DE3788589D1 - Lötverfahren und Gerät. - Google Patents
Lötverfahren und Gerät.Info
- Publication number
- DE3788589D1 DE3788589D1 DE87103203T DE3788589T DE3788589D1 DE 3788589 D1 DE3788589 D1 DE 3788589D1 DE 87103203 T DE87103203 T DE 87103203T DE 3788589 T DE3788589 T DE 3788589T DE 3788589 D1 DE3788589 D1 DE 3788589D1
- Authority
- DE
- Germany
- Prior art keywords
- soldering process
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/751—Means for controlling the bonding environment, e.g. valves, vacuum pumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/856,516 US4747533A (en) | 1986-04-28 | 1986-04-28 | Bonding method and apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3788589D1 true DE3788589D1 (de) | 1994-02-10 |
DE3788589T2 DE3788589T2 (de) | 1994-06-30 |
Family
ID=25323824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3788589T Expired - Fee Related DE3788589T2 (de) | 1986-04-28 | 1987-03-06 | Lötverfahren und Gerät. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4747533A (de) |
EP (1) | EP0243621B1 (de) |
JP (1) | JPS62257737A (de) |
DE (1) | DE3788589T2 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5102028A (en) * | 1990-04-02 | 1992-04-07 | International Business Machines Corporation | Localized soldering station using state changing medium |
DE4024181C1 (en) * | 1990-07-30 | 1992-02-13 | Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De | Vapour phase soldering installation - has valve in by=pass opening in dependence on preset temp. of sec. medium in soldering tank |
JP4271299B2 (ja) * | 1999-06-28 | 2009-06-03 | 光洋サーモシステム株式会社 | リフロー炉 |
DE50214298D1 (de) * | 2001-06-20 | 2010-05-06 | Alstom Technology Ltd | Lötverbindung und Verfahren zur Herstellung einer Lötverbindung |
JP2007180447A (ja) * | 2005-12-28 | 2007-07-12 | Toyota Industries Corp | 半田付け方法、半田付け装置、及び半導体装置の製造方法 |
JP4640170B2 (ja) * | 2005-12-28 | 2011-03-02 | 株式会社豊田自動織機 | 半田付け方法及び半導体モジュールの製造方法並びに半田付け装置 |
JP4375491B1 (ja) * | 2008-06-23 | 2009-12-02 | 日本ジョイント株式会社 | 電子部品のはんだ付け装置およびはんだ付け方法 |
US9166139B2 (en) * | 2009-05-14 | 2015-10-20 | The Neothermal Energy Company | Method for thermally cycling an object including a polarizable material |
US11445650B2 (en) * | 2019-10-22 | 2022-09-13 | International Business Machines Corporation | Localized rework using liquid media soldering |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US30399A (en) * | 1860-10-16 | Gas-kegttlatob | ||
US3054174A (en) * | 1958-05-13 | 1962-09-18 | Rca Corp | Method for making semiconductor devices |
US3825994A (en) * | 1972-11-15 | 1974-07-30 | Rca Corp | Method of soldering circuit components to a substrate |
US4077467A (en) * | 1976-01-28 | 1978-03-07 | Spigarelli Donald J | Method and apparatus for soldering, fusing or brazing |
US4055217A (en) * | 1976-02-02 | 1977-10-25 | Western Electric Company, Inc. | Method for maintaining a vapor blanket in a condensation heating facility |
NL7805800A (nl) * | 1978-05-29 | 1979-12-03 | Philips Nv | Werkwijze en inrichting voor het solderen van onderde- len op een gatloos dikke-film substraat alsmede dikke-film substraat met onderdelen gesoldeerd met de werkwijze. |
US4334646A (en) * | 1980-04-17 | 1982-06-15 | Harris Corporation | Method of solder reflow assembly |
DE3040274C2 (de) * | 1980-10-23 | 1983-06-09 | ERSA Ernst Sachs KG, GmbH & Co, 6980 Wertheim | Vorrichtung zum Auslöten elektronischer Bauteile aus Leiterplatten |
