DE3727901C2 - - Google Patents
Info
- Publication number
- DE3727901C2 DE3727901C2 DE3727901A DE3727901A DE3727901C2 DE 3727901 C2 DE3727901 C2 DE 3727901C2 DE 3727901 A DE3727901 A DE 3727901A DE 3727901 A DE3727901 A DE 3727901A DE 3727901 C2 DE3727901 C2 DE 3727901C2
- Authority
- DE
- Germany
- Prior art keywords
- target
- yoke
- magnet
- electromagnet
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005291 magnetic effect Effects 0.000 claims description 43
- 238000004544 sputter deposition Methods 0.000 claims description 15
- 238000004804 winding Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 2
- 239000000696 magnetic material Substances 0.000 description 5
- 239000013077 target material Substances 0.000 description 4
- 238000000889 atomisation Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 2
- 239000003302 ferromagnetic material Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910020710 Co—Sm Inorganic materials 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910001172 neodymium magnet Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19873727901 DE3727901A1 (de) | 1987-08-21 | 1987-08-21 | Zerstaeubungskathode nach dem magnetronprinzip |
| US07/111,207 US4810346A (en) | 1987-08-21 | 1987-10-21 | Magnetron type sputtering cathode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19873727901 DE3727901A1 (de) | 1987-08-21 | 1987-08-21 | Zerstaeubungskathode nach dem magnetronprinzip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3727901A1 DE3727901A1 (de) | 1989-03-02 |
| DE3727901C2 true DE3727901C2 (enExample) | 1992-11-26 |
Family
ID=6334189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19873727901 Granted DE3727901A1 (de) | 1987-08-21 | 1987-08-21 | Zerstaeubungskathode nach dem magnetronprinzip |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4810346A (enExample) |
| DE (1) | DE3727901A1 (enExample) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4971674A (en) * | 1986-08-06 | 1990-11-20 | Ube Industries, Ltd. | Magnetron sputtering method and apparatus |
| DE3908252C2 (de) * | 1989-03-14 | 1996-06-20 | Leybold Ag | Zerstäubungskathode nach dem Magnetron-Prinzip |
| US4957605A (en) * | 1989-04-17 | 1990-09-18 | Materials Research Corporation | Method and apparatus for sputter coating stepped wafers |
| US5126028A (en) * | 1989-04-17 | 1992-06-30 | Materials Research Corporation | Sputter coating process control method and apparatus |
| DE3929695C2 (de) * | 1989-09-07 | 1996-12-19 | Leybold Ag | Vorrichtung zum Beschichten eines Substrats |
| DE4018914C1 (enExample) * | 1990-06-13 | 1991-06-06 | Leybold Ag, 6450 Hanau, De | |
| US5182001A (en) * | 1990-06-13 | 1993-01-26 | Leybold Aktiengesellschaft | Process for coating substrates by means of a magnetron cathode |
| EP0482891A3 (en) * | 1990-10-22 | 1992-06-17 | Varian Associates, Inc. | High vacuum magnetron sputter source |
| WO1992017621A1 (en) * | 1991-04-04 | 1992-10-15 | Conner Peripherals, Inc. | Apparatus and method for high throughput sputtering |
| DE4137483A1 (de) * | 1991-11-14 | 1993-05-19 | Leybold Ag | Kathode zum beschichten eines substrats |
| US5482610A (en) * | 1991-11-14 | 1996-01-09 | Leybold Aktiengesellschaft | Cathode for coating a substrate |
| DE59205763D1 (de) * | 1991-12-28 | 1996-04-25 | Leybold Ag | Kathode zum Beschichten eines Substrats |
| US5262028A (en) * | 1992-06-01 | 1993-11-16 | Sierra Applied Sciences, Inc. | Planar magnetron sputtering magnet assembly |
| US5630916A (en) * | 1993-03-02 | 1997-05-20 | Cvc Products, Inc. | Magnetic orienting device for thin film deposition and method of use |
| DE4329155A1 (de) * | 1993-08-30 | 1995-03-02 | Bloesch W Ag | Magnetfeldkathode |
| JP3403550B2 (ja) * | 1995-06-29 | 2003-05-06 | 松下電器産業株式会社 | スパッタリング装置とスパッタリング方法 |
| US5705044A (en) * | 1995-08-07 | 1998-01-06 | Akashic Memories Corporation | Modular sputtering machine having batch processing and serial thin film sputtering |
| US5830336A (en) * | 1995-12-05 | 1998-11-03 | Minnesota Mining And Manufacturing Company | Sputtering of lithium |
| DE19747923C2 (de) * | 1997-10-30 | 2002-09-12 | Leybold Systems Gmbh | Sputterkathode |
| US6106682A (en) * | 1998-05-22 | 2000-08-22 | Cvc Products, Inc. | Thin-film processing electromagnet for low-skew magnetic orientation |
| US6042707A (en) * | 1998-05-22 | 2000-03-28 | Cvc Products, Inc. | Multiple-coil electromagnet for magnetically orienting thin films |
| US5980707A (en) * | 1998-12-18 | 1999-11-09 | Sierra Applied Sciences, Inc. | Apparatus and method for a magnetron cathode with moving magnet assembly |
| US6290825B1 (en) * | 1999-02-12 | 2001-09-18 | Applied Materials, Inc. | High-density plasma source for ionized metal deposition |
| US6306265B1 (en) | 1999-02-12 | 2001-10-23 | Applied Materials, Inc. | High-density plasma for ionized metal deposition capable of exciting a plasma wave |
| US6497802B2 (en) | 1999-02-12 | 2002-12-24 | Applied Materials, Inc. | Self ionized plasma sputtering |
| US6183614B1 (en) | 1999-02-12 | 2001-02-06 | Applied Materials, Inc. | Rotating sputter magnetron assembly |
| DE10234858A1 (de) * | 2002-07-31 | 2004-02-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Einrichtung zur Erzeugung einer Magnetron-Entladung |
| DE10234859B4 (de) * | 2002-07-31 | 2007-05-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Einrichtung und Verfahren zum Beschichten von Substraten |
| US7226049B2 (en) * | 2003-06-06 | 2007-06-05 | Xerox Corporation | Universal flexible plural printer to plural finisher sheet integration system |
| EP1873809A1 (en) * | 2006-06-26 | 2008-01-02 | M2 Engineering AB (publ) | Sputtering device |
| CN101796213B (zh) * | 2007-08-30 | 2012-07-11 | 皇家飞利浦电子股份有限公司 | 溅射系统 |
| US9782949B2 (en) | 2008-05-30 | 2017-10-10 | Corning Incorporated | Glass laminated articles and layered articles |
| KR20140004785A (ko) * | 2011-05-30 | 2014-01-13 | 히타치 긴조쿠 가부시키가이샤 | 레이스트랙 형상의 마그네트론 스퍼터링용 자장 발생 장치 |
| US8685214B1 (en) | 2011-09-30 | 2014-04-01 | WD Media, LLC | Magnetic shunting pads for optimizing target erosion in sputtering processes |
| US9347129B2 (en) | 2011-12-09 | 2016-05-24 | Seagate Technology Llc | Interchangeable magnet pack |
| US10573500B2 (en) | 2011-12-09 | 2020-02-25 | Seagate Technology Llc | Interchangeable magnet pack |
| CN103556122B (zh) * | 2013-10-23 | 2017-01-18 | 苏州矩阵光电有限公司 | 一种自适应磁场调整型磁控溅射镀膜设备及其镀膜方法 |
| KR101924143B1 (ko) * | 2017-03-31 | 2018-11-30 | 한국알박(주) | 자석 구조체, 자석 유닛 및 이를 포함하는 마그네트론 스퍼터링 장치 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3884793A (en) * | 1971-09-07 | 1975-05-20 | Telic Corp | Electrode type glow discharge apparatus |
| CA1141704A (en) * | 1978-08-21 | 1983-02-22 | Charles F. Morrison, Jr. | Magnetically enhanced sputtering device |
| US4200510A (en) * | 1979-03-19 | 1980-04-29 | Delbar Products, Inc. | Assembly and method to extend useful life of sputtering targets |
| DE3047113A1 (de) * | 1980-12-13 | 1982-07-29 | Leybold-Heraeus GmbH, 5000 Köln | Katodenanordnung und regelverfahren fuer katodenzerstaeubungsanlagen mit einem magnetsystem zur erhoehung der zerstaeubungsrate |
| US4401539A (en) * | 1981-01-30 | 1983-08-30 | Hitachi, Ltd. | Sputtering cathode structure for sputtering apparatuses, method of controlling magnetic flux generated by said sputtering cathode structure, and method of forming films by use of said sputtering cathode structure |
| US4444635A (en) * | 1981-07-22 | 1984-04-24 | Hitachi, Ltd. | Film forming method |
| JPS59208072A (ja) * | 1983-05-12 | 1984-11-26 | Matsushita Electric Ind Co Ltd | スパツタリング装置 |
| DE3442206A1 (de) * | 1983-12-05 | 1985-07-11 | Leybold-Heraeus GmbH, 5000 Köln | Magnetronkatode zum zerstaeuben ferromagnetischer targets |
| EP0144838B1 (de) * | 1983-12-05 | 1989-10-11 | Leybold Aktiengesellschaft | Magnetronkatode zum Zerstäuben ferromagnetischer Targets |
| JPH06114194A (ja) * | 1992-10-06 | 1994-04-26 | Matsushita Electric Ind Co Ltd | 電気寝具 |
-
1987
- 1987-08-21 DE DE19873727901 patent/DE3727901A1/de active Granted
- 1987-10-21 US US07/111,207 patent/US4810346A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE3727901A1 (de) | 1989-03-02 |
| US4810346A (en) | 1989-03-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3727901C2 (enExample) | ||
| DE4102102C2 (de) | Magnetanordnung mit wenigstens zwei Permanentmagneten sowie ihre Verwendung | |
| EP0253344B1 (de) | Zerstäubungskatode nach dem Magnetronprinzip | |
| DE19853943B4 (de) | Katode zur Zerstäubung oder Bogenaufdampfung sowie Vorrichtung zur Beschichtung oder Ionenimplantation mit einer solchen Katode | |
| DE69033686T2 (de) | Verfahren und Vorrichtung zur Sputterbeschichtung gestufter Wafer - Fall A | |
| EP0946966B1 (de) | Vorrichtung zur kathodenzerstäubung | |
| EP0461525B1 (de) | Verfahren und Vorrichtung zum Beschichten von Substraten mittels einer Magnetronkatode | |
| DE4235064A1 (de) | Vorrichtung zum Erzeugen eines Plasmas mittels Kathodenzerstäubung | |
| EP0667034B1 (de) | Magnetfeldkathode | |
| EP2630650B1 (de) | Sputterquellen für hochdrucksputtern mit grossen targets und sputterverfahren | |
| DE3812379A1 (de) | Zerstaeubungskathode nach dem magnetron-prinzip | |
| DE3012935C2 (de) | Zerstäubungsvorrichtung mit magnetischer Verstärkung | |
| DE163445T1 (de) | Magnetron-zerstaeubungs-vorrichtung mit ebenen und konkaven auftreffplatten. | |
| DE3908252A1 (de) | Zerstaeubungskathode nach dem magnetron-prinzip | |
| DE3331406A1 (de) | Zerstaeubungskatode | |
| DE4109018A1 (de) | Vorrichtung zum beschichten eines substrats | |
| DE3738845A1 (de) | Zerstaeubungskatode nach dem magnetronprinzip | |
| DE4127261C1 (en) | Sputtering equipment for coating large substrates with ferromagnetic and non-magnetic material - has cathode target comprising sub-targets, and cooling plates contg. magnet unit and poles shoes | |
| DE3411536C2 (enExample) | ||
| DE4025077C2 (enExample) | ||
| DE4304581A1 (de) | Vorrichtung zum Beschichten eines Substrats | |
| DE102021104985A1 (de) | Magnetsystem | |
| DD237526A1 (de) | Elektronenstrahl - linienverdampfer | |
| CH702969A2 (de) | Segmentierte Anode. | |
| DE10234858A1 (de) | Einrichtung zur Erzeugung einer Magnetron-Entladung |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: BALZERS UND LEYBOLD DEUTSCHLAND HOLDING AG, 63450 |
|
| 8339 | Ceased/non-payment of the annual fee |