DE3673914D1 - Ueberspannung-schutzanordnung. - Google Patents

Ueberspannung-schutzanordnung.

Info

Publication number
DE3673914D1
DE3673914D1 DE8686305104T DE3673914T DE3673914D1 DE 3673914 D1 DE3673914 D1 DE 3673914D1 DE 8686305104 T DE8686305104 T DE 8686305104T DE 3673914 T DE3673914 T DE 3673914T DE 3673914 D1 DE3673914 D1 DE 3673914D1
Authority
DE
Germany
Prior art keywords
overvoltage protection
overvoltage
protection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686305104T
Other languages
English (en)
Inventor
Raymond Lippmann
James Robert Chintyan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motors Liquidation Co
Original Assignee
Motors Liquidation Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motors Liquidation Co filed Critical Motors Liquidation Co
Application granted granted Critical
Publication of DE3673914D1 publication Critical patent/DE3673914D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/026—Spark gaps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T4/00—Overvoltage arresters using spark gaps
    • H01T4/08—Overvoltage arresters using spark gaps structurally associated with protected apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Elimination Of Static Electricity (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
DE8686305104T 1985-08-02 1986-07-01 Ueberspannung-schutzanordnung. Expired - Fee Related DE3673914D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/761,799 US4586105A (en) 1985-08-02 1985-08-02 High voltage protection device with a tape covered spark gap

Publications (1)

Publication Number Publication Date
DE3673914D1 true DE3673914D1 (de) 1990-10-11

Family

ID=25063300

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686305104T Expired - Fee Related DE3673914D1 (de) 1985-08-02 1986-07-01 Ueberspannung-schutzanordnung.

Country Status (4)

Country Link
US (1) US4586105A (de)
EP (1) EP0211517B1 (de)
JP (1) JPS6235480A (de)
DE (1) DE3673914D1 (de)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8720337D0 (en) * 1987-08-28 1987-10-07 English Electric Valve Co Ltd Spark gap devices
US4944004A (en) * 1989-03-16 1990-07-24 Northern Telecom Limited Interface circuit with transient event tolerance
US5102712A (en) * 1990-02-13 1992-04-07 Conductive Containers, Inc. Process for conformal coating of printed circuit boards
US5134356A (en) * 1990-06-22 1992-07-28 Board Of Regents Of The University Of Washington Reactive power compensator
JP3260460B2 (ja) * 1993-02-08 2002-02-25 株式会社東芝 過電圧印加防止回路
DE4329251C2 (de) * 1993-08-31 1996-08-14 Philips Patentverwaltung Anordnung zum Schutz von gegen Überspannungen empfindlichen Bauelementen auf gedruckten Schaltungsplatten
DE9403580U1 (de) * 1994-03-03 1994-05-05 Hella Kg Hueck & Co, 59557 Lippstadt Elektronisches Steuergerät für ein Kraftfahrzeug
FR2717308B1 (fr) * 1994-03-14 1996-07-26 Sgs Thomson Microelectronics Dispositif de protection contre des surtensions dans des circuits intégrés.
US5598057A (en) * 1995-03-13 1997-01-28 Texas Instruments Incorporated Reduction of the probability of interlevel oxide failures by minimization of lead overlap area through bus width reduction
DE19536521C1 (de) * 1995-09-29 1997-02-20 Siemens Ag Anordnung zum Schutz von Überspannungen
DE19601650A1 (de) * 1996-01-18 1997-07-24 Telefunken Microelectron Anordnung zum Schutz elektrischer und elektronischer Bauelemente vor elektrostatischen Entladungen
DE29615789U1 (de) * 1996-09-10 1996-10-31 Siemens AG, 80333 München Schutzschaltung
US6013358A (en) * 1997-11-18 2000-01-11 Cooper Industries, Inc. Transient voltage protection device with ceramic substrate
EP1010228B1 (de) * 1996-11-19 2007-02-28 Surgx Corporation Schutzvorrichtung gegen transiente spannungen und verfahren zu deren herstellung
US5837153A (en) * 1997-01-15 1998-11-17 Kawan; Joseph C. Method and system for creating and using a logotype contact module with a smart card
SE9701195L (sv) * 1997-04-02 1998-10-03 Ericsson Telefon Ab L M Anordning för skydd mot elektrostatisk urladdning i elektriska apparater
US5969924A (en) * 1997-09-23 1999-10-19 Hewlett Packard Company Spark gap for overcoated printed circuit boards
US6059983A (en) * 1997-09-23 2000-05-09 Hewlett-Packard Company Method for fabricating an overcoated printed circuit board with contaminant-free areas
JPH11204231A (ja) * 1997-11-12 1999-07-30 Funai Electric Co Ltd 放電ギャップ装置及びその取付け構造
GB2334626B (en) * 1998-02-20 2003-01-29 Mitel Corp Spark gap for hermetically packaged integrated circuits
GB2335084B (en) * 1998-02-21 2003-04-02 Mitel Corp Spark gap for high voltage integrated circuit electrostatic discharge protection
US6130459A (en) 1998-03-10 2000-10-10 Oryx Technology Corporation Over-voltage protection device for integrated circuits
US6064094A (en) * 1998-03-10 2000-05-16 Oryx Technology Corporation Over-voltage protection system for integrated circuits using the bonding pads and passivation layer
EP1336202A2 (de) * 2000-02-18 2003-08-20 Robert Bosch Gmbh Einrichtung zum schutz eines auf einem trägersubstrat angeordneten elektrischen und/oder elektronischen bauteils vor elektrostatischen entladungen
US6316734B1 (en) * 2000-03-07 2001-11-13 3M Innovative Properties Company Flexible circuits with static discharge protection and process for manufacture
JP2002093546A (ja) * 2000-07-10 2002-03-29 Samsung Electro Mech Co Ltd 表面実装型静電気放電装置及びその製造方法
US6600642B1 (en) * 2000-12-29 2003-07-29 Cisco Technology, Inc. Method and apparatus for lightning suppression in a telecommunication printed circuit board
US7126804B1 (en) 2002-07-03 2006-10-24 Diversified Control, Inc. Spark gap
DE10301982B4 (de) * 2003-01-15 2007-06-06 Infineon Technologies Ag Wellenleiter
DE10303446B4 (de) * 2003-01-29 2008-12-18 Siemens Ag Vorrichtung zum Schutz von auf Flachbaugruppen verwendeten elektronischen Bauteilen vor einer Zerstörung durch elektrostatische Entladungsvorgänge
JP4710496B2 (ja) 2004-10-26 2011-06-29 株式会社デンソー 回路基板及び電子回路装置
DE102006016419A1 (de) * 2006-04-07 2007-10-18 Infineon Technologies Ag Chipkartenmodul und Verfahren zum Schützen eines Chipkartenmoduls vor Überspannungen
US7561398B2 (en) * 2006-12-06 2009-07-14 Kwongyee Hung Anti-surge power adapter
US20080266730A1 (en) * 2007-04-25 2008-10-30 Karsten Viborg Spark Gaps for ESD Protection
US7799448B2 (en) * 2007-06-19 2010-09-21 Black & Decker Inc. Battery pack for cordless devices
US20090035968A1 (en) * 2007-08-02 2009-02-05 Giga-Byte Technology Co., Ltd. Connector and printed circuit board
US20090231763A1 (en) * 2008-03-12 2009-09-17 Polytronics Technology Corporation Over-voltage protection device
KR101199681B1 (ko) * 2008-05-08 2012-11-08 가부시키가이샤 무라타 세이사쿠쇼 Ｅｓｄ 보호 기능 내장 기판
DE202009008251U1 (de) * 2009-06-16 2010-11-04 Vorwerk & Co. Interholding Gmbh Platine mit zugeordneter Schutzleiterbahn
US20130003329A1 (en) * 2009-09-01 2013-01-03 Airo Wireless, Inc. Ruggedized handset housing
US8395875B2 (en) 2010-08-13 2013-03-12 Andrew F. Tresness Spark gap apparatus
US20130161083A1 (en) * 2011-12-22 2013-06-27 Tyco Electronics Corporation Printed circuit boards and methods of manufacturing printed circuit boards
US8593777B1 (en) * 2012-05-11 2013-11-26 Apple Inc. User-actuated button ESD protection circuit with spark gap
KR101771726B1 (ko) * 2012-06-18 2017-08-25 삼성전기주식회사 정전기 방지 소자 및 이를 포함하는 복합 전자 부품
US9281683B1 (en) * 2015-02-25 2016-03-08 La-Z-Boy Incorporated Electrostatic discharge protection and method in power supply
US11477881B2 (en) * 2019-06-26 2022-10-18 Sandisk Technologies Llc Spark gap electrostatic discharge (ESD) protection for memory cards
US20230307808A1 (en) * 2022-03-25 2023-09-28 Rockwell Collins, Inc. Microscale plasma limiter integrated into thick film interconnect

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676742A (en) * 1971-05-24 1972-07-11 Signetics Corp Means including a spark gap for protecting an integrated circuit from electrical discharge
DE2229301A1 (de) * 1972-06-15 1974-01-03 Standard Elektrik Lorenz Ag Mit einem organisch eingefuegten ueberspannungsschutz versehene gedruckte schaltung
DE2443304A1 (de) * 1974-09-10 1976-03-18 Siemens Ag Einrichtung zum schutz von halbleiterbausteinen gegen zerstoerung durch statische auf- und entladung
US4158254A (en) * 1976-06-18 1979-06-19 Hoshidenki-Seizo Kabushiki Kaisha Method of making a spark gap device for a cathode ray tube socket
GB2053579B (en) * 1979-06-28 1983-09-07 Post Office Device for protection of electrical networks from surges of high voltage utilising spark gaps
US4472876A (en) * 1981-08-13 1984-09-25 Minnesota Mining And Manufacturing Company Area-bonding tape
DE3137279C2 (de) * 1981-09-18 1986-12-11 Wilhelm Ruf KG, 8000 München Verfahren zur Herstellung von Mehrlagen-Leiterplatten sowie nach dem Verfahren hergestellte mehrlagige Leiterplatte

Also Published As

Publication number Publication date
EP0211517A3 (en) 1987-11-04
JPS6235480A (ja) 1987-02-16
EP0211517B1 (de) 1990-09-05
EP0211517A2 (de) 1987-02-25
US4586105A (en) 1986-04-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee