DE3726170C2 - - Google Patents

Info

Publication number
DE3726170C2
DE3726170C2 DE3726170A DE3726170A DE3726170C2 DE 3726170 C2 DE3726170 C2 DE 3726170C2 DE 3726170 A DE3726170 A DE 3726170A DE 3726170 A DE3726170 A DE 3726170A DE 3726170 C2 DE3726170 C2 DE 3726170C2
Authority
DE
Germany
Prior art keywords
flexible circuit
circuit card
electronic device
carrier element
line pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3726170A
Other languages
German (de)
English (en)
Other versions
DE3726170A1 (de
Inventor
Seiichi Nara Jp Kinugawa
Takashi Kawashima
Seio Yamatokooriyama Nara Jp Kainoh
Katsumi Kyoto Jp Okabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of DE3726170A1 publication Critical patent/DE3726170A1/de
Application granted granted Critical
Publication of DE3726170C2 publication Critical patent/DE3726170C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2229/00—Manufacturing
    • H01H2229/034—Positioning of layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2229/00—Manufacturing
    • H01H2229/038—Folding of flexible printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2239/00—Miscellaneous
    • H01H2239/008—Static electricity considerations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2239/00—Miscellaneous
    • H01H2239/01—Miscellaneous combined with other elements on the same substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2239/00—Miscellaneous
    • H01H2239/018—Ground conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Calculators And Similar Devices (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Elimination Of Static Electricity (AREA)
  • Credit Cards Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
DE19873726170 1986-08-07 1987-08-06 Elektronisches geraet mit flexibler schaltungskarte Granted DE3726170A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986122770U JPH041750Y2 (US06815460-20041109-C00097.png) 1986-08-07 1986-08-07

Publications (2)

Publication Number Publication Date
DE3726170A1 DE3726170A1 (de) 1988-02-18
DE3726170C2 true DE3726170C2 (US06815460-20041109-C00097.png) 1989-06-22

Family

ID=14844183

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873726170 Granted DE3726170A1 (de) 1986-08-07 1987-08-06 Elektronisches geraet mit flexibler schaltungskarte

Country Status (3)

Country Link
US (1) US4901193A (US06815460-20041109-C00097.png)
JP (1) JPH041750Y2 (US06815460-20041109-C00097.png)
DE (1) DE3726170A1 (US06815460-20041109-C00097.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10135199B4 (de) * 2000-08-19 2004-03-18 Samsung Electronics Co., Ltd., Suwon Breites Tastenfeld und Montagestruktur für breites Tastenfeld für die Verhinderung von elektrostatischen Endladungen

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3905657A1 (de) * 1989-02-24 1990-08-30 Telefunken Electronic Gmbh Flexible traegerfolie
JPH0665788B2 (ja) * 1989-07-18 1994-08-24 住友ベークライト株式会社 遮音床材
US6169255B1 (en) * 1999-09-10 2001-01-02 Chicony Electronics Co., Ltd. Flexible membrane circuit structure for keyswitch
JP2002220045A (ja) * 2001-01-26 2002-08-06 Honda Motor Co Ltd 電動駐車ブレーキ装置
JP4151584B2 (ja) * 2004-02-16 2008-09-17 セイコーエプソン株式会社 光学装置、およびプロジェクタ
USD638431S1 (en) * 2009-10-20 2011-05-24 Sandisk Corporation MicroSD memory card with a semi-transparent color surface
US8690283B2 (en) 2009-10-20 2014-04-08 Sandisk Il Ltd. Method and system for printing graphical content onto a plurality of memory devices and for providing a visually distinguishable memory device
JP5576092B2 (ja) * 2009-11-05 2014-08-20 ダヴ 電気制御装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US414728A (en) * 1889-11-12 Can-soldering machine
US2854502A (en) * 1956-12-05 1958-09-30 Tape Cable Corp Termination strip for electric cable
GB1136753A (en) * 1965-10-26 1968-12-18 English Electric Computers Ltd Improvements relating to electrical connecting arrangements
DE1690062B1 (de) * 1967-09-29 1971-07-01 Siemens Ag Anordnung zur Verdrahtung von Baugruppen untereinander
US3836824A (en) * 1972-10-24 1974-09-17 Gen Electric Mounting arrangement for flexible circuit
IT1008331B (it) * 1973-03-28 1976-11-10 Rca Corp Pannello composito a circuito stampato
JPS5024770A (US06815460-20041109-C00097.png) * 1973-07-05 1975-03-17
GB1589519A (en) * 1976-11-19 1981-05-13 Solartron Electronic Group Printed circuits
GB1545531A (en) * 1977-09-07 1979-05-10 Gould Advance Ltd Electronic assemblies
US4147889A (en) * 1978-02-28 1979-04-03 Amp Incorporated Chip carrier
US4303960A (en) * 1979-12-31 1981-12-01 Gte Products Corporation Electrostatic discharge-protected switch
US4314117A (en) * 1980-07-24 1982-02-02 Re-Al, Inc. Membrane contact switch
US4360858A (en) * 1981-01-14 1982-11-23 General Motors Corporation Instrument panel assembly with conductive elastomeric connectors
JPS57193094A (en) * 1981-05-18 1982-11-27 Matsushita Electric Ind Co Ltd Electronic circuit part and method of mounting same
DE3226972A1 (de) * 1982-07-19 1984-01-19 Siemens AG, 1000 Berlin und 8000 München Elektronisches geraet mit hoher packungsdichte von bauelementen
US4581495A (en) * 1984-05-02 1986-04-08 Buscom Systems Inc. Modular telephone housing
US4586106A (en) * 1984-08-24 1986-04-29 Frazier Thomas G Static dissipative touch device
JPH046218Y2 (US06815460-20041109-C00097.png) * 1985-02-01 1992-02-20
JPS61206299A (ja) * 1985-03-09 1986-09-12 株式会社東芝 印刷配線板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10135199B4 (de) * 2000-08-19 2004-03-18 Samsung Electronics Co., Ltd., Suwon Breites Tastenfeld und Montagestruktur für breites Tastenfeld für die Verhinderung von elektrostatischen Endladungen

Also Published As

Publication number Publication date
DE3726170A1 (de) 1988-02-18
JPH041750Y2 (US06815460-20041109-C00097.png) 1992-01-21
JPS6329995U (US06815460-20041109-C00097.png) 1988-02-27
US4901193A (en) 1990-02-13

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: PATENTANWAELTE MUELLER & HOFFMANN, 81667 MUENCHEN