DE3770572D1 - Flussmittel, loetpaste und loetung mit loetpaste. - Google Patents

Flussmittel, loetpaste und loetung mit loetpaste.

Info

Publication number
DE3770572D1
DE3770572D1 DE8787115482T DE3770572T DE3770572D1 DE 3770572 D1 DE3770572 D1 DE 3770572D1 DE 8787115482 T DE8787115482 T DE 8787115482T DE 3770572 T DE3770572 T DE 3770572T DE 3770572 D1 DE3770572 D1 DE 3770572D1
Authority
DE
Germany
Prior art keywords
solder paste
flux
solder
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787115482T
Other languages
English (en)
Inventor
Masayuki Fujitsu Limite Ochiai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3770572D1 publication Critical patent/DE3770572D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
DE8787115482T 1986-10-23 1987-10-22 Flussmittel, loetpaste und loetung mit loetpaste. Expired - Fee Related DE3770572D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25075686 1986-10-23

Publications (1)

Publication Number Publication Date
DE3770572D1 true DE3770572D1 (de) 1991-07-11

Family

ID=17212571

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787115482T Expired - Fee Related DE3770572D1 (de) 1986-10-23 1987-10-22 Flussmittel, loetpaste und loetung mit loetpaste.

Country Status (4)

Country Link
US (1) US4759490A (de)
EP (1) EP0264939B1 (de)
JP (1) JPS63220992A (de)
DE (1) DE3770572D1 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8628916D0 (en) * 1986-12-03 1987-01-07 Multicore Solders Ltd Solder composition
DE3713553C1 (de) * 1987-04-23 1988-09-15 Alpha Grillo Lotsysteme Gmbh Halogenfreies Flussmittelgemisch und seine Verwendung
US5046658A (en) * 1989-07-27 1991-09-10 At&T Bell Laboratories Method and apparatus for soldering articles
US5064480A (en) * 1989-08-04 1991-11-12 Quantum Materials, Inc. Water washable soldering paste
US5141568A (en) * 1990-05-15 1992-08-25 Hughes Aircraft Company Water-soluble soldering paste
US5190208A (en) * 1990-05-15 1993-03-02 Hughes Aircraft Company Foaming flux for automatic soldering process
US5452840A (en) * 1990-05-15 1995-09-26 Hughes Aircraft Company Water-soluble soldering flux
US5192360A (en) * 1990-05-15 1993-03-09 Hughes Aircraft Company Water-soluble flux for cored solder
US5198038A (en) * 1990-05-15 1993-03-30 Hughes Aircraft Company Foaming flux for automatic soldering process
US5045128A (en) * 1990-08-13 1991-09-03 Motorola, Inc. Solder fluxes bearing oxide removers generated by light
JPH04220192A (ja) * 1990-12-14 1992-08-11 Senju Metal Ind Co Ltd 低残渣はんだペースト
JP2608995B2 (ja) * 1991-02-12 1997-05-14 松下電器産業株式会社 光ビーム加熱半田用ソルダーペースト
US5150832A (en) * 1991-06-28 1992-09-29 At&T Bell Laboratories Solder paste
US5318651A (en) * 1991-11-27 1994-06-07 Nec Corporation Method of bonding circuit boards
GB2287253B (en) * 1992-03-19 1996-04-03 Fujitsu Ltd Removal of oxide film from a metal
FR2688727B1 (fr) * 1992-03-19 1996-03-15 Fujitsu Ltd Procedes pour rendre spherique une particule metallique et pour eliminer un film d'oxyde, pate a souder et procede de soudure.
US5297721A (en) * 1992-11-19 1994-03-29 Fry's Metals, Inc. No-clean soldering flux and method using the same
US5539153A (en) * 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
US5571340A (en) * 1994-09-09 1996-11-05 Fry's Metals, Inc. Rosin-free, low VOC, no-clean soldering flux and method using the same
US5778638A (en) * 1996-03-06 1998-07-14 Mitsubishi Gas Chemical Company, Inc. Process for preserving solder paste
US6027957A (en) * 1996-06-27 2000-02-22 University Of Maryland Controlled solder interdiffusion for high power semiconductor laser diode die bonding
DE19633486C1 (de) 1996-08-20 1998-01-15 Heraeus Sensor Nite Gmbh Verfahren zur Herstellung einer Leiterplatte mit dünnen Leiterbahnen und Anschluß-Kontaktierungsbereichen sowie deren Verwendung
US20020046627A1 (en) 1998-06-10 2002-04-25 Hitoshi Amita Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product
US6331076B1 (en) 1998-10-30 2001-12-18 Manufacturers' Services Ltd. Solder paste with a time-temperature indicator
JP4506550B2 (ja) * 2004-08-04 2010-07-21 株式会社デンソー 金属接続方法
US7767032B2 (en) * 2006-06-30 2010-08-03 W.C. Heraeus Holding GmbH No-clean low-residue solder paste for semiconductor device applications
CN101347874B (zh) * 2008-08-19 2011-04-06 深圳悍豹科技有限公司 调谐器专用低温节能无铅锡膏
CN103706961B (zh) * 2012-09-28 2016-08-03 钟广飞 无卤素锡膏
CN104289827B (zh) * 2014-09-12 2017-01-18 上海三思电子工程有限公司 一种助焊剂和焊膏
CN104646865A (zh) * 2014-12-26 2015-05-27 苏州龙腾万里化工科技有限公司 新型环保耐高温热风整平助焊剂

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2064801A5 (de) * 1969-08-26 1971-07-23 Du Pont
US4373974A (en) * 1981-04-02 1983-02-15 Mcdonnell Douglas Corporation Solder composition
US4505421A (en) * 1981-10-05 1985-03-19 Raychem Corporation Soldering methods and devices
US4504007A (en) * 1982-09-14 1985-03-12 International Business Machines Corporation Solder and braze fluxes and processes for using the same
JPS60101995A (ja) * 1983-11-07 1985-06-06 ソニー株式会社 プリント基板のチツプ部品実装方法
US4650108A (en) * 1985-08-15 1987-03-17 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for forming hermetic seals

Also Published As

Publication number Publication date
EP0264939A1 (de) 1988-04-27
JPS63220992A (ja) 1988-09-14
US4759490A (en) 1988-07-26
JPH0375277B2 (de) 1991-11-29
EP0264939B1 (de) 1991-06-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee