DE3573367D1 - Sealed standard interface apparatus - Google Patents

Sealed standard interface apparatus

Info

Publication number
DE3573367D1
DE3573367D1 DE8585903954T DE3573367T DE3573367D1 DE 3573367 D1 DE3573367 D1 DE 3573367D1 DE 8585903954 T DE8585903954 T DE 8585903954T DE 3573367 T DE3573367 T DE 3573367T DE 3573367 D1 DE3573367 D1 DE 3573367D1
Authority
DE
Germany
Prior art keywords
standard interface
interface apparatus
sealed standard
sealed
standard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8585903954T
Other languages
English (en)
Inventor
George Maney
Andrew O'sullivan
W Faraco
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASYST TECHNOLOGIES
Original Assignee
ASYST TECHNOLOGIES
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASYST TECHNOLOGIES filed Critical ASYST TECHNOLOGIES
Application granted granted Critical
Publication of DE3573367D1 publication Critical patent/DE3573367D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Casings For Electric Apparatus (AREA)
DE8585903954T 1984-07-30 1985-07-29 Sealed standard interface apparatus Expired DE3573367D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/635,384 US4674939A (en) 1984-07-30 1984-07-30 Sealed standard interface apparatus
PCT/US1985/001446 WO1986000870A1 (en) 1984-07-30 1985-07-29 Sealed standard interface apparatus

Publications (1)

Publication Number Publication Date
DE3573367D1 true DE3573367D1 (en) 1989-11-02

Family

ID=24547585

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585903954T Expired DE3573367D1 (en) 1984-07-30 1985-07-29 Sealed standard interface apparatus

Country Status (6)

Country Link
US (1) US4674939A (de)
EP (1) EP0191805B1 (de)
JP (1) JPH0746694B2 (de)
KR (1) KR960000214B1 (de)
DE (1) DE3573367D1 (de)
WO (1) WO1986000870A1 (de)

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DE3483828D1 (de) * 1983-09-28 1991-02-07 Hewlett Packard Co Verarbeitungssystem fuer integrierte schaltkreise.
JPH067566B2 (ja) * 1983-09-28 1994-01-26 ヒューレット・パッカード・カンパニー 集積回路処理装置
USRE34311E (en) * 1984-08-30 1993-07-13 Texas Instruments Incorporated Semiconductor slice cassette transport unit
US4705444A (en) * 1985-07-24 1987-11-10 Hewlett-Packard Company Apparatus for automated cassette handling
US4875825A (en) * 1985-07-24 1989-10-24 Hewlett-Packard Company Method for automated cassette handling
JPH0821609B2 (ja) * 1985-08-26 1996-03-04 アシスト テクノロジ−ス 標準機械的インタ−フェ−ス装置用のマニピュレ−タ
US4676709A (en) * 1985-08-26 1987-06-30 Asyst Technologies Long arm manipulator for standard mechanical interface apparatus
US5044871A (en) * 1985-10-24 1991-09-03 Texas Instruments Incorporated Integrated circuit processing system
US4746256A (en) * 1986-03-13 1988-05-24 Roboptek, Inc. Apparatus for handling sensitive material such as semiconductor wafers
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US4724874A (en) * 1986-05-01 1988-02-16 Asyst Technologies Sealable transportable container having a particle filtering system
FR2620049B2 (fr) * 1986-11-28 1989-11-24 Commissariat Energie Atomique Procede de traitement, stockage et/ou transfert d'un objet dans une atmosphere de haute proprete, et conteneur pour la mise en oeuvre de ce procede
DE3776118D1 (de) * 1986-12-22 1992-02-27 Siemens Ag Transportbehaelter mit austauschbarem, zweiteiligem innenbehaelter.
US4859137A (en) * 1987-10-21 1989-08-22 Asyst Technologies Apparatus for transporting a holder between a port opening of a standardized mechanical interface system and a loading and unloading station
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US5482161A (en) * 1994-05-24 1996-01-09 Fluoroware, Inc. Mechanical interface wafer container
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US5653565A (en) * 1995-07-05 1997-08-05 Asyst Technologies, Inc. SMIF port interface adaptor
US5588789A (en) * 1995-07-06 1996-12-31 Brooks Automation Load arm for load lock
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US5613821A (en) * 1995-07-06 1997-03-25 Brooks Automation, Inc. Cluster tool batchloader of substrate carrier
US5609459A (en) * 1995-07-06 1997-03-11 Brooks Automation, Inc. Door drive mechanisms for substrate carrier and load lock
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JP3672929B2 (ja) * 1995-10-13 2005-07-20 エムパック インコーポレイテッド 真空駆動機械ラッチ
US5967571A (en) * 1995-10-13 1999-10-19 Empak, Inc. Vacuum actuated mechanical latch
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US5752796A (en) * 1996-01-24 1998-05-19 Muka; Richard S. Vacuum integrated SMIF system
US5669508A (en) * 1996-05-28 1997-09-23 Taiwan Semiconductor Manufacturing Company, Ltd. Pod carrier function expansion by adding a fixture
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US6776289B1 (en) 1996-07-12 2004-08-17 Entegris, Inc. Wafer container with minimal contact
US5674039A (en) * 1996-07-12 1997-10-07 Fusion Systems Corporation System for transferring articles between controlled environments
US5915562A (en) * 1996-07-12 1999-06-29 Fluoroware, Inc. Transport module with latching door
US5711427A (en) * 1996-07-12 1998-01-27 Fluoroware, Inc. Wafer carrier with door
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US5957292A (en) * 1997-08-01 1999-09-28 Fluoroware, Inc. Wafer enclosure with door
JP3370279B2 (ja) * 1998-07-07 2003-01-27 信越ポリマー株式会社 精密基板収納容器
US6261044B1 (en) * 1998-08-06 2001-07-17 Asyst Technologies, Inc. Pod to port door retention and evacuation system
KR100495434B1 (ko) * 1998-12-02 2005-06-14 다이니치쇼지 가부시키가이샤 컨테이너
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US7677859B2 (en) 2002-07-22 2010-03-16 Brooks Automation, Inc. Substrate loading and uploading station with buffer
US6869263B2 (en) 2002-07-22 2005-03-22 Brooks Automation, Inc. Substrate loading and unloading station with buffer
FR2844258B1 (fr) * 2002-09-06 2005-06-03 Recif Sa Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert
US20090056116A1 (en) * 2007-08-07 2009-03-05 Micro Foundry Inc. Integrated miniature device factory
JP4751460B2 (ja) * 2009-02-18 2011-08-17 東京エレクトロン株式会社 基板搬送装置及び基板処理システム
JP5516968B2 (ja) 2010-06-08 2014-06-11 独立行政法人産業技術総合研究所 連結搬送システム
JP5794497B2 (ja) 2010-06-08 2015-10-14 国立研究開発法人産業技術総合研究所 連結システム
KR101633369B1 (ko) 2011-12-06 2016-07-08 고쿠리츠켄큐카이하츠호진 상교기쥬츠 소고켄큐쇼 옐로 룸 시스템
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Also Published As

Publication number Publication date
KR960000214B1 (ko) 1996-01-03
EP0191805A1 (de) 1986-08-27
EP0191805B1 (de) 1989-09-27
US4674939A (en) 1987-06-23
JPH0746694B2 (ja) 1995-05-17
WO1986000870A1 (en) 1986-02-13
KR860700241A (ko) 1986-08-01
JPS61502994A (ja) 1986-12-18
EP0191805A4 (de) 1986-11-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee