DE3484731D1 - Programmierbarer dickschichtschaltkreis und verfahren zu dessen herstellung. - Google Patents

Programmierbarer dickschichtschaltkreis und verfahren zu dessen herstellung.

Info

Publication number
DE3484731D1
DE3484731D1 DE8484201675T DE3484731T DE3484731D1 DE 3484731 D1 DE3484731 D1 DE 3484731D1 DE 8484201675 T DE8484201675 T DE 8484201675T DE 3484731 T DE3484731 T DE 3484731T DE 3484731 D1 DE3484731 D1 DE 3484731D1
Authority
DE
Germany
Prior art keywords
programmable
production
thick film
film circuit
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8484201675T
Other languages
English (en)
Inventor
John Louis Hilgers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips North America LLC
Original Assignee
Centralab Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centralab Inc filed Critical Centralab Inc
Application granted granted Critical
Publication of DE3484731D1 publication Critical patent/DE3484731D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/45—Differential amplifiers
    • H03F3/45071—Differential amplifiers with semiconductor devices only
    • H03F3/45076—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
    • H03F3/45475—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using IC blocks as the active amplifying circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2203/00—Indexing scheme relating to amplifiers with only discharge tubes or only semiconductor devices as amplifying elements covered by H03F3/00
    • H03F2203/45—Indexing scheme relating to differential amplifiers
    • H03F2203/45522—Indexing scheme relating to differential amplifiers the FBC comprising one or more potentiometers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03G—CONTROL OF AMPLIFICATION
    • H03G1/00—Details of arrangements for controlling amplification
    • H03G1/0005—Circuits characterised by the type of controlling devices operated by a controlling current or voltage signal
    • H03G1/0088—Circuits characterised by the type of controlling devices operated by a controlling current or voltage signal using discontinuously variable devices, e.g. switch-operated
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/24—Frequency- independent attenuators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10181—Fuse
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Fuses (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
DE8484201675T 1983-11-28 1984-11-20 Programmierbarer dickschichtschaltkreis und verfahren zu dessen herstellung. Expired - Lifetime DE3484731D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/555,847 US4626818A (en) 1983-11-28 1983-11-28 Device for programmable thick film networks

Publications (1)

Publication Number Publication Date
DE3484731D1 true DE3484731D1 (de) 1991-07-25

Family

ID=24218845

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484201675T Expired - Lifetime DE3484731D1 (de) 1983-11-28 1984-11-20 Programmierbarer dickschichtschaltkreis und verfahren zu dessen herstellung.

Country Status (4)

Country Link
US (1) US4626818A (de)
EP (1) EP0143493B1 (de)
JP (1) JPS60157247A (de)
DE (1) DE3484731D1 (de)

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US5182538A (en) * 1985-11-07 1993-01-26 Limitor Ag Bimetal thermoswitch
DE3539425A1 (de) * 1985-11-07 1987-05-14 Limitor Ag Thermobimetallschalter
US4771260A (en) * 1987-03-24 1988-09-13 Cooper Industries, Inc. Wire bonded microfuse and method of making
US4763228A (en) * 1987-11-20 1988-08-09 Union Carbide Corporation Fuse assembly for solid electrolytic capacitor
US5204799A (en) * 1990-03-22 1993-04-20 Gpt Limited Protective arrangement for telecommunications line interface circuit
US5097246A (en) * 1990-04-16 1992-03-17 Cooper Industries, Inc. Low amperage microfuse
GB2255455A (en) * 1991-04-22 1992-11-04 Electronic Components Ltd Fuse
IT1249299B (it) * 1991-04-30 1995-02-22 Sgs Thomson Microelectronics Circuito integrato con componenti passivi trimmabili
US5097247A (en) * 1991-06-03 1992-03-17 North American Philips Corporation Heat actuated fuse apparatus with solder link
DE4222278C1 (de) * 1992-07-07 1994-03-31 Roederstein Kondensatoren Verfahren zur Herstellung elektrischer Dickschichtsicherungen
US5479147A (en) 1993-11-04 1995-12-26 Mepcopal Company High voltage thick film fuse assembly
US5552757A (en) * 1994-05-27 1996-09-03 Littelfuse, Inc. Surface-mounted fuse device
US5790008A (en) * 1994-05-27 1998-08-04 Littlefuse, Inc. Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces
US5974661A (en) * 1994-05-27 1999-11-02 Littelfuse, Inc. Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components
US6191928B1 (en) 1994-05-27 2001-02-20 Littelfuse, Inc. Surface-mountable device for protection against electrostatic damage to electronic components
US5929741A (en) * 1994-11-30 1999-07-27 Hitachi Chemical Company, Ltd. Current protector
US5914648A (en) * 1995-03-07 1999-06-22 Caddock Electronics, Inc. Fault current fusing resistor and method
JPH0992110A (ja) * 1995-09-26 1997-04-04 Denso Corp 温度ヒューズ付抵抗器
US5907272A (en) * 1996-01-22 1999-05-25 Littelfuse, Inc. Surface mountable electrical device comprising a PTC element and a fusible link
US5652562A (en) * 1996-05-21 1997-07-29 Spectrol Electronics Corporation Thermally fused resistor having a portion of a solder loop thermally connected to an electrically insulated portion of an outer surface of the resistor
US5699032A (en) * 1996-06-07 1997-12-16 Littelfuse, Inc. Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material
US5977860A (en) * 1996-06-07 1999-11-02 Littelfuse, Inc. Surface-mount fuse and the manufacture thereof
DE19704097A1 (de) * 1997-02-04 1998-08-06 Wickmann Werke Gmbh Elektrisches Sicherungselement
US6373371B1 (en) * 1997-08-29 2002-04-16 Microelectronic Modules Corp. Preformed thermal fuse
US5982268A (en) * 1998-03-31 1999-11-09 Uchihashi Estec Co., Ltd Thin type fuses
JP4396787B2 (ja) * 1998-06-11 2010-01-13 内橋エステック株式会社 薄型温度ヒュ−ズ及び薄型温度ヒュ−ズの製造方法
US6034589A (en) * 1998-12-17 2000-03-07 Aem, Inc. Multi-layer and multi-element monolithic surface mount fuse and method of making the same
US6456186B1 (en) * 1999-10-27 2002-09-24 Motorola, Inc. Multi-terminal fuse device
US6791157B1 (en) * 2000-01-18 2004-09-14 Advanced Micro Devices, Inc. Integrated circuit package incorporating programmable elements
DE10005836B4 (de) * 2000-02-10 2006-10-12 Vossloh-Schwabe Elektronik Gmbh Leiterplattensicherung mit erhöhter Sicherheit
WO2001069988A1 (fr) * 2000-03-14 2001-09-20 Rohm Co., Ltd. Carte a circuits imprimes comprenant un fusible
EP1396003A1 (de) * 2001-06-11 2004-03-10 Wickmann-Werke GmbH Sicherungsbauelement
US7035072B2 (en) * 2001-07-10 2006-04-25 Littlefuse, Inc. Electrostatic discharge apparatus for network devices
US7034652B2 (en) * 2001-07-10 2006-04-25 Littlefuse, Inc. Electrostatic discharge multifunction resistor
US6878004B2 (en) * 2002-03-04 2005-04-12 Littelfuse, Inc. Multi-element fuse array
CN100350606C (zh) 2002-04-08 2007-11-21 力特保险丝有限公司 使用压变材料的装置
US7132922B2 (en) 2002-04-08 2006-11-07 Littelfuse, Inc. Direct application voltage variable material, components thereof and devices employing same
US7183891B2 (en) 2002-04-08 2007-02-27 Littelfuse, Inc. Direct application voltage variable material, devices employing same and methods of manufacturing such devices
US6960978B2 (en) * 2003-07-16 2005-11-01 Hewlett-Packard Development Company, L.P. Fuse structure
DE112004002301T5 (de) * 2003-11-26 2006-09-28 Littelfuse, Inc., Des Plaines Elektrische Schutzeinrichtung für ein Fahrzeug und System, das diese einsetzt
DE102004033251B3 (de) * 2004-07-08 2006-03-09 Vishay Bccomponents Beyschlag Gmbh Schmelzsicherung für einem Chip
US7477130B2 (en) * 2005-01-28 2009-01-13 Littelfuse, Inc. Dual fuse link thin film fuse
JP2009503768A (ja) * 2005-07-22 2009-01-29 リッテルフューズ，インコーポレイティド 一体型溶断導体を備えた電気デバイス
US7983024B2 (en) 2007-04-24 2011-07-19 Littelfuse, Inc. Fuse card system for automotive circuit protection
US20090009281A1 (en) * 2007-07-06 2009-01-08 Cyntec Company Fuse element and manufacturing method thereof
JP5287154B2 (ja) * 2007-11-08 2013-09-11 パナソニック株式会社 回路保護素子およびその製造方法
US8525633B2 (en) * 2008-04-21 2013-09-03 Littelfuse, Inc. Fusible substrate
WO2010048782A1 (zh) * 2008-10-28 2010-05-06 南京萨特科技发展有限公司 片式保险丝及其制备方法
US9129769B2 (en) * 2009-09-04 2015-09-08 Cyntec Co., Ltd. Protective device
JP5571466B2 (ja) * 2010-06-10 2014-08-13 イビデン株式会社 プリント配線板、電子デバイス、及びプリント配線板の製造方法
PL2408277T3 (pl) * 2010-07-16 2016-08-31 Schurter Ag Element bezpiecznikowy
CN104137217B (zh) * 2012-02-20 2016-10-19 松尾电机株式会社 芯片型保险丝
DE102019114228A1 (de) * 2019-05-28 2020-12-03 Ebm-Papst Mulfingen Gmbh & Co. Kg Analogspannungsprogrammierung

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BE631489A (de) * 1962-04-27
GB1001908A (en) * 1962-08-31 1965-08-18 Texas Instruments Inc Semiconductor devices
US3401452A (en) * 1966-04-28 1968-09-17 Electra Midland Corp Method of making a precision electric fuse
GB1184056A (en) * 1966-05-20 1970-03-11 Johnson Matthey Co Ltd Improved Fuse
US3564354A (en) * 1968-12-11 1971-02-16 Signetics Corp Semiconductor structure with fusible link and method
US4445274A (en) * 1977-12-23 1984-05-01 Ngk Insulators, Ltd. Method of manufacturing a ceramic structural body
US4201970A (en) * 1978-08-07 1980-05-06 Rca Corporation Method and apparatus for trimming resistors

Also Published As

Publication number Publication date
EP0143493A2 (de) 1985-06-05
EP0143493B1 (de) 1991-06-19
US4626818A (en) 1986-12-02
JPH0443423B2 (de) 1992-07-16
JPS60157247A (ja) 1985-08-17
EP0143493A3 (en) 1987-03-04

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: NORTH AMERICAN PHILIPS CORP., NEW YORK, N.Y., US

8328 Change in the person/name/address of the agent

Free format text: KUPFERMANN, F., DIPL.-ING., PAT.-ANW., 2000 HAMBURG

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PHILIPS ELECTRONICS NORTH AMERICA CORP., NEW YORK,

8328 Change in the person/name/address of the agent

Free format text: PEUCKERT, H., DIPL.-ING., PAT.-ASS., 20097 HAMBURG

8339 Ceased/non-payment of the annual fee