JPS57141993A (en) * | 1981-02-25 | 1982-09-02 | Matsushita Electric Ind Co Ltd | Printed circuit board mounted with chip part and method of mounting chip part on printed circuit board |
US4441647A (en) * | 1982-06-04 | 1984-04-10 | Northern Telecom Limited | Resoldering tool for ceramic substrate hybrid electronic circuits |
US4474322A (en) * | 1982-11-12 | 1984-10-02 | Epe Corporation | Displacement soldering device |
GB8312503D0 (en) * | 1983-05-06 | 1983-06-08 | Isc Chemicals Ltd | Vapour phase soldering |
US4538757A (en) * | 1983-08-01 | 1985-09-03 | Motorola, Inc. | Wave soldering in a reducing atmosphere |
FR2556083B1 (fr) * | 1983-10-11 | 1986-04-25 | Piezo Ceram Electronique | Machine perfectionnee de chauffage d'un article ou produit par condensation de vapeur sur celui-ci |
US4561584A (en) * | 1983-10-17 | 1985-12-31 | Storage Technology Partners | Integrated circuit package removal |
US4561586A (en) * | 1984-09-04 | 1985-12-31 | Burroughs Corporation | Method of removing a soldered integrated circuit package from a printed circuit board |
US4580716A (en) * | 1984-10-17 | 1986-04-08 | Rca Corporation | Apparatus and method for vapor phase solder reflow |
JPS6264475A (ja) * | 1985-09-17 | 1987-03-23 | Kenji Kondo | 物品の融着接合装置 |
-
1986
- 1986-04-28 US US06/856,516 patent/US4747533A/en not_active Expired - Fee Related
-
1987
- 1987-03-03 JP JP62046944A patent/JPS62257737A/ja active Granted
- 1987-03-06 EP EP87103203A patent/EP0243621B1/de not_active Expired - Lifetime
- 1987-03-06 DE DE3788589T patent/DE3788589T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0243621A2 (de) | 1987-11-04 |
JPS62257737A (ja) | 1987-11-10 |
EP0243621A3 (en) | 1990-05-16 |
EP0243621B1 (de) | 1993-12-29 |
JPH0432542B2 (de) | 1992-05-29 |
US4747533A (en) | 1988-05-31 |
DE3788589T2 (de) | 1994-06-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3678816D1 (de) | Anzeigevorrichtung und herstellungsverfahren. | |
IT1227045B (it) | Dispositivo e procedimento di filtrazione. | |
DE3763336D1 (de) | Tragevorrichtung. | |
DE3782991T2 (de) | Cvd-verfahren und vorrichtung. | |
DE294214T1 (de) | Coexstrusions-vorrichtung und -verfahren. | |
DE3689538T2 (de) | Integrierte Schaltung und Optimierungsverfahren dafür. | |
DE3889649D1 (de) | Ätzverfahren und -gerät. | |
DE3780664D1 (de) | Epitaxiewachstumsverfahren und vorrichtung. | |
DE3650246T2 (de) | Entwicklungsverfahren und Gerät. | |
DE3886910T2 (de) | Emulgierungsverfahren und -vorrichtung. | |
IT8720296A0 (it) | Procedimento e dispositivo per cordonare. | |
DE3580752D1 (de) | Groessenvariables intrauterinpessar und empfaengnisverhuetende vorrichtung. | |
DE3778212D1 (de) | Elektronisches handetikettiergeraet. | |
DE3861876D1 (de) | Vollformverfahren und -vorrichtung. | |
DE3880246T2 (de) | Reinigungsverfahren und Gerät dafür. | |
DE3788589T2 (de) | Lötverfahren und Gerät. | |
NO872951D0 (no) | Fremgangsmaate og anordning for orientering av boks-ender. | |
DE3781601D1 (de) | Elektronisches handetikettiergeraet. | |
DE3771768D1 (de) | Nachweismethode und geraet. | |
DE3668789D1 (de) | Vorrichtung und destillationsverfahren. | |
DE69001135D1 (de) | Loetverfahren und loetgeraet. | |
DE3771103D1 (de) | Loetvorrichtung. | |
DE3784108D1 (de) | Bilderzeugungsverfahren und geraet dafuer. | |
DE3879767D1 (de) | Drahtversorgungsverfahren und geraet. | |
DE3780699D1 (de) | Loetverfahren. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |