DE69001135D1 - Loetverfahren und loetgeraet. - Google Patents

Loetverfahren und loetgeraet.

Info

Publication number
DE69001135D1
DE69001135D1 DE9090300242T DE69001135T DE69001135D1 DE 69001135 D1 DE69001135 D1 DE 69001135D1 DE 9090300242 T DE9090300242 T DE 9090300242T DE 69001135 T DE69001135 T DE 69001135T DE 69001135 D1 DE69001135 D1 DE 69001135D1
Authority
DE
Germany
Prior art keywords
soldering
soldering device
soldering method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9090300242T
Other languages
English (en)
Other versions
DE69001135T2 (de
Inventor
Eishu Nagata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE69001135D1 publication Critical patent/DE69001135D1/de
Application granted granted Critical
Publication of DE69001135T2 publication Critical patent/DE69001135T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0607Solder feeding devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
DE9090300242T 1989-01-10 1990-01-09 Loetverfahren und loetgeraet. Expired - Lifetime DE69001135T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1002041A JP2726936B2 (ja) 1989-01-10 1989-01-10 ハンダ付け方法およびハンダ付け装置

Publications (2)

Publication Number Publication Date
DE69001135D1 true DE69001135D1 (de) 1993-04-29
DE69001135T2 DE69001135T2 (de) 1993-09-16

Family

ID=11518241

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9090300242T Expired - Lifetime DE69001135T2 (de) 1989-01-10 1990-01-09 Loetverfahren und loetgeraet.

Country Status (4)

Country Link
US (1) US5038995A (de)
EP (1) EP0378369B1 (de)
JP (1) JP2726936B2 (de)
DE (1) DE69001135T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT398921B (de) * 1992-05-08 1995-02-27 Kroes Helmut Ing Lötkopf
JP3314088B2 (ja) * 1992-06-08 2002-08-12 栄修 永田 ハンダ付け方法およびハンダ付け装置
JP3307777B2 (ja) * 1994-07-07 2002-07-24 栄修 永田 ハンダ付け方法および装置
JP4346054B2 (ja) * 2000-01-18 2009-10-14 栄修 永田 ハンダ付け方法およびハンダ付け装置
SG91867A1 (en) * 2000-05-24 2002-10-15 Casem Asia Pte Ltd Improved apparatus and method for dispensing solder

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2415542A (en) * 1942-02-07 1947-02-11 Vawryk Mike Soldering iron
US3015137A (en) * 1957-09-03 1962-01-02 Cyril J Hoebing Fishing sinker molding apparatus
DE2348081C2 (de) * 1973-09-25 1984-08-09 Hans 5500 Trier Jaklin Verwendung einer Bariumverbindung als Zusatz zu Beton- und Mörtelmischungen
US4595816A (en) * 1984-08-31 1986-06-17 Westinghouse Electric Corp. Automated soldering process and apparatus
JPH0777665B2 (ja) * 1986-05-16 1995-08-23 栄修 永田 ハンダ付け方法およびハンダ付け装置

Also Published As

Publication number Publication date
EP0378369A2 (de) 1990-07-18
EP0378369A3 (en) 1990-08-22
EP0378369B1 (de) 1993-03-24
JPH02182373A (ja) 1990-07-17
US5038995A (en) 1991-08-13
JP2726936B2 (ja) 1998-03-11
DE69001135T2 (de) 1993-09-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition