DE3752290T2 - Eine Methode, um einen Photolack von einer Aluminiumlegierung zu entfernen - Google Patents
Eine Methode, um einen Photolack von einer Aluminiumlegierung zu entfernenInfo
- Publication number
- DE3752290T2 DE3752290T2 DE3752290T DE3752290T DE3752290T2 DE 3752290 T2 DE3752290 T2 DE 3752290T2 DE 3752290 T DE3752290 T DE 3752290T DE 3752290 T DE3752290 T DE 3752290T DE 3752290 T2 DE3752290 T2 DE 3752290T2
- Authority
- DE
- Germany
- Prior art keywords
- photoresist
- remove
- aluminum alloy
- alloy
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000838 Al alloy Inorganic materials 0.000 title 1
- 229920002120 photoresistant polymer Polymers 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/427—Stripping or agents therefor using plasma means only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
- H01L21/31138—Etching organic layers by chemical means by dry-etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61124123A JPS62281331A (ja) | 1986-05-29 | 1986-05-29 | エツチング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3752290D1 DE3752290D1 (de) | 1999-09-30 |
DE3752290T2 true DE3752290T2 (de) | 2000-01-27 |
Family
ID=14877494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3752290T Expired - Fee Related DE3752290T2 (de) | 1986-05-29 | 1987-05-27 | Eine Methode, um einen Photolack von einer Aluminiumlegierung zu entfernen |
Country Status (5)
Country | Link |
---|---|
US (2) | US6184148B1 (de) |
EP (1) | EP0247603B1 (de) |
JP (1) | JPS62281331A (de) |
KR (2) | KR900004053B1 (de) |
DE (1) | DE3752290T2 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2728483B2 (ja) * | 1989-02-01 | 1998-03-18 | 株式会社日立製作所 | 試料後処理方法と装置 |
US5868854A (en) * | 1989-02-27 | 1999-02-09 | Hitachi, Ltd. | Method and apparatus for processing samples |
US6989228B2 (en) | 1989-02-27 | 2006-01-24 | Hitachi, Ltd | Method and apparatus for processing samples |
US6077788A (en) * | 1989-02-27 | 2000-06-20 | Hitachi, Ltd. | Method and apparatus for processing samples |
EP0809283A3 (de) * | 1989-08-28 | 1998-02-25 | Hitachi, Ltd. | Verfahren zur Behandlung von Scheiben |
JPH0464234A (ja) * | 1990-07-04 | 1992-02-28 | Mitsubishi Electric Corp | 配線パターンの形成方法 |
JP2663704B2 (ja) * | 1990-10-30 | 1997-10-15 | 日本電気株式会社 | Al合金の腐食防止法 |
EP0709877A4 (de) * | 1993-05-20 | 1997-11-26 | Hitachi Ltd | Verfahren für plasma-behandlung |
US5382316A (en) * | 1993-10-29 | 1995-01-17 | Applied Materials, Inc. | Process for simultaneous removal of photoresist and polysilicon/polycide etch residues from an integrated circuit structure |
FR2720855B1 (fr) * | 1993-12-28 | 1998-03-27 | Fujitsu Ltd | Procédé de fabrication de fispositifs à semiconducteurs dotés d'un câblage en aluminium par exposition du substrat à une solution réactive. |
US6060397A (en) * | 1995-07-14 | 2000-05-09 | Applied Materials, Inc. | Gas chemistry for improved in-situ cleaning of residue for a CVD apparatus |
US6080270A (en) * | 1997-07-14 | 2000-06-27 | Lam Research Corporation | Compact microwave downstream plasma system |
US6451217B1 (en) * | 1998-06-09 | 2002-09-17 | Speedfam-Ipec Co., Ltd. | Wafer etching method |
JP3170783B2 (ja) * | 1998-07-09 | 2001-05-28 | 日本電気株式会社 | 半導体装置の配線形成方法及び製造装置 |
US20050022839A1 (en) * | 1999-10-20 | 2005-02-03 | Savas Stephen E. | Systems and methods for photoresist strip and residue treatment in integrated circuit manufacturing |
US6660646B1 (en) * | 2000-09-21 | 2003-12-09 | Northrop Grumman Corporation | Method for plasma hardening photoresist in etching of semiconductor and superconductor films |
US20020142612A1 (en) * | 2001-03-30 | 2002-10-03 | Han-Ming Wu | Shielding plate in plasma for uniformity improvement |
KR100928098B1 (ko) * | 2002-12-24 | 2009-11-24 | 동부일렉트로닉스 주식회사 | 산화막을 이용한 메탈라인 형성방법 |
US20070193602A1 (en) * | 2004-07-12 | 2007-08-23 | Savas Stephen E | Systems and Methods for Photoresist Strip and Residue Treatment in Integrated Circuit Manufacturing |
KR100734778B1 (ko) | 2005-08-25 | 2007-07-03 | 세메스 주식회사 | 플라즈마를 이용한 기판 처리 장치 및 방법 |
US20080061112A1 (en) * | 2006-09-07 | 2008-03-13 | Shih-Ju Liang | Method for soldering charge coupled device and tooling thereof |
CN102226635B (zh) * | 2011-06-09 | 2013-02-27 | 四川宏普微波科技有限公司 | 一种微波连续冻干装置 |
CN102929110B (zh) * | 2012-11-06 | 2014-03-19 | 中国科学院微电子研究所 | 一种微波激发的超临界干燥装置及方法 |
US10866516B2 (en) | 2016-08-05 | 2020-12-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Metal-compound-removing solvent and method in lithography |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53112065A (en) * | 1977-03-11 | 1978-09-30 | Toshiba Corp | Removing method of high molecular compound |
US4183781A (en) * | 1978-09-25 | 1980-01-15 | International Business Machines Corporation | Stabilization process for aluminum microcircuits which have been reactive-ion etched |
JPS5852324B2 (ja) * | 1979-10-11 | 1983-11-22 | 富士通株式会社 | 半導体装置の製造方法 |
JPS57170534A (en) * | 1981-04-15 | 1982-10-20 | Hitachi Ltd | Dry etching method for aluminum and aluminum alloy |
US4370195A (en) * | 1982-03-25 | 1983-01-25 | Rca Corporation | Removal of plasma etching residues |
US4718976A (en) * | 1982-03-31 | 1988-01-12 | Fujitsu Limited | Process and apparatus for plasma treatment |
JPS593927A (ja) * | 1982-06-29 | 1984-01-10 | Fujitsu Ltd | 薄膜のエツチング方法 |
JPS59186326A (ja) * | 1983-04-06 | 1984-10-23 | Hitachi Ltd | プラズマ処理装置 |
JPS59210644A (ja) * | 1983-05-16 | 1984-11-29 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
JPS6016424A (ja) * | 1983-07-08 | 1985-01-28 | Fujitsu Ltd | マイクロ波プラズマ処理方法及びその装置 |
JPS6130036A (ja) * | 1984-07-23 | 1986-02-12 | Fujitsu Ltd | マイクロ波プラズマ処理装置 |
US4592800A (en) * | 1984-11-02 | 1986-06-03 | Oerlikon-Buhrle U.S.A. Inc. | Method of inhibiting corrosion after aluminum etching |
US4631105A (en) * | 1985-04-22 | 1986-12-23 | Branson International Plasma Corporation | Plasma etching apparatus |
US4699689A (en) * | 1985-05-17 | 1987-10-13 | Emergent Technologies Corporation | Method and apparatus for dry processing of substrates |
JPH0722153B2 (ja) * | 1985-09-09 | 1995-03-08 | 日本電信電話株式会社 | ドライエツチング方法および装置 |
US4632719A (en) * | 1985-09-18 | 1986-12-30 | Varian Associates, Inc. | Semiconductor etching apparatus with magnetic array and vertical shield |
US4662977A (en) * | 1986-05-05 | 1987-05-05 | University Patents, Inc. | Neutral particle surface alteration |
-
1986
- 1986-05-29 JP JP61124123A patent/JPS62281331A/ja active Granted
-
1987
- 1987-05-27 DE DE3752290T patent/DE3752290T2/de not_active Expired - Fee Related
- 1987-05-27 EP EP87107743A patent/EP0247603B1/de not_active Expired - Lifetime
- 1987-05-29 KR KR1019870005360A patent/KR900004053B1/ko active
- 1987-05-29 KR KR1019870005360A patent/KR870011678A/ko not_active IP Right Cessation
-
1997
- 1997-04-18 US US08/839,371 patent/US6184148B1/en not_active Expired - Fee Related
-
2000
- 2000-08-16 US US09/639,113 patent/US6486073B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE3752290D1 (de) | 1999-09-30 |
EP0247603B1 (de) | 1999-08-25 |
EP0247603A3 (de) | 1988-07-20 |
KR900004053B1 (ko) | 1990-06-09 |
US6486073B1 (en) | 2002-11-26 |
JPH057862B2 (de) | 1993-01-29 |
JPS62281331A (ja) | 1987-12-07 |
US6184148B1 (en) | 2001-02-06 |
EP0247603A2 (de) | 1987-12-02 |
KR870011678A (ko) | 1987-12-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |