DE3469642D1 - Apparatus and installation for the wet processing of planar substrates - Google Patents

Apparatus and installation for the wet processing of planar substrates

Info

Publication number
DE3469642D1
DE3469642D1 DE8484401133T DE3469642T DE3469642D1 DE 3469642 D1 DE3469642 D1 DE 3469642D1 DE 8484401133 T DE8484401133 T DE 8484401133T DE 3469642 T DE3469642 T DE 3469642T DE 3469642 D1 DE3469642 D1 DE 3469642D1
Authority
DE
Germany
Prior art keywords
installation
wet processing
planar substrates
substrates
planar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484401133T
Other languages
English (en)
Inventor
Yuji Ohkuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3469642D1 publication Critical patent/DE3469642D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE8484401133T 1983-06-29 1984-06-05 Apparatus and installation for the wet processing of planar substrates Expired DE3469642D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58117364A JPS609129A (ja) 1983-06-29 1983-06-29 ウエツト処理装置

Publications (1)

Publication Number Publication Date
DE3469642D1 true DE3469642D1 (en) 1988-04-07

Family

ID=14709834

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484401133T Expired DE3469642D1 (en) 1983-06-29 1984-06-05 Apparatus and installation for the wet processing of planar substrates

Country Status (5)

Country Link
US (1) US4557785A (de)
EP (1) EP0130866B1 (de)
JP (1) JPS609129A (de)
KR (1) KR890002137B1 (de)
DE (1) DE3469642D1 (de)

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JPH084105B2 (ja) * 1987-06-19 1996-01-17 株式会社エンヤシステム ウェハ接着方法
US5025280A (en) * 1987-12-17 1991-06-18 Texas Instruments Incorporated Immersion development and rinse machine and process
DE3811068C2 (de) * 1988-03-31 1995-07-20 Telefunken Microelectron Vorrichtung zum einseitigen Bearbeiten von flächenhaft ausgedehnten Körpern, insbesondere von Halbleiterscheiben
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GB8928773D0 (en) * 1989-12-20 1990-02-28 Emi Plc Thorn Fountain etch system
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JPH0770504B2 (ja) * 1990-12-26 1995-07-31 信越半導体株式会社 ウエーハのハンドリング方法及び装置
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US5127984A (en) * 1991-05-02 1992-07-07 Avantek, Inc. Rapid wafer thinning process
JP3334139B2 (ja) * 1991-07-01 2002-10-15 ソニー株式会社 研磨装置
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US5294259A (en) * 1992-05-18 1994-03-15 International Business Machines Corporation Fluid treatment device
US5289639A (en) * 1992-07-10 1994-03-01 International Business Machines Corp. Fluid treatment apparatus and method
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US5442828A (en) * 1992-11-30 1995-08-22 Ontrak Systems, Inc. Double-sided wafer scrubber with a wet submersing silicon wafer indexer
JP3402644B2 (ja) * 1993-01-29 2003-05-06 キヤノン株式会社 半導体装置の製造方法
US5650039A (en) * 1994-03-02 1997-07-22 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
US5840199A (en) * 1994-06-01 1998-11-24 Litton Systems, Inc. Method for purging a multi-layer sacrificial etched silicon substrate
TW294821B (de) * 1994-09-09 1997-01-01 Tokyo Electron Co Ltd
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
US5688359A (en) * 1995-07-20 1997-11-18 Micron Technology, Inc. Muffle etch injector assembly
US5614264A (en) * 1995-08-11 1997-03-25 Atotech Usa, Inc. Fluid delivery apparatus and method
US5904773A (en) * 1995-08-11 1999-05-18 Atotech Usa, Inc. Fluid delivery apparatus
US5792709A (en) 1995-12-19 1998-08-11 Micron Technology, Inc. High-speed planarizing apparatus and method for chemical mechanical planarization of semiconductor wafers
US5952050A (en) 1996-02-27 1999-09-14 Micron Technology, Inc. Chemical dispensing system for semiconductor wafer processing
KR100232998B1 (ko) * 1996-06-05 1999-12-01 윤종용 식각량 조절수단을 갖는 케미컬 배스 유니트
US6413436B1 (en) * 1999-01-27 2002-07-02 Semitool, Inc. Selective treatment of the surface of a microelectronic workpiece
JPH1133506A (ja) * 1997-07-24 1999-02-09 Tadahiro Omi 流体処理装置及び洗浄処理システム
US5779816A (en) * 1997-01-30 1998-07-14 Trinh; Tieu T. Nozzle and system for use in wafer cleaning procedures
US6027602A (en) * 1997-08-29 2000-02-22 Techpoint Pacific Singapore Pte. Ltd. Wet processing apparatus
DE19806406C1 (de) * 1998-02-17 1999-07-29 Sez Semiconduct Equip Zubehoer Verfahren zum Rauhätzen einer Halbleiter-Oberfläche
US20050217707A1 (en) * 1998-03-13 2005-10-06 Aegerter Brian K Selective processing of microelectronic workpiece surfaces
US6423642B1 (en) * 1998-03-13 2002-07-23 Semitool, Inc. Reactor for processing a semiconductor wafer
TW452828B (en) * 1998-03-13 2001-09-01 Semitool Inc Micro-environment reactor for processing a microelectronic workpiece
EP1079705A4 (de) * 1998-05-28 2005-02-09 Hi Per Wash Ltd Dichtung
US6864186B1 (en) 1998-07-28 2005-03-08 Micron Technology, Inc. Method of reducing surface contamination in semiconductor wet-processing vessels
TW511172B (en) * 1999-07-19 2002-11-21 Winbond Electronics Corp Machine for etching wafer edge and its etching method
DE19934300C2 (de) * 1999-07-21 2002-02-07 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten
DE10007248A1 (de) * 2000-02-17 2001-08-23 Contrade Mikrostruktur Technol Verfahren und Vorrichtung für die naßchemische Reinigung und Ätzung von scheibenförmigen Einzelsubstraten
US6225235B1 (en) * 2000-02-18 2001-05-01 Horst Kunze-Concewitz Method and device for cleaning and etching individual wafers using wet chemistry
US6539960B1 (en) * 2000-05-01 2003-04-01 United Microelectronics Corp. Cleaning system for cleaning ink in a semiconductor wafer
JP2002055422A (ja) * 2000-05-29 2002-02-20 Fuji Photo Film Co Ltd 感光材料の液中搬送構造
US6344106B1 (en) 2000-06-12 2002-02-05 International Business Machines Corporation Apparatus, and corresponding method, for chemically etching substrates
US6589361B2 (en) 2000-06-16 2003-07-08 Applied Materials Inc. Configurable single substrate wet-dry integrated cluster cleaner
AU2001282879A1 (en) 2000-07-08 2002-01-21 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US20020139684A1 (en) * 2001-04-02 2002-10-03 Mitsubishi Denki Kabushiki Kaisha Plating system, plating method, method of manufacturing semiconductor device using the same, and method of manufacturing printed board using the same
US6899111B2 (en) * 2001-06-15 2005-05-31 Applied Materials, Inc. Configurable single substrate wet-dry integrated cluster cleaner
US7138014B2 (en) * 2002-01-28 2006-11-21 Applied Materials, Inc. Electroless deposition apparatus
US6743722B2 (en) 2002-01-29 2004-06-01 Strasbaugh Method of spin etching wafers with an alkali solution
US20040175504A1 (en) * 2003-03-06 2004-09-09 Zyomyx, Inc. Substrate processing apparatus and method for the controlled formation of layers including self-assembled monolayers
US20050020077A1 (en) * 2003-04-18 2005-01-27 Applied Materials, Inc. Formation of protection layer by dripping DI on wafer with high rotation to prevent stain formation from H2O2/H2SO4 chemical splash
US20070232072A1 (en) * 2003-04-18 2007-10-04 Bo Zheng Formation of protection layer on wafer to prevent stain formation
US7520939B2 (en) * 2003-04-18 2009-04-21 Applied Materials, Inc. Integrated bevel clean chamber
US20040222101A1 (en) * 2003-04-18 2004-11-11 Applied Materials, Inc. Contact ring spin during idle time and deplate for defect reduction
US20050173253A1 (en) * 2004-02-05 2005-08-11 Applied Materials, Inc. Method and apparatus for infilm defect reduction for electrochemical copper deposition
WO2007084952A2 (en) * 2006-01-18 2007-07-26 Akrion Technologies, Inc. Systems and methods for drying a rotating substrate
GB2459055B (en) * 2007-01-11 2012-05-23 Peter Philip Andrew Lymn Liquid treatment apparatus
CN103776477A (zh) * 2014-01-24 2014-05-07 深圳市华星光电技术有限公司 一种摇摆式传感器组件
US10269557B2 (en) * 2015-10-20 2019-04-23 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus of processing semiconductor substrate

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CH390397A (de) * 1958-06-18 1965-04-15 Siemens Ag Verfahren zur Oberflächenbehandlung von Halbleiteranordnungen mit mehreren Elektroden und mindestens einem p-n-Übergang
US3630804A (en) * 1968-08-19 1971-12-28 Chemcut Corp Etching apparatus
US3620813A (en) * 1968-11-12 1971-11-16 Udylite Corp Method of treating workpieces in a treating fluid
BE764970A (fr) * 1971-03-30 1971-08-16 Duquesne Victor Dispositif pour le montage et le demontage des pneus equipant les rouesdes vehicules automobiles.
JPS55158634A (en) * 1979-05-30 1980-12-10 Fujitsu Ltd Treating device for photo-mask, etc.
DE3027934A1 (de) * 1980-07-23 1982-02-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zur einseitigen aetzung von halbleiterscheiben

Also Published As

Publication number Publication date
EP0130866A1 (de) 1985-01-09
JPH0145219B2 (de) 1989-10-03
US4557785A (en) 1985-12-10
KR890002137B1 (ko) 1989-06-20
KR850000782A (ko) 1985-03-09
EP0130866B1 (de) 1988-03-02
JPS609129A (ja) 1985-01-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee