number Title Priority Date Filing Date
GB8531565A Pending GB8531565D0 (en) 1985-12-21 1985-12-21 Heat sink
GB8629541A Withdrawn GB2184887A (en) 1985-12-21 1986-12-10 Heat sink

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB8531565A Pending GB8531565D0 (en) 1985-12-21 1985-12-21 Heat sink

Country Status (1)

Country Link
GB (2) GB8531565D0 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4729426A (en) * 1986-03-06 1988-03-08 Thermalloy Incorporated Bonded clip heat sink
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
GB8700843D0 (en) * 1987-01-15 1987-02-18 Marston Palmer Ltd Heat sink
US4982783A (en) * 1988-11-22 1991-01-08 Varian Associates, Inc. Self-tightening heat sink
DE69530490D1 (en) * 1995-11-30 2003-05-28 St Microelectronics Srl Heat sink for electronic arrangements
GB2316235A (en) * 1996-08-09 1998-02-18 Motorola Israel Ltd Heat sink and grounding arrangement
IT1292590B1 (en) * 1997-05-30 1999-02-08 El Bo Mec S R L HEAT SINK, IN PARTICULAR FOR ELECTRONIC COMPONENTS.
US5869897A (en) * 1997-10-22 1999-02-09 Ericcson, Inc. Mounting arrangement for securing an intergrated circuit package to heat sink
US6055158A (en) * 1999-03-16 2000-04-25 Framatome Connectors Interlock, Inc. Electronic component heat sink assembly
US6249436B1 (en) * 1999-08-30 2001-06-19 Sun Microsystems, Inc. Wire heat sink assembly and method of assembling
CN102404974A (en) * 2010-09-13 2012-04-04 延锋伟世通汽车电子有限公司 Novel radiator of automobile power amplifier
CN205864940U (en) 2016-07-22 2017-01-04 台达电子工业股份有限公司 Heat sink assembly

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3293508A (en) * 1964-04-21 1966-12-20 Int Rectifier Corp Compression connected semiconductor device
US3793570A (en) * 1968-09-26 1974-02-19 Gen Motors Corp Compact power semiconductor device and method of making same
US4004195A (en) * 1975-05-12 1977-01-18 Rca Corporation Heat-sink assembly for high-power stud-mounted semiconductor device
JPS59208762A (en) * 1983-05-09 1984-11-27 インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン Device for contacting under pressure solid state unit with heat sink member
GB8421499D0 (en) * 1984-08-24 1984-09-26 British Telecomm Heat sink

Also Published As

Publication number Publication date
GB2184887A (en) 1987-07-01
GB8531565D0 (en) 1986-02-05

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)