DE3440668A1 - Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen - Google Patents

Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen

Info

Publication number
DE3440668A1
DE3440668A1 DE19843440668 DE3440668A DE3440668A1 DE 3440668 A1 DE3440668 A1 DE 3440668A1 DE 19843440668 DE19843440668 DE 19843440668 DE 3440668 A DE3440668 A DE 3440668A DE 3440668 A1 DE3440668 A1 DE 3440668A1
Authority
DE
Germany
Prior art keywords
lead
tin
coating
copper
ing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19843440668
Other languages
German (de)
English (en)
Other versions
DE3440668C2 (enExample
Inventor
Manfred Dr. 7335 Salach Jordan
Gernot Dr. 7340 Geislingen Strube
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dr Ing Max Schloetter GmbH and Co KG
Original Assignee
Dr Ing Max Schloetter GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dr Ing Max Schloetter GmbH and Co KG filed Critical Dr Ing Max Schloetter GmbH and Co KG
Priority to DE19843440668 priority Critical patent/DE3440668A1/de
Priority to DE8585112843T priority patent/DE3563075D1/de
Priority to EP85112843A priority patent/EP0180804B1/de
Priority to AT85112843T priority patent/ATE34783T1/de
Priority to US06/794,659 priority patent/US4650548A/en
Priority to JP60249921A priority patent/JPH0697714B2/ja
Publication of DE3440668A1 publication Critical patent/DE3440668A1/de
Application granted granted Critical
Publication of DE3440668C2 publication Critical patent/DE3440668C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE19843440668 1984-11-07 1984-11-07 Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen Granted DE3440668A1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE19843440668 DE3440668A1 (de) 1984-11-07 1984-11-07 Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen
DE8585112843T DE3563075D1 (en) 1984-11-07 1985-10-10 Process for maintaining the solderability of lead-tin coatings, and plated holes printed circuit board
EP85112843A EP0180804B1 (de) 1984-11-07 1985-10-10 Verfahren zur Erhaltung der Lötbarkeit von Bleizinn-Überzügen; sowie durchkontaktierte Leiterplatte
AT85112843T ATE34783T1 (de) 1984-11-07 1985-10-10 Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen; sowie durchkontaktierte leiterplatte.
US06/794,659 US4650548A (en) 1984-11-07 1985-11-04 Process for preserving the solderability of through hole plated printed circuit boards
JP60249921A JPH0697714B2 (ja) 1984-11-07 1985-11-07 めつきされたスルーホールプリント回路基板及びその生産方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843440668 DE3440668A1 (de) 1984-11-07 1984-11-07 Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen

Publications (2)

Publication Number Publication Date
DE3440668A1 true DE3440668A1 (de) 1986-05-07
DE3440668C2 DE3440668C2 (enExample) 1989-05-18

Family

ID=6249716

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19843440668 Granted DE3440668A1 (de) 1984-11-07 1984-11-07 Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen
DE8585112843T Expired DE3563075D1 (en) 1984-11-07 1985-10-10 Process for maintaining the solderability of lead-tin coatings, and plated holes printed circuit board

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE8585112843T Expired DE3563075D1 (en) 1984-11-07 1985-10-10 Process for maintaining the solderability of lead-tin coatings, and plated holes printed circuit board

Country Status (5)

Country Link
US (1) US4650548A (enExample)
EP (1) EP0180804B1 (enExample)
JP (1) JPH0697714B2 (enExample)
AT (1) ATE34783T1 (enExample)
DE (2) DE3440668A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
GB9626754D0 (en) * 1996-12-23 1997-02-12 Northern Telecom Ltd A pseudo duplex scheme
TW396462B (en) * 1998-12-17 2000-07-01 Eriston Technologies Pte Ltd Bumpless flip chip assembly with solder via
US6844253B2 (en) * 1999-02-19 2005-01-18 Micron Technology, Inc. Selective deposition of solder ball contacts

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1920585A1 (de) * 1968-04-23 1969-11-13 Engelhard Ind Ltd Verfahren zum Herstellen eines mit Loetmittel ueberzogenen,elektrisch leitenden Elementes

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1073197B (enExample) * 1955-06-28 1960-01-14
US3785939A (en) * 1970-10-22 1974-01-15 Conversion Chem Corp Tin/lead plating bath and method
US3673680A (en) * 1970-12-14 1972-07-04 California Computer Products Method of circuit board with solder coated pattern
US3926749A (en) * 1971-12-20 1975-12-16 M & T Chemicals Inc Tin-lead alloy plating
US3859182A (en) * 1973-01-04 1975-01-07 Allied Chem Coating printed circuit boards with tin or tin-lead alloy and tin-lead fluoborate plating baths
JPS53374A (en) * 1976-06-25 1978-01-05 Ito Kazuichi Stepless speed change gear
US4104111A (en) * 1977-08-03 1978-08-01 Mack Robert L Process for manufacturing printed circuit boards
GB1567235A (en) * 1978-05-15 1980-05-14 Pmd Chemicals Ltd Electrodeposition of tin or tin/lead alloys
DE2852753C3 (de) * 1978-12-06 1985-06-20 Württembergische Metallwarenfabrik, 7340 Geislingen Verfahren zum Befestigen von Bauelementen mit flächigen Anschlußkontakten auf einer Leiterplatte und Schablone zur Durchführung des Verfahrens
JPS56118209A (en) * 1980-02-20 1981-09-17 Hitachi Ltd Conductor
AU1517383A (en) * 1982-03-15 1983-10-24 Gsp Metals & Chemicals Corp. Chelating metals
US4525246A (en) * 1982-06-24 1985-06-25 Hadco Corporation Making solderable printed circuit boards
US4440608A (en) * 1982-08-16 1984-04-03 Mcgean-Rohco, Inc. Process and bath for the electrodeposition of tin-lead alloys
AT378008B (de) * 1982-09-07 1985-06-10 Neumayer Karl Gmbh Verfahren zur herstellung von mit einer zinnlegierung ueberzogenen draehten
JPS5967387A (ja) * 1982-10-08 1984-04-17 Hiyougoken すず、鉛及びすず―鉛合金メッキ浴
GB2134136B (en) * 1983-01-19 1986-03-26 Shell Int Research An electronic conduit and a method of manufacturing it

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1920585A1 (de) * 1968-04-23 1969-11-13 Engelhard Ind Ltd Verfahren zum Herstellen eines mit Loetmittel ueberzogenen,elektrisch leitenden Elementes

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
BOGENSCHÜTZ, A.F.: Oberflächentechnik und Galvanotechnik in der Elektronik, Eugen G. Leuze Verlag, Saulgau/Württemberg, 1971, S. 46 *
HERMANN, G.: Handbuch der Leiteplatten- Technik, Eugen G. Leuze Verlag, Saulgau/ Württemberg, 1982, S. 191 *

Also Published As

Publication number Publication date
EP0180804B1 (de) 1988-06-01
US4650548A (en) 1987-03-17
JPS61120492A (ja) 1986-06-07
DE3563075D1 (en) 1988-07-07
ATE34783T1 (de) 1988-06-15
DE3440668C2 (enExample) 1989-05-18
EP0180804A1 (de) 1986-05-14
JPH0697714B2 (ja) 1994-11-30

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee