DE3435335A1 - Verfahren zur erneuerung der goldoberflaechenschicht an steckkontakten bestueckter leiterplatten - Google Patents

Verfahren zur erneuerung der goldoberflaechenschicht an steckkontakten bestueckter leiterplatten

Info

Publication number
DE3435335A1
DE3435335A1 DE19843435335 DE3435335A DE3435335A1 DE 3435335 A1 DE3435335 A1 DE 3435335A1 DE 19843435335 DE19843435335 DE 19843435335 DE 3435335 A DE3435335 A DE 3435335A DE 3435335 A1 DE3435335 A1 DE 3435335A1
Authority
DE
Germany
Prior art keywords
plug contacts
gold surface
circuit board
surface layer
plastic film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19843435335
Other languages
German (de)
English (en)
Other versions
DE3435335C2 (enExample
Inventor
Adolf 8264 Waldkraiburg Rittersporn
Serban-Georg 8025 Ismaning Viona
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RELECTRONIC GmbH
Original Assignee
RELECTRONIC GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RELECTRONIC GmbH filed Critical RELECTRONIC GmbH
Priority to DE19843435335 priority Critical patent/DE3435335A1/de
Publication of DE3435335A1 publication Critical patent/DE3435335A1/de
Application granted granted Critical
Publication of DE3435335C2 publication Critical patent/DE3435335C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/002—Maintenance of line connectors, e.g. cleaning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
DE19843435335 1984-09-26 1984-09-26 Verfahren zur erneuerung der goldoberflaechenschicht an steckkontakten bestueckter leiterplatten Granted DE3435335A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19843435335 DE3435335A1 (de) 1984-09-26 1984-09-26 Verfahren zur erneuerung der goldoberflaechenschicht an steckkontakten bestueckter leiterplatten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843435335 DE3435335A1 (de) 1984-09-26 1984-09-26 Verfahren zur erneuerung der goldoberflaechenschicht an steckkontakten bestueckter leiterplatten

Publications (2)

Publication Number Publication Date
DE3435335A1 true DE3435335A1 (de) 1986-04-03
DE3435335C2 DE3435335C2 (enExample) 1987-09-24

Family

ID=6246417

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19843435335 Granted DE3435335A1 (de) 1984-09-26 1984-09-26 Verfahren zur erneuerung der goldoberflaechenschicht an steckkontakten bestueckter leiterplatten

Country Status (1)

Country Link
DE (1) DE3435335A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3435335A1 (de) 1984-09-26 1986-04-03 Relectronic GmbH, 8045 Ismaning Verfahren zur erneuerung der goldoberflaechenschicht an steckkontakten bestueckter leiterplatten

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4082605A (en) * 1974-11-19 1978-04-04 Peter Kepets Processing printed circuit boards
DE3235958A1 (de) * 1981-10-02 1983-05-05 Chemcut Corp., State College, Pa. Verfahren zur behandlung von streifen gedruckter schaltungen und dergleichen und vorrichtung zur durchfuerung des verfahrens
DE3435335A1 (de) 1984-09-26 1986-04-03 Relectronic GmbH, 8045 Ismaning Verfahren zur erneuerung der goldoberflaechenschicht an steckkontakten bestueckter leiterplatten

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4082605A (en) * 1974-11-19 1978-04-04 Peter Kepets Processing printed circuit boards
DE3235958A1 (de) * 1981-10-02 1983-05-05 Chemcut Corp., State College, Pa. Verfahren zur behandlung von streifen gedruckter schaltungen und dergleichen und vorrichtung zur durchfuerung des verfahrens
DE3435335A1 (de) 1984-09-26 1986-04-03 Relectronic GmbH, 8045 Ismaning Verfahren zur erneuerung der goldoberflaechenschicht an steckkontakten bestueckter leiterplatten

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3435335A1 (de) 1984-09-26 1986-04-03 Relectronic GmbH, 8045 Ismaning Verfahren zur erneuerung der goldoberflaechenschicht an steckkontakten bestueckter leiterplatten

Also Published As

Publication number Publication date
DE3435335C2 (enExample) 1987-09-24

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee