DE3582535D1 - Halbleiteranordnung vom harzverkapselungstyp wobei epoxyharzzusammensetzung benutzt wird. - Google Patents

Halbleiteranordnung vom harzverkapselungstyp wobei epoxyharzzusammensetzung benutzt wird.

Info

Publication number
DE3582535D1
DE3582535D1 DE8585106675T DE3582535T DE3582535D1 DE 3582535 D1 DE3582535 D1 DE 3582535D1 DE 8585106675 T DE8585106675 T DE 8585106675T DE 3582535 T DE3582535 T DE 3582535T DE 3582535 D1 DE3582535 D1 DE 3582535D1
Authority
DE
Germany
Prior art keywords
wobei
semiconductor device
resin composition
epoxy resin
enclosure type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585106675T
Other languages
English (en)
Inventor
Hirotoshi C O Kabushiki Ikeya
Michiya C O Kabushiki Higashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE3582535D1 publication Critical patent/DE3582535D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE8585106675T 1984-08-23 1985-05-30 Halbleiteranordnung vom harzverkapselungstyp wobei epoxyharzzusammensetzung benutzt wird. Expired - Lifetime DE3582535D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59174148A JPS6153321A (ja) 1984-08-23 1984-08-23 半導体封止用エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置

Publications (1)

Publication Number Publication Date
DE3582535D1 true DE3582535D1 (de) 1991-05-23

Family

ID=15973511

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585106675T Expired - Lifetime DE3582535D1 (de) 1984-08-23 1985-05-30 Halbleiteranordnung vom harzverkapselungstyp wobei epoxyharzzusammensetzung benutzt wird.

Country Status (5)

Country Link
US (1) US4710796A (de)
EP (1) EP0172324B1 (de)
JP (1) JPS6153321A (de)
KR (1) KR900000376B1 (de)
DE (1) DE3582535D1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3675321D1 (de) * 1985-08-16 1990-12-06 Dai Ichi Seiko Co Ltd Halbleiteranordnung mit packung vom steckerstifttyp.
JPS62212422A (ja) * 1986-03-14 1987-09-18 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPS62217645A (ja) * 1986-03-19 1987-09-25 Fujitsu Ltd 半導体装置の製造方法
JPH0684422B2 (ja) * 1986-05-20 1994-10-26 住友化学工業株式会社 電子部品の封止材
JP2514981B2 (ja) * 1987-05-28 1996-07-10 日東電工株式会社 半導体装置
JPH0648710B2 (ja) * 1987-08-03 1994-06-22 株式会社日立製作所 樹脂封止型半導体装置
JP2684677B2 (ja) * 1988-05-25 1997-12-03 株式会社日立製作所 半導体装置の製造方法
US5192995A (en) * 1988-08-26 1993-03-09 Semiconductor Energy Laboratory Co., Ltd. Electric device utilizing antioxidation film between base pad for semiconductor chip and organic encapsulating material
US5104604A (en) * 1989-10-05 1992-04-14 Dexter Electronic Materials Div. Of Dexter Corp. Flame retardant epoxy molding compound, method and encapsulated device method of encapsulating a semiconductor device with a flame retardant epoxy molding compound
US5154976A (en) * 1988-10-17 1992-10-13 Dexter Corporation Flame retardant epoxy molding compound, method and encapsulated device
US5476716A (en) * 1988-10-17 1995-12-19 The Dexter Corporation Flame retardant epoxy molding compound, method and encapsulated device
US5041254A (en) * 1988-10-17 1991-08-20 Dexter Corporation Method of encapsulating a semiconductor device with a flame retardant epoxy molding compound
US5413861A (en) * 1988-10-17 1995-05-09 Dextor Corporation Semiconductor device encapsulated with a flame retardant epoxy molding compound
JPH07119275B2 (ja) * 1988-11-17 1995-12-20 サンスター技研株式会社 二液型エポキシ樹脂組成物
US5194930A (en) * 1991-09-16 1993-03-16 International Business Machines Dielectric composition and solder interconnection structure for its use
JPH06196603A (ja) * 1992-12-23 1994-07-15 Shinko Electric Ind Co Ltd リードフレームの製造方法
JP3121020B2 (ja) * 1995-03-07 2000-12-25 日東電工株式会社 半導体装置の製法およびそれに用いる封止用ペレット
US6099783A (en) * 1995-06-06 2000-08-08 Board Of Trustees Operating Michigan State University Photopolymerizable compositions for encapsulating microelectronic devices
US6297332B1 (en) * 1998-04-28 2001-10-02 Mitsui Chemicals, Inc. Epoxy-resin composition and use thereof
JP3926141B2 (ja) * 2000-12-27 2007-06-06 日本特殊陶業株式会社 配線基板
KR20030001539A (ko) 2001-04-23 2003-01-06 스미토모 베이클리트 컴퍼니 리미티드 에폭시수지 조성물 및 반도체 소자
US7163973B2 (en) * 2002-08-08 2007-01-16 Henkel Corporation Composition of bulk filler and epoxy-clay nanocomposite

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4248920A (en) * 1978-04-26 1981-02-03 Tokyo Shibaura Denki Kabushiki Kaisha Resin-sealed semiconductor device
US4282136A (en) * 1979-04-09 1981-08-04 Hunt Earl R Flame retardant epoxy molding compound method and encapsulated device
JPS56129245A (en) * 1980-03-14 1981-10-09 Mitsubishi Gas Chem Co Inc Flame-retardant epoxy resin composition
JPS5933125B2 (ja) * 1980-03-17 1984-08-14 信越化学工業株式会社 半導体装置封止用エポキシ樹脂組成物
EP0041662B1 (de) * 1980-06-05 1984-04-11 Kabushiki Kaisha Toshiba Kunstharzeingekapseltes Halbleiterbauelement
US4572853A (en) * 1980-06-05 1986-02-25 Tokyo Shibaura Denki Kabushiki Kaisha Resin encapsulation type semiconductor device
JPS5875854A (ja) * 1981-10-30 1983-05-07 Toshiba Corp 樹脂封止型半導体装置
JPS5896755A (ja) * 1981-12-03 1983-06-08 Toshiba Corp 樹脂封止型半導体装置
JPS5948943A (ja) * 1982-09-14 1984-03-21 Toshiba Corp 樹脂封止型半導体装置

Also Published As

Publication number Publication date
US4710796A (en) 1987-12-01
KR860002139A (ko) 1986-03-26
EP0172324A3 (en) 1986-10-08
JPS6153321A (ja) 1986-03-17
EP0172324B1 (de) 1991-04-17
KR900000376B1 (ko) 1990-01-25
EP0172324A2 (de) 1986-02-26

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