DE3442062A1 - Verfahren und vorrichtung zum zerteilen von bestueckten keramischen schaltungsplatten - Google Patents

Verfahren und vorrichtung zum zerteilen von bestueckten keramischen schaltungsplatten

Info

Publication number
DE3442062A1
DE3442062A1 DE19843442062 DE3442062A DE3442062A1 DE 3442062 A1 DE3442062 A1 DE 3442062A1 DE 19843442062 DE19843442062 DE 19843442062 DE 3442062 A DE3442062 A DE 3442062A DE 3442062 A1 DE3442062 A1 DE 3442062A1
Authority
DE
Germany
Prior art keywords
circuit board
holder
adhesive film
plastic plate
clamping frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19843442062
Other languages
German (de)
English (en)
Other versions
DE3442062C2 (enrdf_load_stackoverflow
Inventor
Hans Nebel
Horst 8500 Nürnberg Sadowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent Deutschland AG
Original Assignee
Standard Elektrik Lorenz AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Elektrik Lorenz AG filed Critical Standard Elektrik Lorenz AG
Priority to DE19843442062 priority Critical patent/DE3442062A1/de
Publication of DE3442062A1 publication Critical patent/DE3442062A1/de
Application granted granted Critical
Publication of DE3442062C2 publication Critical patent/DE3442062C2/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/222—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by pressing, e.g. presses
    • B28D1/223—Hand-held or hand-operated tools for shearing or cleaving
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
DE19843442062 1984-11-17 1984-11-17 Verfahren und vorrichtung zum zerteilen von bestueckten keramischen schaltungsplatten Granted DE3442062A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19843442062 DE3442062A1 (de) 1984-11-17 1984-11-17 Verfahren und vorrichtung zum zerteilen von bestueckten keramischen schaltungsplatten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843442062 DE3442062A1 (de) 1984-11-17 1984-11-17 Verfahren und vorrichtung zum zerteilen von bestueckten keramischen schaltungsplatten

Publications (2)

Publication Number Publication Date
DE3442062A1 true DE3442062A1 (de) 1986-05-22
DE3442062C2 DE3442062C2 (enrdf_load_stackoverflow) 1988-03-31

Family

ID=6250540

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19843442062 Granted DE3442062A1 (de) 1984-11-17 1984-11-17 Verfahren und vorrichtung zum zerteilen von bestueckten keramischen schaltungsplatten

Country Status (1)

Country Link
DE (1) DE3442062A1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29919961U1 (de) 1999-11-15 2000-03-23 Baumann GmbH, 92224 Amberg Vorrichtung zum Vereinzeln von elektrischen oder elektronischen Substraten aus eine Vielzahl solcher Substrate aufweisenden Mehrfachsubstraten
DE19930639A1 (de) * 1999-07-02 2001-01-11 Bosch Gmbh Robert Verfahren und Vorrichtung zum Zertrennen eines plattenförmigen Gegenstands
DE102005023238B3 (de) * 2005-05-20 2006-06-22 Sieghard Schiller Gmbh & Co. Kg Vorrichtung zum Brechen eines dünnen, plattenförmigen Gegenstands

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2107740B2 (de) * 1970-02-19 1973-08-09 Western Electric Co. Inc., New York, N.Y. (V.StA.) Verfahren und vorrichtung zur teilung eines substrats
DE2816445A1 (de) * 1978-04-15 1979-10-25 Telefonbau & Normalzeit Gmbh Einrichtung zum brechen von substraten
DE1652522B2 (de) * 1967-11-18 1980-06-12 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zum Zerlegen einer geritzten Halbleiterscheibe

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1652522B2 (de) * 1967-11-18 1980-06-12 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zum Zerlegen einer geritzten Halbleiterscheibe
DE2107740B2 (de) * 1970-02-19 1973-08-09 Western Electric Co. Inc., New York, N.Y. (V.StA.) Verfahren und vorrichtung zur teilung eines substrats
DE2816445A1 (de) * 1978-04-15 1979-10-25 Telefonbau & Normalzeit Gmbh Einrichtung zum brechen von substraten

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19930639A1 (de) * 1999-07-02 2001-01-11 Bosch Gmbh Robert Verfahren und Vorrichtung zum Zertrennen eines plattenförmigen Gegenstands
DE19930639B4 (de) * 1999-07-02 2005-01-20 Robert Bosch Gmbh Vorrichtung zum Zertrennen eines plattenförmigen Gegenstands
DE29919961U1 (de) 1999-11-15 2000-03-23 Baumann GmbH, 92224 Amberg Vorrichtung zum Vereinzeln von elektrischen oder elektronischen Substraten aus eine Vielzahl solcher Substrate aufweisenden Mehrfachsubstraten
DE102005023238B3 (de) * 2005-05-20 2006-06-22 Sieghard Schiller Gmbh & Co. Kg Vorrichtung zum Brechen eines dünnen, plattenförmigen Gegenstands

Also Published As

Publication number Publication date
DE3442062C2 (enrdf_load_stackoverflow) 1988-03-31

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee
8370 Indication of lapse of patent is to be deleted
8320 Willingness to grant licences declared (paragraph 23)
8327 Change in the person/name/address of the patent owner

Owner name: ALCATEL SEL AKTIENGESELLSCHAFT, 7000 STUTTGART, DE

8339 Ceased/non-payment of the annual fee