DE3442062C2 - - Google Patents
Info
- Publication number
- DE3442062C2 DE3442062C2 DE19843442062 DE3442062A DE3442062C2 DE 3442062 C2 DE3442062 C2 DE 3442062C2 DE 19843442062 DE19843442062 DE 19843442062 DE 3442062 A DE3442062 A DE 3442062A DE 3442062 C2 DE3442062 C2 DE 3442062C2
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- holder
- plastic plate
- clamping frame
- weakness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 22
- 239000004033 plastic Substances 0.000 claims description 18
- 229920003023 plastic Polymers 0.000 claims description 18
- 239000002313 adhesive film Substances 0.000 claims description 16
- 238000005520 cutting process Methods 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 10
- 238000013459 approach Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/222—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by pressing, e.g. presses
- B28D1/223—Hand-held or hand-operated tools for shearing or cleaving
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19843442062 DE3442062A1 (de) | 1984-11-17 | 1984-11-17 | Verfahren und vorrichtung zum zerteilen von bestueckten keramischen schaltungsplatten |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19843442062 DE3442062A1 (de) | 1984-11-17 | 1984-11-17 | Verfahren und vorrichtung zum zerteilen von bestueckten keramischen schaltungsplatten |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3442062A1 DE3442062A1 (de) | 1986-05-22 |
| DE3442062C2 true DE3442062C2 (enrdf_load_stackoverflow) | 1988-03-31 |
Family
ID=6250540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19843442062 Granted DE3442062A1 (de) | 1984-11-17 | 1984-11-17 | Verfahren und vorrichtung zum zerteilen von bestueckten keramischen schaltungsplatten |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE3442062A1 (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19930639B4 (de) * | 1999-07-02 | 2005-01-20 | Robert Bosch Gmbh | Vorrichtung zum Zertrennen eines plattenförmigen Gegenstands |
| DE29919961U1 (de) | 1999-11-15 | 2000-03-23 | Baumann GmbH, 92224 Amberg | Vorrichtung zum Vereinzeln von elektrischen oder elektronischen Substraten aus eine Vielzahl solcher Substrate aufweisenden Mehrfachsubstraten |
| DE102005023238B3 (de) * | 2005-05-20 | 2006-06-22 | Sieghard Schiller Gmbh & Co. Kg | Vorrichtung zum Brechen eines dünnen, plattenförmigen Gegenstands |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1652522C3 (de) * | 1967-11-18 | 1981-02-12 | Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm | Verfahren zum Zerlegen einer geritzten Halbleiterscheibe |
| US3610871A (en) * | 1970-02-19 | 1971-10-05 | Western Electric Co | Initiation of a controlled fracture |
| DE2816445C2 (de) * | 1978-04-15 | 1982-03-04 | Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt | Einrichtung zum Brechen von Substraten |
-
1984
- 1984-11-17 DE DE19843442062 patent/DE3442062A1/de active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE3442062A1 (de) | 1986-05-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee | ||
| 8370 | Indication of lapse of patent is to be deleted | ||
| 8320 | Willingness to grant licenses declared (paragraph 23) | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: ALCATEL SEL AKTIENGESELLSCHAFT, 7000 STUTTGART, DE |
|
| 8339 | Ceased/non-payment of the annual fee |